ZHCSNP3A September   2020  – April 2021 DLP5533A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5.     Illumination Overfill Diagram
    6. 6.5  Thermal Information
    7. 6.6  Electrical Characteristics
    8. 6.7  Timing Requirements
    9.     Electrical and Timing Diagrams
    10. 6.8  Switching Characteristics
    11.     LPSDR and Test Load Circuit Diagrams
    12. 6.9  System Mounting Interface Loads
    13.     System Interface Loads Diagram
    14. 6.10 Physical Characteristics of the Micromirror Array
    15.     Array Physical Characteristics Diagram
    16. 6.11 Micromirror Array Optical Characteristics
    17. 6.12 Window Characteristics
    18. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sub-LVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
        1. 7.3.5.1 Temperature Sense Diode Theory
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Temperature Rise Through the Package for Heatsink Design
      2. 7.6.2 Monitoring Array Temperature Using the Temperature Sense Diode
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 DMD Handling
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6.1 Temperature Rise Through the Package for Heatsink Design

When designing the DMD heatsink solution, the package thermal resistance from array to reference ceramic temperature (thermocouple location TP1 in Figure 7-4)  can be used to determine the temperature rise through the package as given by the following equations:

Equation 1. TARRAY-TO-CERAMIC = QARRAY × RARRAY–TO–CERAMIC
Equation 2. QILLUMINATION = (QINCIDENT × DMD Absorption Constant)
Equation 3. QARRAY = QELECTRICAL + QILLUMINATION

where

  • TARRAY-TO-CERAMIC = temperature rise from array to thermal test point TP1 (°C/W)
  • TCERAMIC = measured ceramic temperature, at the TP1 location in Figure 7-4 (°C)
  • RARRAY–TO–CERAMIC = DMD package thermal resistance from array to thermal test point TP1 (°C/W),
    see Section 6.5
  • QARRAY = total power, electrical plus absorbed, on the DMD array (W)
  • QELECTRICAL = nominal electrical power dissipation by the DMD (W)
  • QILLUMINATION = absorbed illumination heat load (W)
  • QINCIDENT = incident power on the DMD (W)

The DMD package thermal resistance from array to ceramic (RARRAY–TO–CERAMIC) assumes a non-uniform illumination distribution on the DMD as shown in Figure 7-5. For illumination profiles more uniform than the one highlighted in Figure 7-5, the value provided here is valid.  However, for more non-uniform profiles (e.g. Gaussian distribution) the thermal resistance will be higher. Please contact TI to determine an accurate value for this case.

GUID-B322717E-47DD-4A6A-944F-5671C088B1B0-low.pngFigure 7-5 Non-Uniform Illumination Profile

The DMD absorption constant is a function of illumination distribution on the active array and the array border, angle of incidence (AOI), f number of the system, and operating state of the mirrors. The absorption constant is higher in the OFF state than in the ON state. Equations to calculate the absorption constant are provided for both ON and OFF mirror states. They assume an AOI of 34 degrees, an f/1.7 system, and they account for the distribution of light on the active array, POM, and array border.

Equation 4. DMD Absorption Constant (OFF state) = 0.895 – 0.004783 × (% of light on ActiveArray + POM)
Equation 5. DMD Absorption Constant (ON state) = 0.895 – 0.007208 × (% of light on ActiveArray + POM)

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating frequencies.

The following sample calculations assume 10% of the total incident light falls outside of the active array and POM, and the mirrors are in the OFF state.

  1. DMD Absorption Constant = 0.895 – 0.004783 × 90 = 0.46
  2. QELECTRICAL = 0.4 W
  3. RARRAY–TO–CERAMIC = 1.3°C/W
  4. QINCIDENT = 10 W
  5. QARRAY = 0.4 W + (0.46 × 10 W) = 5 W
  6. TARRAY-TO-CERAMIC = 5 W × 1.3°C/W = 6.5°C