ZHCSCQ6A August   2014  – October 2014 FDC1004

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 典型应用
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Voltage Level
    7. 7.7 I2C Interface Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 The Shield
      2. 8.3.2 The CAPDAC
      3. 8.3.3 Capacitive System Offset Calibration
      4. 8.3.4 Capacitive Gain Calibration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single Ended Measurement
      2. 8.4.2 Differential Measurement
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Address
      2. 8.5.2 Read/Write Operations
      3. 8.5.3 Device Usage
        1. 8.5.3.1 Measurement Configuration
        2. 8.5.3.2 Triggering Measurements
        3. 8.5.3.3 Wait for Measurement Completion
        4. 8.5.3.4 Read of Measurement Result
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 Capacitive Measurement Registers
      2. 8.6.2 Measurement Configuration Registers
      3. 8.6.3 FDC Configuration Register
      4. 8.6.4 Offset Calibration Registers
      5. 8.6.5 Gain Calibration Registers
      6. 8.6.6 Manufacturer ID Register
      7. 8.6.7 Device ID Register
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Liquid Level Measurement
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plot
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Set Up
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Input voltage VDD –0.3 6 V
SCL, SDA –0.3 6 V
at any other pin –0.3 VDD+0.3 V
Input current at any pin 3 mA
Junction temperature(2) 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.

7.2 Handling Ratings

MIN MAX UNIT
TSTG Storage Temperature –65 150 °C
V(ESD) Electrostatic discharge(1) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2) –1000 1000 V
Charged device model (CDM), per JEDEC specification -500 500 JESD22-C101, all pins(3) –250 250 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage (VDD-GND) 3 3.3 3.6 V
Temperature –40 85 °C

7.4 Thermal Information

THERMAL METRIC(1) FDC1004 UNIT
WSON
10 PINS
RθJA Junction-to-ambient thermal resistance 46.8 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Over recommended operating temperature range, VDD = 3.3 V, for TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITION MIN TYP MAX UNIT
POWER SUPPLY
IDD Supply current Conversion mode; Digital input to VDD or GND 750 950 µA
Standby; Digital input to VDD or GND 29 70 µA
CAPACITIVE INPUT
ICR Input conversion range ±15 pF
COMAX Max input offset capacitance per channel, Series resistance at CINn n=1.4 = 0 Ω 100 pF
RES Effective resolution (2) Sample rate = 100S/s (1) 16 bit
EON Output noise Sample rate = 100S/s (1) 33.2 aF/√Hz
ERR Absolute error after offset calibration ±6 fF
TcCOFF Offset deviation over temperature -40°C < T < 85°C 30 fF
GERR Gain rrror 0.07 % of FS
tcG Gain drift vs. temperature -40°C < T < 85°C 2.1 ppm of FSR/°C
PSRR DC power supply rejection 3 V < VDD < 3.6 V 11 fF/V
CAPDAC
FRCAPDAC Full-scale range 96.875 pF
RESCAPDAC Resolution 5 bit
TcCOFFCAPDAC Offset drift vs. temperature -40°C < T < 85°C 1 ppm of FS/°C
EXCITATION
ƒ Frequency 25 kHz
VAC AC voltage across capacitance 2.4 Vpp
VDC Average DC voltage across capacitance 1.2 V
SHIELD
DRV Driver capability ƒ = 25 kHz, SHLDn to GND, n = 1,2 400 pF
(1) No external capacitance connected.
(2) Effective resolution is the ratio of converter full scale range to RMS measurement noise.

7.6 I2C Interface Voltage Level

Over recommended operating free-air temperature range, VDD = 3.3 V, for TA = TJ = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input high voltage 0.7*VDD V
VIL Input low voltage 0.3*VDD V
VOL Output low voltage Sink current 3 mA 0.4 V
HYS Hysteresis (1) 0.1*VDD V
(1) This parameter is specified by design and/or characterization and is not tested in production.

7.7 I2C Interface Timing

Over recommended operating free-air temperature range, VDD = 3.3 V, for TA = TJ = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fSCL Clock frequency(1) 10 400 kHz
tLOW Clock low time(1) 1.3 µs
tHIGH Clock high time(1) 0.6 µs
tHD;STA Hold time (repeated) START condition(1) After this period, the first clock pulse is generated 0.6 µs
tSU;STA Set-up time for a repeated START condition(1) 0.6 µs
tHD;DAT Data hold time(1)(2) 0 ns
tSU;DAT Data setup time(1) 100 ns
tf SDA fall time(1) IL ≤ 3mA; CL ≤ 400pF 300 ns
tSU;STO Set-up time for STOP condition(1) 0.6 µs
tBUF Bus free time between a STOP and START condition(1) 1.3 µs
tVD;DAT Data valid time(1) 0.9 ns
tVD;ACK Data valid acknowledge time(1) 0.9 ns
tSP Pulse width of spikes that must be suppressed by the input filter(1) 50 ns
(1) This parameter is specified by design and/or characterization and is not tested in production.
(2) The FDC1004 provides an internal 300 ns minimum hold time to bridge the undefined region of the falling edge of SCL.
I2C_TIMING.gifFigure 1. I2C Timing

7.8 Typical Characteristics

D044_SNOSCY5.gif
Figure 2. Active Conversion Mode Supply Current vs. Temperature
D090_SNOSCY5.gif
CINn = 10 pF n = 1...4
Figure 4. Gain Drift vs. Temperature
D049_SNOSCY5.gif
Figure 6. Frequency Response 100S/s
D051_SNOSCY5.gif
Figure 8. Frequency Response 400S/s
D043_SNOSCY5.gif
Figure 3. Stand-by Mode Supply Current vs. Temperature
D045_SNOSCY5.gif
CINn = open n = 1...4
Figure 5. Offset Drift vs. Temperature
D050_SNOSCY5.gif
Figure 7. Frequency Response 200S/s