ZHCSDE3G February   2015  – October 2022 DP83867CR , DP83867IR

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     7
    2. 6.1 Unused Pins
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Power-Up Timing
    7. 7.7  Reset Timing
    8. 7.8  MII Serial Management Timing
    9. 7.9  RGMII Timing
    10. 7.10 GMII Transmit Timing (1)
    11. 7.11 GMII Receive Timing (1)
    12. 7.12 100-Mbps MII Transmit Timing (1)
    13. 7.13 100-Mbps MII Receive Timing (1)
    14. 7.14 10-Mbps MII Transmit Timing (1)
    15. 7.15 10-Mbps MII Receive Timing (1)
    16. 7.16 DP83867IR/CR Start of Frame Detection Timing
    17. 7.17 Timing Diagrams
    18. 7.18 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 WoL (Wake-on-LAN) Packet Detection
        1. 8.3.1.1 Magic Packet Structure
        2. 8.3.1.2 Magic Packet Example
        3. 8.3.1.3 Wake-on-LAN Configuration and Status
      2. 8.3.2 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 8.3.2.1 SFD Latency Variation and Determinism
          1. 8.3.2.1.1 1000-Mb SFD Variation in Master Mode
          2. 8.3.2.1.2 1000-Mb SFD Variation in Slave Mode
          3. 8.3.2.1.3 100-Mb SFD Variation
      3. 8.3.3 Clock Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 MAC Interfaces
        1. 8.4.1.1 Reduced GMII (RGMII)
          1. 8.4.1.1.1 1000-Mbps Mode Operation
          2. 8.4.1.1.2 1000-Mbps Mode Timing
          3. 8.4.1.1.3 10- and 100-Mbps Mode
        2. 8.4.1.2 Gigabit MII (GMII)
        3. 8.4.1.3 Media Independent Interface (MII)
          1. 8.4.1.3.1 Nibble-wide MII Data Interface
          2. 8.4.1.3.2 Collision Detect
          3. 8.4.1.3.3 Carrier Sense
      2. 8.4.2 Serial Management Interface
        1. 8.4.2.1 Extended Address Space Access
          1. 8.4.2.1.1 Write Address Operation
          2. 8.4.2.1.2 Read Address Operation
          3. 8.4.2.1.3 Write (No Post Increment) Operation
          4. 8.4.2.1.4 Read (No Post Increment) Operation
          5. 8.4.2.1.5 Write (Post Increment) Operation
          6. 8.4.2.1.6 Read (Post Increment) Operation
          7. 8.4.2.1.7 Example of Read Operation Using Indirect Register Access
          8. 8.4.2.1.8 Example of Write Operation Using Indirect Register Access
      3. 8.4.3 Auto-Negotiation
        1. 8.4.3.1 Speed and Duplex Selection - Priority Resolution
        2. 8.4.3.2 Master and Slave Resolution
        3. 8.4.3.3 Pause and Asymmetrical Pause Resolution
        4. 8.4.3.4 Next Page Support
        5. 8.4.3.5 Parallel Detection
        6. 8.4.3.6 Restart Auto-Negotiation
        7. 8.4.3.7 Enabling Auto-Negotiation Through Software
        8. 8.4.3.8 Auto-Negotiation Complete Time
        9. 8.4.3.9 Auto-MDIX Resolution
      4. 8.4.4 Loopback Mode
        1. 8.4.4.1 Near-End Loopback
          1. 8.4.4.1.1 MII Loopback
          2. 8.4.4.1.2 PCS Loopback
          3. 8.4.4.1.3 Digital Loopback
          4. 8.4.4.1.4 Analog Loopback
        2. 8.4.4.2 External Loopback
        3. 8.4.4.3 Far-End (Reverse) Loopback
      5. 8.4.5 BIST Configuration
      6. 8.4.6 Cable Diagnostics
        1. 8.4.6.1 TDR
        2. 8.4.6.2 Energy Detect
        3. 8.4.6.3 Fast Link Detect
        4. 8.4.6.4 Speed Optimization
        5. 8.4.6.5 Mirror Mode
        6. 8.4.6.6 Interrupt
        7. 8.4.6.7 IEEE 802.3 Test Modes
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 LED Operation From 1.8-V I/O VDD Supply
      4. 8.5.4 PHY Address Configuration
      5. 8.5.5 Reset Operation
        1. 8.5.5.1 Hardware Reset
        2. 8.5.5.2 IEEE Software Reset
        3. 8.5.5.3 Global Software Reset
        4. 8.5.5.4 Global Software Restart
      6. 8.5.6 Power-Saving Modes
        1. 8.5.6.1 IEEE Power Down
        2. 8.5.6.2 Deep Power-Down Mode
        3. 8.5.6.3 Active Sleep
        4. 8.5.6.4 Passive Sleep
    6. 8.6 Register Maps
      1. 8.6.1   Basic Mode Control Register (BMCR)
      2. 8.6.2   Basic Mode Status Register (BMSR)
      3. 8.6.3   PHY Identifier Register #1 (PHYIDR1)
      4. 8.6.4   PHY Identifier Register #2 (PHYIDR2)
      5. 8.6.5   Auto-Negotiation Advertisement Register (ANAR)
      6. 8.6.6   Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 8.6.7   Auto-Negotiate Expansion Register (ANER)
      8. 8.6.8   Auto-Negotiation Next Page Transmit Register (ANNPTR)
      9. 8.6.9   Auto-Negotiation Next Page Receive Register (ANNPRR)
      10. 8.6.10  1000BASE-T Configuration Register (CFG1)
      11. 8.6.11  Status Register 1 (STS1)
      12. 8.6.12  Extended Register Addressing
        1. 8.6.12.1 Register Control Register (REGCR)
        2. 8.6.12.2 Address or Data Register (ADDAR)
      13. 8.6.13  1000BASE-T Status Register (1KSCR)
      14. 8.6.14  PHY Control Register (PHYCR)
      15. 8.6.15  PHY Status Register (PHYSTS)
      16. 8.6.16  MII Interrupt Control Register (MICR)
      17. 8.6.17  Interrupt Status Register (ISR)
      18. 8.6.18  Configuration Register 2 (CFG2)
      19. 8.6.19  Receiver Error Counter Register (RECR)
      20. 8.6.20  BIST Control Register (BISCR)
      21. 8.6.21  Status Register 2 (STS2)
      22. 8.6.22  LED Configuration Register 1 (LEDCR1)
      23. 8.6.23  LED Configuration Register 2 (LEDCR2)
      24. 8.6.24  LED Configuration Register (LEDCR3)
      25. 8.6.25  Configuration Register 3 (CFG3)
      26. 8.6.26  Control Register (CTRL)
      27. 8.6.27  Testmode Channel Control (TMCH_CTRL)
      28. 8.6.28  Robust Auto MDIX Timer Configuration Register (AMDIX_TMR_CFG)
      29. 8.6.29  Fast Link Drop Configuration Register (FLD_CFG)
      30. 8.6.30  Fast Link Drop Threshold Configuration Register (FLD_THR_CFG)
      31. 8.6.31  Configuration Register 4 (CFG4)
      32. 8.6.32  RGMII Control Register (RGMIICTL)
      33. 8.6.33  RGMII Control Register 2 (RGMIICTL2)
      34. 8.6.34  100BASE-TX Configuration (100CR)
      35. 8.6.35  Viterbi Module Configuration (VTM_CFG)
      36. 8.6.36  Skew FIFO Status (SKEW_FIFO)
      37. 8.6.37  Strap Configuration Status Register 1 (STRAP_STS1)
      38. 8.6.38  Strap Configuration Status Register 2 (STRAP_STS2)
      39. 8.6.39  BIST Control and Status Register 1 (BICSR1)
      40. 8.6.40  BIST Control and Status Register 2 (BICSR2)
      41. 8.6.41  BIST Control and Status Register 3 (BICSR3)
      42. 8.6.42  BIST Control and Status Register 4 (BICSR4)
      43. 8.6.43  Configuration for Receiver's Equalizer (CRE)
      44. 8.6.44  RGMII Delay Control Register (RGMIIDCTL)
      45. 8.6.45  Configuration of Receiver's LPF (CRLPF)
      46. 8.6.46  Enable Control of Receiver's Equalizer (ECRE)
      47. 8.6.47  PLL Clock-out Control Register (PLLCTL)
      48. 8.6.48  Sync FIFO Control (SYNC_FIFO_CTRL)
      49. 8.6.49  Loopback Configuration Register (LOOPCR)
      50. 8.6.50  DSP Configuration (DSP_CONFIG)
      51. 8.6.51  DSP Feedforward Equalizer Configuration (DSP_FFE_CFG)
      52. 8.6.52  Receive Configuration Register (RXFCFG)
      53. 8.6.53  Receive Status Register (RXFSTS)
      54. 8.6.54  Pattern Match Data Register 1 (RXFPMD1)
      55. 8.6.55  Pattern Match Data Register 2 (RXFPMD2)
      56. 8.6.56  Pattern Match Data Register 3 (RXFPMD3)
      57. 8.6.57  SecureOn Pass Register 2 (RXFSOP1)
      58. 8.6.58  SecureOn Pass Register 2 (RXFSOP2)
      59. 8.6.59  SecureOn Pass Register 3 (RXFSOP3)
      60. 8.6.60  Receive Pattern Register 1 (RXFPAT1)
      61. 8.6.61  Receive Pattern Register 2 (RXFPAT2)
      62. 8.6.62  Receive Pattern Register 3 (RXFPAT3)
      63. 8.6.63  Receive Pattern Register 4 (RXFPAT4)
      64. 8.6.64  Receive Pattern Register 5 (RXFPAT5)
      65. 8.6.65  Receive Pattern Register 6 (RXFPAT6)
      66. 8.6.66  Receive Pattern Register 7 (RXFPAT7)
      67. 8.6.67  Receive Pattern Register 8 (RXFPAT8)
      68. 8.6.68  Receive Pattern Register 9 (RXFPAT9)
      69. 8.6.69  Receive Pattern Register 10 (RXFPAT10)
      70. 8.6.70  Receive Pattern Register 11 (RXFPAT11)
      71. 8.6.71  Receive Pattern Register 12 (RXFPAT12)
      72. 8.6.72  Receive Pattern Register 13 (RXFPAT13)
      73. 8.6.73  Receive Pattern Register 14 (RXFPAT14)
      74. 8.6.74  Receive Pattern Register 15 (RXFPAT15)
      75. 8.6.75  Receive Pattern Register 16 (RXFPAT16)
      76. 8.6.76  Receive Pattern Register 17 (RXFPAT17)
      77. 8.6.77  Receive Pattern Register 18 (RXFPAT18)
      78. 8.6.78  Receive Pattern Register 19 (RXFPAT19)
      79. 8.6.79  Receive Pattern Register 20 (RXFPAT20)
      80. 8.6.80  Receive Pattern Register 21 (RXFPAT21)
      81. 8.6.81  Receive Pattern Register 22 (RXFPAT22)
      82. 8.6.82  Receive Pattern Register 23 (RXFPAT23)
      83. 8.6.83  Receive Pattern Register 24 (RXFPAT24)
      84. 8.6.84  Receive Pattern Register 25 (RXFPAT25)
      85. 8.6.85  Receive Pattern Register 26 (RXFPAT26)
      86. 8.6.86  Receive Pattern Register 27 (RXFPAT27)
      87. 8.6.87  Receive Pattern Register 28 (RXFPAT28)
      88. 8.6.88  Receive Pattern Register 29 (RXFPAT29)
      89. 8.6.89  Receive Pattern Register 30 (RXFPAT30)
      90. 8.6.90  Receive Pattern Register 31 (RXFPAT31)
      91. 8.6.91  Receive Pattern Register 32 (RXFPAT32)
      92. 8.6.92  Receive Pattern Byte Mask Register 1 (RXFPBM1)
      93. 8.6.93  Receive Pattern Byte Mask Register 2 (RXFPBM2)
      94. 8.6.94  Receive Pattern Byte Mask Register 3 (RXFPBM3)
      95. 8.6.95  Receive Pattern Byte Mask Register 4 (RXFPBM4)
      96. 8.6.96  Receive Pattern Control (RXFPATC)
      97. 8.6.97  I/O Configuration (IO_MUX_CFG)
      98. 8.6.98  GPIO Mux Control Register 1 (GPIO_MUX_CTRL1)
      99. 8.6.99  GPIO Mux Control Register 2 (GPIO_MUX_CTRL2)
      100. 8.6.100 GPIO Mux Control Register (GPIO_MUX_CTRL)
      101. 8.6.101 TDR General Configuration Register 1 (TDR_GEN_CFG1)
      102. 8.6.102 TDR Peak Locations Register 1 (TDR_PEAKS_LOC_1)
      103. 8.6.103 TDR Peak Locations Register 2 (TDR_PEAKS_LOC_2)
      104. 8.6.104 TDR Peak Locations Register 3 (TDR_PEAKS_LOC_3)
      105. 8.6.105 TDR Peak Locations Register 4 (TDR_PEAKS_LOC_4)
      106. 8.6.106 TDR Peak Locations Register 5 (TDR_PEAKS_LOC_5)
      107. 8.6.107 TDR Peak Locations Register 6 (TDR_PEAKS_LOC_6)
      108. 8.6.108 TDR Peak Locations Register 7 (TDR_PEAKS_LOC_7)
      109. 8.6.109 TDR Peak Locations Register 8 (TDR_PEAKS_LOC_8)
      110. 8.6.110 TDR Peak Locations Register 9 (TDR_PEAKS_LOC_9)
      111. 8.6.111 TDR Peak Locations Register 10 (TDR_PEAKS_LOC_10)
      112. 8.6.112 TDR Peak Amplitudes Register 1 (TDR_PEAKS_AMP_1)
      113. 8.6.113 TDR Peak Amplitudes Register 2 (TDR_PEAKS_AMP_2)
      114. 8.6.114 TDR Peak Amplitudes Register 3 (TDR_PEAKS_AMP_3)
      115. 8.6.115 TDR Peak Amplitudes Register 4 (TDR_PEAKS_AMP_4)
      116. 8.6.116 TDR Peak Amplitudes Register 5 (TDR_PEAKS_AMP_5)
      117. 8.6.117 TDR Peak Amplitudes Register 6 (TDR_PEAKS_AMP_6)
      118. 8.6.118 TDR Peak Amplitudes Register 7 (TDR_PEAKS_AMP_7)
      119. 8.6.119 TDR Peak Amplitudes Register 8 (TDR_PEAKS_AMP_8)
      120. 8.6.120 TDR Peak Amplitudes Register 9 (TDR_PEAKS_AMP_9)
      121. 8.6.121 TDR Peak Amplitudes Register 10 (TDR_PEAKS_AMP_10)
      122. 8.6.122 TDR General Status (TDR_GEN_STATUS)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Cable Line Driver
        2. 9.2.1.2 Clock In (XI) Recommendation
        3. 9.2.1.3 Crystal Recommendations
        4. 9.2.1.4 Clock Out (CLK_OUT) Phase Noise
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 MAC Interface
          1. 9.2.2.1.1 RGMII Layout Guidelines
          2. 9.2.2.1.2 GMII Layout Guidelines
        2. 9.2.2.2 Media Dependent Interface (MDI)
          1. 9.2.2.2.1 MDI Layout Guidelines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Transformer Layout
      4. 11.1.4 Metal Pour
      5. 11.1.5 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
    7. 12.7 Trademarks
      1.      Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Power Supply Recommendations

The DP83867 is capable of operating with as few as two or three supplies. The I/O power supply can also be operated independently of the main device power supplies to provide flexibility for the MAC interface.

For detailed information about DP83867 power consumption for specific supplies under a wide set of conditions, see the DP83867E/IS/CS/IR/CR RGZ Power Consumption Data application report (SNLA241).

The connection diagrams for the two-supply and three-supply configurations are shown in Figure 10-1 and Figure 10-2.

GUID-8DA73577-647F-49FD-8BC2-B7CABD3D04BF-low.gif
For two supply configuration, both VDDA1P8 pins must be left unconnected.
RGZ devices support 1.0V on VDD1P0 pins
Place 1-µF and 0.1-µF decoupling capacitors as close as possible to component VDD pins, placing the 0.1-µF capacitor closest to the pin.
VDDIO may be 3.3 V or 2.5 V or 1.8 V.
No Components should be connected to VDDA1P8 pins in Two Supply Configuration.
Figure 10-1 Two Supply Configuration
GUID-BBFA4883-D50E-4676-A1CA-7F3BAFCC054E-low.gif
Place 1-µF and 0.1-µF decoupling capacitors as close as possible to component VDD pins, placing the 0.1-µF capacitor closest to the pin.
RGZ devices support 1.0V on VDD1P0 pins
Note: VDDIO may be 3.3 V or 2.5 V or 1.8 V.
Figure 10-2 Three Supply Configuration

There is no requirement for the sequence of the supplies when operating in two-supply mode.

When operating in three-supply mode, the 1.8-V VDDA1P8 supply must be stable within 25 ms of the 2.5-V VDDA2P5 supply ramping up. There is no sequencing requirement for other supplies when operating in three-supply mode.

When powering down the DP83867, the 1.8-V supply should be brought down before the 2.5-V supply.

GUID-6BAE4A79-50F4-4BE5-BBE9-7954A0EFA72E-low.gif Figure 10-3 Three-Supply Mode Power Supply Sequence Diagram
Table 10-1 Three-Supply Mode Power Supply Sequence
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
T1 Beginning of VDDA2P5 ramp up to VDDA1P8 stable 0 25 ms
Note:

If the 2.5-V power supply provides power to DP83867 devices only, the 1.8-V supply may ramp up any time before 2.5-V.