ZHCSA88G August   2012  – August 2021 DLPR410

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Supply Voltage Requirements for Power-On Reset and Power-Down
    7. 6.7 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Data Interface
        1. 7.3.1.1 Data Outputs
        2. 7.3.1.2 Configuration Clock Input
        3. 7.3.1.3 Output Enable and Reset
        4. 7.3.1.4 Chip Enable
        5. 7.3.1.5 Configuration Pulse
        6. 7.3.1.6 Revision Selection
    4. 7.4 Device Functional Modes
      1.     
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Component Placement
      2. 10.1.2 Impedance Requirements
      3. 10.1.3 PCB Signal Routing
      4. 10.1.4 Fiducials
      5. 10.1.5 PCB Decoupling Guidelines
        1. 10.1.5.1 Bulk Decoupling
          1. 10.1.5.1.1 DLPR410 Decoupling Capacitors
      6. 10.1.6 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Compatibility
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (see (1) (2))
MINMAXUNIT
VCCINTInternal supply voltageRelative to ground–0.52.7V
VCCOI/O supply voltageRelative to ground–0.54.0V
VCCJ JTAG I/O supply voltage Relative to ground –0.5 4.0 V
VINInput voltage with respect to groundVCCO < 2.5 V–0.53.6V
VCCO ≥ 2.5 V–0.53.6V
VTSVoltage applied to high-impedance outputVCCO < 2.5 V–0.53.6V
VCCO ≥ 2.5 V–0.53.6V
TJJunction temperature125°C
TstgStorage temperature, ambient–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
(2) Maximum DC undershoot below GND must be limited to either 0.5 V or 10 mA. During transitions, the device pins can undershoot to –2 V or overshoot to 7 V, provided this overshoot or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.