ZHCSID5E April   2018  – September 2019 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化应用电路原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Power Ratings
    6. 8.6  Insulation Specifications
    7. 8.7  Safety-Related Certifications
    8. 8.8  Safety Limiting Values
    9. 8.9  Electrical Characteristics: Driver
    10. 8.10 Electrical Characteristics: Receiver
    11. 8.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 8.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 8.13 Switching Characteristics: Driver
    14. 8.14 Switching Characteristics: Receiver
    15. 8.15 Insulation Characteristics Curves
    16. 8.16 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 10.3.2 Failsafe Receiver
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Glitch-Free Power Up and Power Down
    4. 10.4 Device Functional Modes
      1. 10.4.1 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate and Bus Length
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Bus Loading
      3. 11.2.3 Application Curves
        1. 11.2.3.1 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 PCB Material
    2. 13.2 Layout Example
  14. 14器件和文档支持
    1. 14.1 文档支持
      1. 14.1.1 相关文档
    2. 14.2 相关链接
    3. 14.3 接收文档更新通知
    4. 14.4 社区资源
    5. 14.5 商标
    6. 14.6 静电放电警告
    7. 14.7 Glossary
  15. 15机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.3.3 Thermal Shutdown

The ISO14xx devices have a thermal shutdown circuit to protect against damage when a fault condition occurs. A driver output short circuit or bus contention condition can cause the driver current to increase significantly which increases the power dissipation inside the device. An increase in the die temperature is monitored and the device is disabled when the die temperature becomes 170℃ (typical) which lets the device decrease the temperature. The device is enabled when the junction temperature becomes 165℃ (typical).

Bus short circuit for an extended duration and/or beyond voltage levels specified in recommended operating condition should be avoided. Repeated or prolonged exposure to bus shorts can result in high junction temperatures and affect device reliability.