ZHCSA88G August   2012  – August 2021 DLPR410

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Supply Voltage Requirements for Power-On Reset and Power-Down
    7. 6.7 Timing Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Data Interface
        1. 7.3.1.1 Data Outputs
        2. 7.3.1.2 Configuration Clock Input
        3. 7.3.1.3 Output Enable and Reset
        4. 7.3.1.4 Chip Enable
        5. 7.3.1.5 Configuration Pulse
        6. 7.3.1.6 Revision Selection
    4. 7.4 Device Functional Modes
      1.     
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Component Placement
      2. 10.1.2 Impedance Requirements
      3. 10.1.3 PCB Signal Routing
      4. 10.1.4 Fiducials
      5. 10.1.5 PCB Decoupling Guidelines
        1. 10.1.5.1 Bulk Decoupling
          1. 10.1.5.1.1 DLPR410 Decoupling Capacitors
      6. 10.1.6 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Compatibility
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
DLPR410 Decoupling Capacitors

Decoupling capacitors (0.1 µF recommended) are placed to minimize the distance from the decoupling capacitor to the supply and ground pins of the component. It is recommended that the placement of and routing for the decoupling capacitors meet the following guidelines:

  • The supply voltage pin of the capacitor must be located close to the device supply voltage pin(s). The decoupling capacitor must have vias to ground and voltage planes. The device can be connected directly to the decoupling capacitor (no via) if the trace length is less than 0.1 inch. Otherwise, the component must be tied to the voltage or ground plane through separate vias.
  • The trace lengths of the voltage and ground connections for decoupling capacitors and components must be less than 0.1 inch to minimize inductance.
  • The trace width of the power and ground connection to decoupling capacitors and components must be as wide as possible to minimize inductance.
  • Connecting decoupling capacitors to ground and power planes through multiple vias can reduce inductance and improve noise performance. Via sharing between components (discreet or integrated) is discouraged.
  • Decoupling performance can be improved by utilizing low ESR and low ESL capacitors.