SLVSET1 August   2018 DRV8873

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bridge Control
        1. 7.3.1.1 Control Modes
        2. 7.3.1.2 Half-Bridge Operation
        3. 7.3.1.3 Internal Current Sense and Current Regulation
        4. 7.3.1.4 Slew-Rate Control
        5. 7.3.1.5 Dead Time
        6. 7.3.1.6 Propagation Delay
        7. 7.3.1.7 nFAULT Pin
        8. 7.3.1.8 nSLEEP as SDO Reference
      2. 7.3.2 Motor Driver Protection Circuits
        1. 7.3.2.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.2.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.2.3 Overcurrent Protection (OCP)
          1. 7.3.2.3.1 Latched Shutdown (OCP_MODE = 00b)
          2. 7.3.2.3.2 Automatic Retry (OCP_MODE = 01b)
          3. 7.3.2.3.3 Report Only (OCP_MODE = 10b)
          4. 7.3.2.3.4 Disabled (OCP_MODE = 11b)
        4. 7.3.2.4 Open-Load Detection (OLD)
          1. 7.3.2.4.1 Open-Load Detection in Passive Mode (OLP)
          2. 7.3.2.4.2 Open-Load Detection in Active Mode (OLA)
        5. 7.3.2.5 Thermal Shutdown (TSD)
          1. 7.3.2.5.1 Latched Shutdown (TSD_MODE = 0b)
          2. 7.3.2.5.2 Automatic Recovery (TSD_MODE = 1b)
        6. 7.3.2.6 Thermal Warning (OTW)
      3. 7.3.3 Hardware Interface
        1. 7.3.3.1 MODE (Tri-Level Input)
        2. 7.3.3.2 Slew Rate
    4. 7.4 Device Functional Modes
      1. 7.4.1 Motor Driver Functional Modes
        1. 7.4.1.1 Sleep Mode (nSLEEP = 0)
        2. 7.4.1.2 Disable Mode (nSLEEP = 1, DISABLE = 1)
        3. 7.4.1.3 Operating Mode (nSLEEP = 1, DISABLE = 0)
        4. 7.4.1.4 nSLEEP Reset Pulse
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
      1. 7.6.1 Status Registers
        1. 7.6.1.1 FAULT Status Register Name (address = 0x00)
          1. Table 21. FAULT Status Register Field Descriptions
        2. 7.6.1.2 DIAG Status Register Name (address = 0x01)
          1. Table 22. DIAG Status Register Field Descriptions
      2. 7.6.2 Control Registers
        1. 7.6.2.1 IC1 Control Register (address = 0x02)
          1. Table 24. IC1 Control Register Field Descriptions
        2. 7.6.2.2 IC2 Control Register (address = 0x03)
          1. Table 25. IC2 Control Register Field Descriptions
        3. 7.6.2.3 IC3 Control Register (address = 0x04)
          1. Table 26. IC3 Control Register Field Descriptions
        4. 7.6.2.4 IC4 Control Register (address = 0x05)
          1. Table 27. IC4 Control Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Motor Voltage
        2. 8.2.1.2 Drive Current and Power Dissipation
        3. 8.2.1.3 Sense Resistor
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Thermal Considerations
        2. 8.2.2.2 Heatsinking
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.1.4 Slew-Rate Control

The rise and fall times (tr and tf) of the outputs can be adjusted on the hardware version of the device by changing the value of an external resistor connected from the SR pin to ground. On the SPI version of the device, the slew rate can be adjusted through the SPI. The output slew rate is adjusted internally to the device by controlling the ramp rate of the driven FET gate. The voltage or resistance on the SR pin sets the output rise and fall times in the hardware version of the device.

Table 10. DRV8873H Slew Rate (SR) Pin Connections

CONNECTION SR CIRCUIT
Connect to GND 53.2 V/µs DRV8873 drv8873q1_sr_connection1.gif
22 kΩ ± 5% to GND 34 V/µs DRV8873 drv8873q1_sr_connection2.gif
68 kΩ ± 5% to GND 18.3 V/µs DRV8873 drv8873q1_sr_connection2.gif
> 2 MΩ to GND (Hi-Z) 13 V/µs DRV8873 drv8873q1_sr_connection3.gif
51 kΩ ± 5% to DVDD 7.9 V/µs DRV8873 drv8873q1_sr_connection4.gif
Connect to DVDD 2.6 V/µs DRV8873 drv8873q1_sr_connection5.gif

Figure 15 shows the internal circuit block for the SR pin.

DRV8873 drv8873q1_sr_block_diagram.gifFigure 15. SR Block Diagram

Table 11 lists the settings in the SPI register that set the output rise and fall times in the SPI version of the device.

Table 11. DRV8873S Slew Rate Settings

SR RISE TIME (V/µs) FALL TIME (V/µs)
000b 53.2 53.2
001b 34 34
010b 18.3 18.3
011b 13 13
100b 10.8 10.8
101b 7.9 7.9
110b 5.3 5.3
111b 2.6 2.6

The typical voltage on the SR pin is 3 V and is driven internally. Changing the resistor value on the SR pin changes the slew-rate setting from approximately 2.6 V/µs to 53.2 V/µs. The recommended values for the external resistor are shown in the Slew Rate section. If the SR pin is grounded then the slew rate is 53.2 V/µs. Leaving the SR pin as a no-connect pin sets the slew rate to 13 V/µs. Tying it to the DVDD pin sets the slew rate to 2.6 V/µs.