ZHCSE74C September   2015  – May 2025 LMK61E2

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Supply
    6. 5.6  LVPECL Output Characteristics
    7. 5.7  LVDS Output Characteristics
    8. 5.8  HCSL Output Characteristics
    9. 5.9  OE Input Characteristics
    10. 5.10 ADD Input Characteristics
    11. 5.11 Frequency Tolerance Characteristics #GUID-0535526F-DD03-4092-AF22-72C29F7682F3/SNAS6776645
    12. 5.12 Power-On/Reset Characteristics (VDD)
    13. 5.13 I2C-Compatible Interface Characteristics (SDA, SCL)
    14. 5.14 PSRR Characteristics
    15. 5.15 Other Characteristics
    16. 5.16 PLL Clock Output Jitter Characteristics #GUID-A72B6B2B-0279-4F5A-AC8C-45785B0FF568/SNAS6776369 #GUID-A72B6B2B-0279-4F5A-AC8C-45785B0FF568/SNAS6773735
    17. 5.17 Typical 156.25MHz Output Phase Noise Characteristics #GUID-00AE447B-502F-42A7-B85A-8E83BC487AD9/SNAS6777861 #GUID-00AE447B-502F-42A7-B85A-8E83BC487AD9/SNAS6776335
    18. 5.18 Typical 161.1328125 MHz Output Phase Noise Characteristics
    19. 5.19 Additional Reliability and Qualification
    20. 5.20 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Device Output Configurations
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Block-Level Description
      2. 7.3.2  Device Configuration Control
      3. 7.3.3  Register File Reference Convention
      4. 7.3.4  Configuring the PLL
      5. 7.3.5  Integrated Oscillator
      6. 7.3.6  Reference Doubler
      7. 7.3.7  Phase Frequency Detector
      8. 7.3.8  Feedback Divider (N)
      9. 7.3.9  Fractional Circuitry
      10. 7.3.10 Charge Pump
      11. 7.3.11 Loop Filter
      12. 7.3.12 VCO Calibration
      13. 7.3.13 High-Speed Output Divider
      14. 7.3.14 High-Speed Clock Output
      15. 7.3.15 Device Status
        1. 7.3.15.1 Loss of Lock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Interface and Control
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
      2. 7.5.2 Block Register Write
      3. 7.5.3 Block Register Read
      4. 7.5.4 Write SRAM
      5. 7.5.5 Write EEPROM
      6. 7.5.6 Read SRAM
      7. 7.5.7 Read EEPROM
    6. 7.6 EEPROM Map
  9. Register Map
    1. 8.1 Register Descriptions
      1. 8.1.1  VNDRID_BY1 Register; R0
      2. 8.1.2  VNDRID_BY0 Register; R1
      3. 8.1.3  PRODID Register; R2
      4. 8.1.4  REVID Register; R3
      5. 8.1.5  TARGETADR Register; R8
      6. 8.1.6  EEREV Register; R9
      7. 8.1.7  DEV_CTL Register; R10
      8. 8.1.8  XO_CAPCTRL_BY1 Register; R16
      9. 8.1.9  XO_CAPCTRL_BY0 Register; R17
      10. 8.1.10 DIFFCTL Register; R21
      11. 8.1.11 OUTDIV_BY1 Register; R22
      12. 8.1.12 OUTDIV_BY0 Register; R23
      13. 8.1.13 PLL_NDIV_BY1 Register; R25
      14. 8.1.14 PLL_NDIV_BY0 Register; R26
      15. 8.1.15 PLL_FRACNUM_BY2 Register; R27
      16. 8.1.16 PLL_FRACNUM_BY1 Register; R28
      17. 8.1.17 PLL_FRACNUM_BY0 Register; R29
      18. 8.1.18 PLL_FRACDEN_BY2 Register; R30
      19. 8.1.19 PLL_FRACDEN_BY1 Register; R31
      20. 8.1.20 PLL_FRACDEN_BY0 Register; R32
      21. 8.1.21 PLL_MASHCTRL Register; R33
      22. 8.1.22 PLL_CTRL0 Register; R34
      23. 8.1.23 PLL_CTRL1 Register; R35
      24. 8.1.24 PLL_LF_R2 Register; R36
      25. 8.1.25 PLL_LF_C1 Register; R37
      26. 8.1.26 PLL_LF_R3 Register; R38
      27. 8.1.27 PLL_LF_C3 Register; R39
      28. 8.1.28 PLL_CALCTRL Register; R42
      29. 8.1.29 NVMSCRC Register; R47
      30. 8.1.30 NVMCNT Register; R48
      31. 8.1.31 NVMCTL Register; R49
      32. 8.1.32 NVMLCRC Register; R50
      33. 8.1.33 MEMADR Register; R51
      34. 8.1.34 NVMDAT Register; R52
      35. 8.1.35 RAMDAT Register; R53
      36. 8.1.36 NVMUNLK Register; R56
      37. 8.1.37 INT_LIVE Register; R66
      38. 8.1.38 SWRST Register; R72
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Jitter Considerations in Serdes Systems
      2. 9.2.2 Frequency Margining
        1. 9.2.2.1 Fine Frequency Margining
        2. 9.2.2.2 Coarse Frequency Margining
      3. 9.2.3 Design Requirements
        1. 9.2.3.1 Detailed Design Procedure
          1. 9.2.3.1.1 Custom Design With WEBENCH® Tools
          2. 9.2.3.1.2 Device Selection
          3. 9.2.3.1.3 VCO Frequency Calculation
          4. 9.2.3.1.4 Device Configuration
          5. 9.2.3.1.5 PLL Loop Filter Design
          6. 9.2.3.1.6 Spur Mitigation Techniques
            1. 9.2.3.1.6.1 Phase Detection Spur
            2. 9.2.3.1.6.2 Integer Boundary Fractional Spur
            3. 9.2.3.1.6.3 Primary Fractional Spur
            4. 9.2.3.1.6.4 Sub-Fractional Spur
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Verified Thermal Reliability
        2. 9.4.1.2 Best Practices for Signal Integrity
        3. 9.4.1.3 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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Jitter Considerations in Serdes Systems

Jitter-sensitive applications such as 10Gbps or 100Gbps Ethernet, deploy a serial link using a Serializer in the transmit section (TX) and a De-serializer in the receive section (RX). These SERDES blocks are typically embedded in an ASIC or FPGA. Estimating the clock jitter impact on the link budget requires understanding of the TX PLL bandwidth and the RX CDR bandwidth.

As can be seen in Figure 9-1, the pass band region between the TX low-pass cutoff and RX high-pass cutoff frequencies is the range over which the reference clock jitter adds without any attenuation to the jitter budget of the link. Outside of these frequencies, the SERDES link attenuates the reference clock jitter with a 20dB/dec or even steeper roll-off. Modern ASIC or FPGA designs have some flexibility on deciding the optimal RX CDR bandwidth and TX PLL bandwidth. These bandwidths are typically set based on what is achievable in the ASIC or FPGA process node, without increasing design complexity, and on any jitter tolerance or wander specification that needs to be met, as related to the RX CDR bandwidth.

The overall allowable jitter in a serial link is dictated by IEEE or other relevant standards. For example, IEEE802.3ba states that the maximum transmit jitter (peak-peak) for 10Gbps Ethernet must be no more than 0.28 × UI and this equates to a 27.1516ps, p-p for the overall allowable transmit jitter.

The jitter contributing elements are made up of the reference clock, generated potentially from a device like LMK61E2, the transmit medium, transmit driver, and so forth. Only a portion of the overall allowable transmit jitter is allocated to the reference clock, typically 20% or lower. Therefore, the allowable reference clock jitter, for a 20% clock jitter budget, is 5.43ps, p-p.

Jitter in a reference clock is made up of deterministic jitter (arising from spurious signals due to supply noise or mixing from other outputs or from the reference input) and random jitter (typically due to thermal noise and other uncorrelated noise sources). A typical clock tree in a serial link system consists of clock generators and fanout buffers. The allowable reference clock jitter of 5.43ps, p-p is needed at the output of the fanout buffer. Modern fanout buffers have low-additive random jitter (less than 100fs RMS) with no substantial contribution to the deterministic jitter. Therefore, the clock generator and fanout buffer contribute to the random jitter while the primary contributor to the deterministic jitter is the clock generator. General guidance, for modern clock generators, is to allocate 25% of allowable reference clock jitter to the deterministic jitter and 75% to the random jitter. This amounts to an allowable deterministic jitter of 1.36ps, p-p and an allowable random jitter of 4.07ps, p-p. For serial link systems that need to meet a bit error rate (BER) of 10–12, the allowable random jitter in root-mean-square is 0.29ps RMS. This is calculated by dividing the p-p jitter by 14 for a BER of 10–12. Accounting for random jitter from the fanout buffer, the random jitter needed from the clock generator is 0.27ps RMS. This is calculated by the root-mean-square subtraction from the desired jitter at the fanout buffer's output assuming 100fs RMS of additive jitter from the fanout buffer.

With careful frequency planning techniques, like spur optimization (covered in Spur Mitigation Techniques) and on-chip LDOs to suppress supply noise, the LMK61E2 is able to generate clock outputs with deterministic jitter that is below 1ps, p-p and random jitter that is below 0.2ps RMS. This gives the serial link system with additional margin on the allowable transmit jitter resulting in a BER better than 10–12.

LMK61E2 Dependence of Clock Jitter in Serial LinksFigure 9-1 Dependence of Clock Jitter in Serial Links