ZHCSEX8A December   2015  – October 2016 INA300-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Selecting a Current-Sensing Resistor
        1. 7.3.1.1 Selecting a Current-Sensing Resistor: Example
      2. 7.3.2 Setting The Current-Limit Threshold
        1. 7.3.2.1 Resistor-Controlled Current Limit
        2. 7.3.2.2 Voltage Source Controlled Current Limit
      3. 7.3.3 Delay Setting
      4. 7.3.4 Alert Timing Response
      5. 7.3.5 Selectable Hysteresis
      6. 7.3.6 Alert Output
      7. 7.3.7 Noise Adjustment Factor (NAF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Mode
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
      2. 7.4.2 Disable Mode
      3. 7.4.3 Input Filtering
      4. 7.4.4 Using the INA300-Q1 With Common-Mode Transients Above 36 V
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Operation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Operation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Window Comparator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档 
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Specifications

Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage, VS 6 V
Analog inputs (IN+, IN–) Differential (VIN+) – (VIN–)(2) –40 40 V
Common-mode (3) GND – 0.3 40
Analog input LIMIT GND – 0.3 (VS) + 0.3 V
Digital inputs LATCH, DELAY, ENABLE, HYS GND – 0.3 (VS) + 0.3 V
Alert output GND – 0.3 6 V
Operating temperature –40 125 °C
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
VIN+ and VIN– are the voltages at the IN+ and IN– terminals, respectively.
Input voltage may exceed the voltage shown if the current at that terminal is limited to 5 mA.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V
Charged-device model (CDM), per AEC Q100-011 ±1000
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCM Common-mode input voltage 12 V
VS Operating supply voltage 2.7 3.3 5.5 V
Delay setting 100 µs
TA Operating free-air temperature –40 125 °C

Thermal Information

THERMAL METRIC(1) INA300-Q1 UNIT
DGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 169.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.1 °C/W
RθJB Junction-to-board thermal resistance 89.6 °C/W
ψJT Junction-to-top characterization parameter 8.5 °C/W
ψJB Junction-to-board characterization parameter 88.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

Electrical Characteristics

at TA = 25°C, VSENSE = VIN+ – VIN– = 0 mV, VS = 3.3 V, VIN+ = 12 V, VLIMIT = 10 mV, and DELAY = 100 µs (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
INPUT
VCM Common-mode input voltage 0 36 V
VIN Differential input voltage VIN = VIN+ – VIN– 0 250 mV
CMR Common-mode rejection VIN+ = 0 V to 36 V,
TA= –40ºC to 125ºC
100 120 dB
VOS Offset voltage, RTI(1) VS = 3.3 V, DELAY = 100 μs –75 –500 μV
VS = +3.3 V, DELAY = 50 μs –125 –500
VS = +3.3 V, DELAY = 10 μs(2) –350 –650
dVOS/dT Offset voltage drift, RTI(1) TA= –40ºC to 125ºC 0.1 0.5 μV/°C
PSR Power-supply rejection ratio VS = 2.7 V to 5.5 V, VIN+ = 12 V,
TA= –40ºC to 125ºC
75 150 μV/V
IB Input bias current 5 10 μA
Disable mode 0.05 0.5
IOS Input offset current ±0.1 μA
ILIMIT Limit threshold output current TA= 25ºC 19.9 20 20.1 μA
TA= –40ºC to 125ºC 19.85 20.15
DIGITAL INPUT/OUTPUT
tp Alert propagation delay Delay = open, overdrive = 1 mV 10 μs
Delay = GND, overdrive = 1 mV 50
Delay = VS, overdrive = 1 mV 100
HYS Hysteresis HYS = open 2 mV
HYS = GND 4
HYS = VS 8
VIH High-level input voltage Latch, enable 1.4 6 V
Delay, hysteresis VS – 0.5 6
VIL Low-level input voltage Latch, enable 0 0.4 V
Delay, hysteresis 0 0.5
VOL Alert low-level output voltage IOL = 3 mA 50 400 mV
ALERT terminal leakage input current VOH = 3.3 V 0.1 1 μA
Digital leakage input current 0 ≤ VIN ≤ VS 1 2 μA
POWER SUPPLY
IQ Quiescent current VSENSE = 0 mV, TA = 25ºC 115 135 μA
TA = –40ºC to 125ºC 150
VSENSE = 0 mV, disable mode,
HYS = 2 mV
2 3.5
RTI = referred-to-input.
Absolute-maximum values are tested with the threshold limit set using the corresponding noise adjustment factor (NAF) value. See Noise Adjustment Factor (NAF) for additional information on applying the NAF value.

Timing Requirements

MIN NOM MAX UNIT
Start-up time 1 ms
ten Enable time 300 µs
tdis Disable time 20 µs

Typical Characteristics

at TA = 25°C, VS = 3.3 V, VIN+ = 12 V, alert pull-up resistor = 10 kΩ, and Delay = 100 µs (unless otherwise noted)
INA300-Q1 C001_SBOS613.png
Delay = 10 µs
Figure 1. Input Offset Voltage
INA300-Q1 C003_SBOS613.png
Delay = 100 µs
Figure 3. Input Offset Voltage
INA300-Q1 C005_SBOS613.png
Figure 5. Input Offset Voltage vs Temperature
INA300-Q1 C007_SBOS613.png
Figure 7. Input Bias Current vs Common-Mode Voltage
(Enabled)
INA300-Q1 C009_SBOS613.png
Figure 9. Input Bias Current vs Temperature (Enabled)
INA300-Q1 C011_SBOS613.png
Figure 11. Quiescent Current vs Supply Voltage (Enabled)
INA300-Q1 C013_SBOS613.png
Figure 13. Quiescent Current vs Temperature (Enabled)
INA300-Q1 C025_SBOS613.png
Z = Floating L = Low H = High
HYS – DELAY
Figure 15. Quiescent Current vs HYS and DELAY Settings
(Enabled)
INA300-Q1 C015_SBOS613.png
Figure 17. Limit Current Source vs Temperature
INA300-Q1 C017_SBOS613.png
Figure 19. Alert Step Response
INA300-Q1 C019_SBOS613.png
Figure 21. Alert Response
(Latch Mode to Transparent Mode)
INA300-Q1 C002_SBOS613.png
Delay = 50 µs
Figure 2. Input Offset Voltage
INA300-Q1 C004_SBOS613.png
Figure 4. Input Offset Voltage vs Supply Voltage
INA300-Q1 common_mode_graph.gif
Figure 6. Common-Mode Rejection Ratio vs Temperature
INA300-Q1 C008_SBOS613.png
Figure 8. Input Bias Current vs Common-Mode Voltage
(Disabled)
INA300-Q1 C010_SBOS613.png
Figure 10. Input Bias Current vs Temperature (Disabled)
INA300-Q1 C012_SBOS613.png
Figure 12. Quiescent Current vs Supply Voltage (Disabled)
INA300-Q1 C014_SBOS613.png
Figure 14. Quiescent Current vs Temperature (Disabled)
INA300-Q1 C026_SBOS613.png
Z = Floating L = Low H = High
HYS – DELAY
Figure 16. Quiescent Current vs HYS and DELAY Settings
(Disabled)
INA300-Q1 C016_SBOS613.png
Figure 18. Hysteresis vs Temperature
INA300-Q1 C018_SBOS613.png
Figure 20. Alert Response (Disable to Enable)