ZHCSGK5A July 2017 – July 2017 ESD401
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Electrical fast transient | IEC 61000-4-4 (5/50 ns) at 25°C | 80 | A | |
Peak pulse | IEC 61000-4-5 power (tp - 8/20 µs) at 25°C | 67 | W | |
IEC 61000-4-5 current (tp - 8/20 µs) at 25°C | 4.5 | A | ||
TA | Operating free-air temperature | –40 | 125 | °C |
Tstg | Storage temperature | –65 | 155 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2500 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | IEC 61000-4-2 contact discharge | ±24000 | V |
IEC 61000-4-2 air-gap discharge | ±30000 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VIO | Input pin voltage | –5.5 | 5.5 | V |
TA | Operating free-air temperature | –40 | 125 | °C |
THERMAL METRIC(1) | ESD401 | UNIT | |
---|---|---|---|
DPY (X1SON) | |||
2 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 420 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 169.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 276.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 122.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 157.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
VRWM | Reverse stand-off voltage | IIO < 10 nA | –5.5 | 5.5 | V | |
VBRF | Breakdown voltage, Pin 1 to Pin 2 (1) | IIO =1 mA, at TA = 25°C | 7.5 | 9.1 | V | |
VBRR | Breakdown voltage, Pin 2 to Pin 1 (1) | IIO =1 mA, at TA = 25°C | 7.5 | 9.1 | V | |
VHOLD | Holding voltage (2) | IIO =1 mA | 8.3 | V | ||
VCLAMP | Clamping voltage | IPP = 1 A, TLP, from Pin 1 to Pin 2 and Pin 2 to Pin 1, TA = 25°C | 11 | V | ||
IPP = 5 A, TLP, from Pin 1 to Pin 2 and Pin 2 to Pin 1, TA = 25°C | 16 | |||||
IPP = 16 A, TLP, from Pin 1 to Pin 2 and Pin 2 to Pin 1, TA = 25°C | 24 | |||||
IPP = 1.8 A, IEC-61000-4-5 (tp - 8/20 µs) from Pin 1 to Pin 2 and Pin 2 to Pin 1, TA = 25°C | 12 | |||||
IPP = 4.5 A, IEC-61000-4-5 (tp - 8/20 µs) from Pin 1 to Pin 2 and Pin 2 to Pin 1, TA = 25°C | 15 | |||||
ILEAK | Leakage current, Pin 1 to Pin2 and PIn2 to Pin 1 | VIO = ±2.5 V | 0.03 | 10 | nA | |
RDYN | Dynamic resistance | Measured between TLP IPP of 10 A and 20 A, Pin 2 to Pin 1 and Pin 1 to Pin2, TA = 25°C | 0.7 | Ω | ||
CL | Line capacitance | VIO = 0 V, f = 1 MHz, Pin 1 to Pin 2 and Pin2 to Pin1, TA = 25°C | 0.77 | 0.95 | pF |