ZHCSA88G August   2012  – August 2021 DLPR410

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Supply Voltage Requirements for Power-On Reset and Power-Down
    7. 6.7 Timing Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Data Interface
        1. 7.3.1.1 Data Outputs
        2. 7.3.1.2 Configuration Clock Input
        3. 7.3.1.3 Output Enable and Reset
        4. 7.3.1.4 Chip Enable
        5. 7.3.1.5 Configuration Pulse
        6. 7.3.1.6 Revision Selection
    4. 7.4 Device Functional Modes
      1.     
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Component Placement
      2. 10.1.2 Impedance Requirements
      3. 10.1.3 PCB Signal Routing
      4. 10.1.4 Fiducials
      5. 10.1.5 PCB Decoupling Guidelines
        1. 10.1.5.1 Bulk Decoupling
          1. 10.1.5.1.1 DLPR410 Decoupling Capacitors
      6. 10.1.6 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Compatibility
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision F (January 2020) to Revision G (August 2021)

  • 将数据表中对 DLPC410 控制器的所有引用更新为 DLPC410ZYR 控制器Go
  • 更新了应用列表Go
  • 更新了“说明”部分中的简化应用图Go
  • 将 Xilinx XCF 规格链接移到“规格”部分顶部Go
  • Removed numbers appended to all DNC signals in Pin Functions tableGo
  • Added entry for VCCJ to Absolute Maximum RatingsGo
  • Removed footnote reference to JEDEC Standard JESD22-A114A in ESD RatingsGo
  • Added entry for VCCJ to Recommended Operating ConditionsGo
  • Updated DLPC410ZYR and DLPR410 Connection SchematicGo
  • Updated DLPR410 and DLPC410ZYR with DMD Example Block Diagram Go
  • Added Application Curves sectionGo
  • Added 0.047-μF decoupling capacitor to GND for all Power Pins in Power Supply RecommendationsGo
  • Added Layout Example sectionGo
  • Added DLPR410BYVA to Device Compatibility tableGo
  • Added DLPR410BYVA to Part Number Description tableGo
  • Added DLPR410B Device MarkingsGo

Changes from Revision E (December 2018) to Revision F (January 2020)

  • Corrected Max Tstg per Xilinx data sheet Go
  • Pulled in specific layout information from referenced document and removed reference.Go
  • Corrected DDC_Version(3:0) bus width to DDC_Version(2:0). Go
  • Corrected DDC_Version(3:0) bus width to DDC_Version(2:0) . Go

Changes from Revision D (April 2015) to Revision E (December 2018)

  • 更新了应用说明 以包含新的 DLP650LNIR,移除了数据传输速率Go
  • Corrected Min Tstg per Xilinx data sheet Go
  • Corrected Min VCCO per Xilinx data sheet Go
  • Added support information for new DLP650LNIR DMD (multiple places)Go
  • Updated Section 7.2 Go
  • Corrected improper "DLPC910" reference to "DLPC410" Go
  • Updated Figure 8-1 Go
  • Added support for new DLP650LNIR DMD (multiple places)Go
  • Added Section 11.1.1 tableGo
  • Updated Section 11.1.2 Go
  • Updated Section 11.1.3 sectionGo
  • Added DLP650LNIR to Table 11-2 sectionGo
  • Deleted DLP Discovery 4100 Chipset reference in Table 11-2 Go

Changes from Revision C (March 2013) to Revision D (October 2015)

  • 更新了特性应用说明 Go
  • 通篇删除了 DLPR4101(增强功能 PROM 器件型号)Go
  • 添加了 ESD 等级表、特性说明部分、器件功能模式应用和实现部分、电源相关建议部分、布局部分、器件和文档支持部分以及机械、封装和可订购信息部分。Go
  • Deleted 1.8 V and 3.3 V operation values from VCCO, VIL, and VIH - this implementation is 2.5 V Go
  • Changed Device Marking Image Go
  • Changed Device Marking Image Go
  • Deleted DLP® Discovery™ 4100 Chipset Datasheet from Related Documentation Go
  • Added Link to XCF16P data sheet at xilinx.com Go

Changes from Revision B (March 2013) to Revision C (April 2013)

  • 添加了“器件顶视图”Go
  • 向“特性”添加了 DLPR4101“Load 4”增强功能Go
  • 通篇向 DLPR410 添加了 DLPR410 和 DLPR4101(增强功能 PROM 器件型号)Go
  • 添加了指向数据表的链接Go
  • Added the Version column to the Ordering Information tableGo
  • Updated DLPC and DLP7000 / DLP7000UV Embedded Example Block DiagramGo
  • Added DLP7000UV and DLP9500UV well suited for direct imaging lithography, 3D printing, and UV applications Go
  • Added DLPR4101YVA as equivalent to TI part number 2510442-0006 Go
  • Added Reference to DLPC410 data sheetGo
  • Added DLPR410 to Figure 11-2 Go
  • Added Top View of Device to device marking Go
  • Added DLP7000UV Related DocumentationGo
  • Added DLP9500UV Related DocumentationGo

Changes from Revision A (September 2012) to Revision B (March 2013)

  • Changed the top-side marking in the Ordering Information tableGo
  • Added DLPR4101 to DLPR410Go

Changes from Revision * (August 2012) to Revision A (September 2012)

  • 将器件从“产品预发布”更改为“量产”Go