DLPS074 February   2017 DLPC4422

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements
    7. 6.7  Test and Reset Timing Requirements
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  Port 1 Input Pixel Timing Requirements
    10. 6.10 Port 3 Input Pixel Interface (via GPIO) Timing Requirements
    11. 6.11 DMD LVDS Interface Timing Requirements
    12. 6.12 Synchronous Serial Port (SSP) Interface Timing Requirements
    13. 6.13 Programmable Output Clocks Switching Characteristics
    14. 6.14 Synchronous Serial Port Interface (SSP) Switching Characteristics
    15. 6.15 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Reset Operation
        1. 7.3.1.1 Power-up Reset Operation
        2. 7.3.1.2 System Reset Operation
      2. 7.3.2 Spread Spectrum Clock Generator Support
      3. 7.3.3 GPIO Interface
      4. 7.3.4 Source Input Blanking
      5. 7.3.5 Video Graphics Processing Delay
      6. 7.3.6 Program Memory Flash/SRAM Interface
      7. 7.3.7 Calibration and Debug Support
      8. 7.3.8 Board Level Test Support
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Regulations
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC4422 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.1-V System Power
      3. 9.4.3 1.8-V System Power
      4. 9.4.4 3.3-V System Power
      5. 9.4.5 Power Good (PWRGOOD) Support
      6. 9.4.6 5V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal ASIC Power
      2. 10.1.2 PCB Layout Guidelines for Auto-Lock Performance
      3. 10.1.3 DMD Interface Considerations
      4. 10.1.4 Layout Example
      5. 10.1.5 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Video Timing Parameter Definitions
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
        1. 11.1.3.1 Device Marking
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

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7.3.6 Program Memory Flash/SRAM Interface

The DLPC4422 controller provides three external program memory chip selects:

  • PM_CSZ_0 – available for optional SRAM or flash device (≤ 128 Mb)
  • PM_CSZ_1 – dedicated CS for boot flash device (ie. Standard NOR-type flash, ≤ 128 Mb)
  • PM_CSZ_2 – available for optional SRAM or flash device (≤ 128 Mb)

Flash and SRAM access timing is software programmable up to 31 wait states. Wait state resolution is 6.7 ns in normal mode and 53.33 ns in low power modes. Wait state program values for typical flash access times are shown in the Table 4.

Table 4. Wait State Program Values for Typical Flash Access Times

Normal Mode (1) Low Power Mode(1)
Formula to Calculate the Required Wait State Value = Roundup (Device_Access_Time / 6.7 ns) = Roundup (Device_Access_Time / 53.33 ns)
Max Supported Device Access Time 207 ns 1660 ns
(1) Assumes a maximum single direction trace length of 75 mm.

Note that when another device such as an SRAM or additional flash is used in conjunction with the boot flash, care must be taken to keep stub length short and located as close as possible to the flash end of the route.

The DLPC4422 controller provides enough Program Memory Address pins to support a flash or SRAM device up to 128 Mb. For systems not requiring this capacity, up to two address pins can be used as GPIO instead. Specifically, the two most significant address bits (i.e. PM_ADDR_22 and PM_ADDR_21) are shared on pins GPIO_36 and GPIO_35 respectively. Like other GPIO pins, these pins float in a high-impedance input state following reset; therefore, if these GPIO pins are to be reconfigured as Program Memory Address pins, they require board-level pull-down resistors to prevent any flash address bits from floating until software is able to reconfigure the pins from GPIO to Program Memory Address. Also note that until software reconfigures the pins from GPIO to Program Memory Address, upper portions of flash memory are not accessible.

Table 5 shows typical GPIO_35 and GPIO36 pin configuration for various flash sizes.

Table 5. Typical GPIO_35 and GPIO_36 Pin Configurations for Various Flash Sizes

FLASH SIZE GPIO_36 Pin Configuration GPIO_35 Pin Configuration
32 Mb or less GPIO_36 GPIO_35
64 Mb GPIO_36 PM_ADDR_21(1)
128 Mb PM_ADDR_22(1) PM_ADDR_21(1)
(1) Board-level pulldown resistor required.