over operating free-air temperature (unless otherwise noted) (see (1) (2)) | MIN | MAX | UNIT |
---|
VCCINT | Internal supply voltage | Relative to ground | –0.5 | 2.7 | V |
VCCO | I/O supply voltage | Relative to ground | –0.5 | 4.0 | V |
VCCJ |
JTAG I/O supply
voltage |
Relative to
ground |
–0.5 |
4.0 |
V |
VIN | Input voltage with respect to ground | VCCO < 2.5 V | –0.5 | 3.6 | V |
VCCO ≥ 2.5 V | –0.5 | 3.6 | V |
VTS | Voltage applied to high-impedance output | VCCO < 2.5 V | –0.5 | 3.6 | V |
VCCO ≥ 2.5 V | –0.5 | 3.6 | V |
TJ | Junction temperature | | 125 | °C |
Tstg | Storage temperature, ambient | –65 | 150 | °C |
(1) Stresses beyond those listed under
Absolute Maximum Ratings can cause
permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated
under
Section 6.3 is not implied. Exposure to absolute-maximum-rated conditions for
extended periods can affect device reliability.
(2) Maximum DC undershoot below GND must be limited to either 0.5 V or 10 mA. During transitions, the device pins can undershoot to –2 V or overshoot to 7 V, provided this overshoot or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.