ZHCSHX4B November   2017  – June 2019 DLP3030-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      DLPDLP3030-Q1 系统框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Optical Characteristics of the Micromirror Array
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 Active Array Temperature
      8. 7.3.8 DMD JTAG Interface
    4. 7.4 Optical Performance
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Quality Specification
    6. 7.6 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 HUD Reference Design and LED Controller Reference Design
    3. 8.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
    3. 10.3 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 器件处理
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (March 2018) to B Revision

  • Added illumination overfill maximum allowable heat load specifications, table notes, and figure in Recommended Operating ConditionsGo
  • Added calculation for array width and height with respect to number of active columns and rows in the Physical Characteristics of the Micromirror Array tableGo
  • Deleted axis-of-rotation specification from Optical Characteristics of the Micromirror Array table, as it was deemed unnecessary for customer designsGo
  • Deleted illumination overfill row and corresponding table note in the Window Characteristics tableGo
  • Changed description of illumination overfill in the Illumination Overfill and Alignment section and added reference to Recommended Operating Conditions overfill specificationGo
  • Added 器件处理 部分Go

Changes from * Revision (November 2017) to A Revision

  • Changed 将器件状态从高级信息 更改为生产数据Go
  • Changed 将封装标识符从 CPGA 更改为 FYJGo
  • Added comment to ground VCCH and VSSH pins Go
  • Changed maximum DMD storage temperature from 105°C to 125°C in Storage Conditions tableGo
  • Changed IOFFSET from 2.16 mA to 2.93 mA in Electrical Characteristics tableGo
  • Changed IRESET from 1.5 mA to -2.00 mA in Electrical Characteristics tableGo
  • Changed POFFSET from 13.2 mW to 25.64 mW in Electrical Characteristics tableGo
  • Changed PBIAS from 37.3 mW to 37.95 mW in Electrical Characteristics tableGo
  • Changed PRESET from 15.8 mW to 21.00 mW in Electrical Characteristics tableGo
  • Changed PTOTAL from 236.6 mW to 254.77 mW in Electrical Characteristics table Go
  • Added table note in Optical Parameters tableGo
  • Changed 更改了器件标记 部分中的器件标记编号Go