11.1.3.1 Device Marking
Marking Definitions:
Line1: DLP Device Name followed by TI Part Number
Line2: Foundry part number
Line3:
- SSSSSSYYWWMMM-QQ Package Assembly information
- SSSSSS: Manufacturing Country
- YYWW: Date Code (YY =Year :: WW = Week)
- MMM: Manufacturing Site (HAL = Taiwan, HBL = Japan)
- QQ: Qualification level
Line4:
- LLLLLLL: Manufacturing Lot code
- e1: lead-free solder balls consisting of SnAgCu