ZHCSIF9F March   2016  – May 2019 DLP5530-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      DLP5530-Q1 DLP芯片组系统方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions – Connector Pins
    2.     Pin Functions – Test Pads
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sub-LVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
        1. 7.3.5.1 Temperature Sense Diode Theory
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 DMD 处理
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • FYK|149
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Overview

The DLP5530-Q1 Automotive DMD consists of 1,327,104 highly reflective, digitally switchable, micrometer-sized mirrors organized in a two-dimensional array. As shown in Figure 15, the micromirror array consists of 1152 micromirror columns × 1152 micromirror rows in a diamond pixel configuration with a 2:1 aspect ratio.

Around the perimeter of the 1152 × 1152 array of micromirrors is a uniform band of border micromirrors called the Pond of Micromirrors (POM). The border micromirrors are not user-addressable. The border micromirrors land in the –12° position once power has been applied to the device. There are 10 border micromirrors on each side of the 1152 × 1152 active array.

Due to the diamond pixel configuration, the columns of each odd row are offset by half a pixel from the columns of the even row. Each mirror is switchable between two discrete angular positions: –12° and +12°. The mirrors are illuminated from the bottom which allows for compact and efficient system optical design.

Although the native resolution of the DLP5530-Q1 is 1152 × 1152, when paired with the DLPC230-Q1 controller, the DLP5530-Q1 can be driven with different resolutions to utilize the 2:1 aspect ratio. For example, Head-Up Display applications typically use a resolution of 1152 × 576. Please see the DLPC230-Q1 automotive DMD controller data sheet (DLPS054) for a list of supported resolutions. Diamond pixel arrays also have the capability to increase display resolution beyond native resolution. Future controllers or video formatters may take advantage of this enhanced resolution.

DLP5530-Q1 sec_7_micromirror_array.gifFigure 15. 0.55-in 1.3-MP Micromirror Array