ZHCSN76B January   2021  – April 2022 DRV8316

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 SPI Slave Mode Timings
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Output Stage
      2. 8.3.2  Control Modes
        1. 8.3.2.1 6x PWM Mode (MODE = 00b or MODE Pin Tied to AGND)
        2. 8.3.2.2 3x PWM Mode (MODE = 10b or MODE Pin is Connected to AGND with RMODE)
        3. 8.3.2.3 Current Limit Mode (MODE = 01b / 11b or MODE Pin is Hi-Z or Connected to AVDD)
      3. 8.3.3  Device Interface Modes
        1. 8.3.3.1 Serial Peripheral Interface (SPI)
        2. 8.3.3.2 Hardware Interface
      4. 8.3.4  Step-Down Mixed-Mode Buck Regulator
        1. 8.3.4.1 Buck in Inductor Mode
        2. 8.3.4.2 Buck in Resistor mode
        3. 8.3.4.3 Buck Regulator with External LDO
        4. 8.3.4.4 AVDD Power Sequencing on Buck Regulator
        5. 8.3.4.5 Mixed mode Buck Operation and Control
      5. 8.3.5  AVDD Linear Voltage Regulator
      6. 8.3.6  Charge Pump
      7. 8.3.7  Slew Rate Control
      8. 8.3.8  Cross Conduction (Dead Time)
      9. 8.3.9  Propagation Delay
        1. 8.3.9.1 Driver Delay Compensation
      10. 8.3.10 Pin Diagrams
        1. 8.3.10.1 Logic Level Input Pin (Internal Pulldown)
        2. 8.3.10.2 Logic Level Input Pin (Internal Pullup)
        3. 8.3.10.3 Open Drain Pin
        4. 8.3.10.4 Push Pull Pin
        5. 8.3.10.5 Four Level Input Pin
      11. 8.3.11 Current Sense Amplifiers
        1. 8.3.11.1 Current Sense Amplifier Operation
        2. 8.3.11.2 Current Sense Amplifier Offset Correction
      12. 8.3.12 Active Demagnetization
        1. 8.3.12.1 Automatic Synchronous Rectification Mode (ASR Mode)
          1. 8.3.12.1.1 Automatic Synchronous Rectification in Commutation
          2. 8.3.12.1.2 Automatic Synchronous Rectification in PWM Mode
        2. 8.3.12.2 Automatic Asynchronous Rectification Mode (AAR Mode)
      13. 8.3.13 Cycle-by-Cycle Current Limit
        1. 8.3.13.1 Cycle by Cycle Current Limit with 100% Duty Cycle Input
      14. 8.3.14 Protections
        1. 8.3.14.1 VM Supply Undervoltage Lockout (NPOR)
        2. 8.3.14.2 AVDD Undervoltage Lockout (AVDD_UV)
        3. 8.3.14.3 BUCK Undervoltage Lockout (BUCK_UV)
        4. 8.3.14.4 VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 8.3.14.5 Overvoltage Protections (OV)
        6. 8.3.14.6 Overcurrent Protection (OCP)
          1. 8.3.14.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 8.3.14.6.2 OCP Automatic Retry (OCP_MODE = 01b)
          3. 8.3.14.6.3 OCP Report Only (OCP_MODE = 10b)
          4. 8.3.14.6.4 OCP Disabled (OCP_MODE = 11b)
        7. 8.3.14.7 Buck Overcurrent Protection
        8. 8.3.14.8 Thermal Warning (OTW)
        9. 8.3.14.9 Thermal Shutdown (OTS)
          1. 8.3.14.9.1 OTS FET
          2. 8.3.14.9.2 OTS (Non FET)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (CLR_FLT or nSLEEP Reset Pulse)
      2. 8.4.2 DRVOFF functionality
    5. 8.5 SPI Communication
      1. 8.5.1 Programming
        1. 8.5.1.1 SPI Format
    6. 8.6 Register Map
      1. 8.6.1 STATUS Registers
      2. 8.6.2 CONTROL Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Three-Phase Brushless-DC Motor Control
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Motor Voltage
          2. 9.2.1.1.2 Using Active Demagnetization
          3. 9.2.1.1.3 Driver Propagation Delay and Dead Time
          4. 9.2.1.1.4 Using Delay Compensation
          5. 9.2.1.1.5 Using the Buck Regulator
          6. 9.2.1.1.6 Current Sensing and Output Filtering
          7. 9.2.1.1.7 Power Dissipation and Junction Temperature Losses
        2. 9.2.1.2 Application Curves
      2. 9.2.2 Three-Phase Brushless-DC Motor Control With Current Limit
        1. 9.2.2.1 Block Diagram
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Motor Voltage
          2. 9.2.2.2.2 ILIM Implementation
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Brushed-DC and Solenoid Load
        1. 9.2.3.1 Block Diagram
        2. 9.2.3.2 Design Requirements
          1. 9.2.3.2.1 Detailed Design Procedure
      4. 9.2.4 Three Solenoid Loads
        1. 9.2.4.1 Block Diagram
        2. 9.2.4.2 Design Requirements
          1. 9.2.4.2.1 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
9.2.1.1.3 Driver Propagation Delay and Dead Time

Driver propagation delay (tPD) and dead time (tdead) is specified with a typical and maximum value, but not with a minimum value. This is due to the direction of current at the OUTx pin when synchronous inputs are switching. Driver propagation delay and dead time can be shorter than typical values due to slower internal turn-ons of the high-side or low-side internal MOSFETs to avoid internal dV/dt coupling.

For more information and examples of how propagation delay and dead time differs for input PWM and output configurations, please visit the Delay and Dead Time in Integrated MOSFET Drivers application note.

The dead time from the microcontroller’s PWM outputs can be used as an extra precaution in addition to the DRV8316 internal shoot-through protection. This creates a condition where internal logic prioritizes the MCU dead time or driver dead time based on their durations.

If the MCU dead time is less than the driver dead time, the driver will compensate and make the true output dead time the value specified by the DRV8316. If the MCU inserted dead time is larger than the driver dead time, then the DRV8316 will adjust accordingly to the MCU dead time as shown in the table below.

A summary of the device delay times with respect to synchronous inputs INHx and INLx, OUTx current direction, and inserted MCU dead time are shown in Table 9-2.

Table 9-2 Summary of delay times in integrated FET devices depending on inputs and output current direction

OUTx current direction

INHx

INLx

Propagation Delay (tPD)

Dead Time (tdead)

Inserted MCU dead time (tdead(MCU))

tdead(MCU) < tdead

tdead(MCU) > tdead

Out of OUTx

Rising

Falling

Typical

Typical

Output dead time = tdead

Output dead time = tdead(MCU)

Falling

Rising

Smaller than typical

Smaller than typical

Output dead time < tdead

Output dead time < tdead(MCU)

Into OUTx

Rising

Falling

Smaller than typical

Smaller than typical

Output dead time < tdead

Output dead time < tdead(MCU)

Falling

Rising

Typical

Typical

Output dead time = tdead

Output dead time = tdead(MCU)