ZHCSH39B November   2017  – September 2019 ISOW7821

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Input, 5-V Output
    10. 7.10 Supply Current Characteristics—5-V Input, 5-V Output
    11. 7.11 Electrical Characteristics—5-V Input, 3.3-V Output
    12. 7.12 Supply Current Characteristics—5-V Input, 3.3-V Output
    13. 7.13 Electrical Characteristics—3.3-V Input, 3.3-V Output
    14. 7.14 Supply Current Characteristics—3.3-V Input, 3.3-V Output
    15. 7.15 Switching Characteristics—5-V Input, 5-V Output
    16. 7.16 Switching Characteristics—5-V Input, 3.3-V Output
    17. 7.17 Switching Characteristics—3.3-V Input, 3.3-V Output
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Current Limit, Thermal Overload Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 开发支持
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.2.1 Design Requirements

To design with this device, use the parameters listed in Table 4.

Table 4. Design Parameters

PARAMETER VALUE
Input voltage 3 V to 5.5 V
Decoupling capacitor between VCC and GND1 0.1 µF to 10 µF
Decoupling capacitor between VISO and GND2 0.1 µF to 10 µF

Because of very-high current flowing through the ISOW7821 VCC and VISO supplies, higher decoupling capacitors typically provide better noise and ripple performance. Although a 10-µF capacitor is adequate, higher decoupling capacitors (such as 47 µF) on both the VCC and VISO pins to the respective grounds are strongly recommended to achieve the best performance. Optional 100 µF decoupling capacitor can be added between VCC and GND1 pins; refer to Power Supply Recommendations for more details.