ZHCSJA1G April   2010  – January 2019 DLP5500

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用原理图
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Window Characteristics
    12. 7.12 Chipset Component Usage Specification
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Video Modes
      2. 8.4.2 Structured Light Modes
        1. 8.4.2.1 Static Image Buffer Mode
        2. 8.4.2.2 Real Time Structured Light Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 8.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLP5500 System Interface
  10. 10Power Supply Recommendations
    1. 10.1 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件命名规则
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关文档
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZEW|780
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from F Revision (May 2015) to G Revision

Changes from E Revision (September 2013) to F Revision

  • Added ESD 额定值特性 说明 部分、器件功能模式应用和实施部分、电源相关建议部分、布局部分、器件和文档支持部分以及机械、封装和可订购信息部分Go
  • Changed Incorrect VCC2 value from 9V to 8VGo
  • Changed LVDS ƒclock to200 MHz - previously incorrectly listed as 150 MHzGo
  • Added Max Recommended DMD Temperature – Derating CurveGo
  • Added LVCMOS Output Measurement Condition FigureGo
  • Changed Incorrect tC value from 4 ns to 5 ns (200 MHz clock)Go
  • Changed Incorrect tW value from 1.25 ns to 2.5 ns (200 MHz clock)Go
  • Changed SCP Bus DiagramsGo
  • Added LVDS Voltage Definition FigureGo
  • Changed LVDS Waveform Requirements FigureGo
  • Added LVDS Equivalent Input Circuit FigureGo
  • Added LVDS & SCP Rise and Fall Time FiguresGo
  • Moved the Mechanical section from Recommended Operating Conditions table to the System Mounting Interface Loads section Go
  • Added Micromirror Array Physical Characteristics section Go
  • Changed Micromirror Array Physical Characteristics Figure to generic image (M x N)Go
  • Added Micromirror Array Optical Characteristics section Go
  • Changed specular reflectivity wavelength range to 420 - 700 nm (from 400 - 700 nm) to match Recommended Operating ConditionsGo
  • Changed Micromirror Landed Orientation and Tilt Figure to generic image (M x N)Go
  • Added Window Characteristics section Go
  • Added Chipset Component Usage Specification section Go
  • Changed Micromirror Array, Pitch, Hinge Axis Orientation Figure to generic image (M x N)Go
  • Changed Micromirror States: On, Off, Flat Figure to generic DMD imageGo
  • Changed Test Point locations from TC1 & TC2 to TP1 - TP5Go
  • Changed Test Point location Diagram to show TP1 - TP5Go
  • Added Micromirror Landed-on/Landed-Off Duty Cycle sectionGo
  • Changed Typical Application diagramGo
  • Replaced "DAD" with "DLPA200"Go

Changes from D Revision (October 2012) to E Revision

  • 删除了“器件型号命名规则”部分Go

Changes from C Revision (June 2012) to D Revision

  • 将器件型号命名规则从“DLP5500FYA”更改为“DLP5500AFYA”Go
  • 将“机械 ICD”更新至 V2,窗口高度略有更改Go

Changes from B Revision (Spetember 2011) to C Revision

  • 将“封装尺寸和插座”信息添加至 特性 列表Go
  • Deleted “说明”部分的 冗余信息Go
  • Changed the Illumination power density Max value of <420 mm From: 20 To: 2 mW/cm2Go
  • Changed Storage temperature range and humidity values in Absolute Maximum Ratings Go
  • Added Operating Case Temperature, Operating Humidity, Operating Device Temperature Gradient and Operating Landed Duty-Cycle to RECOMMENDED OPERATING CONDITIONS.Go
  • Added Mirror metal specular reflectivity and Illumination overfill values to "Micromirror Array Optical Characteristics" tableGo
  • Corrected the CL2W, Qarray and Tarray values in Micromirror Array Temperature Calculation for Uniform Illumination.Go
  • 更正了相关文档中的文献编号Go

Changes from A Revision (June 2010) to B Revision

  • Changed the window refractive index NOM spec From: 1.5090 To: 1.5119Go
  • Added table note "At a wavelength of 632.8 nm"Go

Changes from * Revision (April 2010) to A Revision

  • Changed VREF to VCC1Go
  • Added |VID| to the absolute max tableGo
  • Added VMBRST to the absolute max tableGo
  • Clarified Note6 measurement point Go
  • Changed the Illumination power density Max value of <420 mm From: 2 To: 20 mW/cm2Go
  • Added 更多相关文档Go