ZHCSHX4B November   2017  – June 2019 DLP3030-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      DLPDLP3030-Q1 系统框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Optical Characteristics of the Micromirror Array
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 Active Array Temperature
      8. 7.3.8 DMD JTAG Interface
    4. 7.4 Optical Performance
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Quality Specification
    6. 7.6 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 HUD Reference Design and LED Controller Reference Design
    3. 8.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
    3. 10.3 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
      2. 11.1.2 器件标记
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 器件处理
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)(3)
PARAMETER TEST CONDITIONS(2) MIN TYP MAX UNIT
VOH High level output voltage VCC = 2.25 V 1.7 V
IOH = –8 mA
VOH2 High level output voltage(7) VREF = 1.8 V 1.44 V
IOH = –2 mA
VOL Low level output voltage VCC = 2.75 V 0.4 V
IOL = 8 mA
VOL2 Low level output voltage(7) VREF = 1.8 V 0.36 V
IOL = 2 mA
IOZ Output high impedance current VREF = 1.95 V –10 µA
VOL = 0 V
VREF = 1.95 V 10
VOH = VREF
IIL Low level input current(4) VREF = 1.95 V –5 µA
VI = 0 V
IIH High level input current(4) VREF = 1.95 V 6 µA
VI = VREF
IIL2 Low level input current(5) VREF = 1.95 V –785 µA
VI = 0 V
IIH2 High level input current(5) VREF = 1.95 V 6 µA
VI = VREF
IIL3 Low level input current(6) VREF = 1.95 V –5 µA
VI = 0 V
IIH3 High level input current(6) VREF = 1.95 V 785 µA
VI = VREF
CURRENT
IREF Current at  VREF = 1.95 V fDCLK = 80 MHz 2.80 mA
Icc Current at  VCC = 2.75 V fDCLK = 80 MHz 59.90 mA
IOFFSET Current at  VOFFSET = 8.75 V 2.93 mA
IBIAS Current at  VBIAS = 16.5 V 2.30 mA
IRESET Current at  VRESET = –10.5 V –2.00 mA
POWER(1)
PREF Power at  VREF = 1.95 V fDCLK = 80 MHz 5.46 mW
PCC Power at  VCC = 2.75 V fDCLK = 80 MHz 164.73 mW
POFFSET Power at  VOFFSET = 8.75 V 25.64 mW
PBIAS Power at  VBIAS = 16.5 V 37.95 mW
PRESET Power at  VRESET = –10.5 V 21.00 mW
PTOTAL Total power at nominal conditions fDCLK = 80 MHz 105 254.77 mW
CAPACITANCE
CIN Input pin capacitance ƒ = 1 MHz 20 pF
CA Analog pin capacitance  (TEMP_PLUS and TEMP_MINUS pins) ƒ = 1 MHz 65 pF
Co Output pin capacitance ƒ = 1 MHz 20 pF
(1) The following power supplies are all required to operate the DMD: VDD, VDDI, VOFFSET, VBIAS, VRESET. All VSS connections are also required.
(2) All voltage values are with respect to the ground pins (VSS).
(3) Device electrical characteristics are over Recommended Operating Conditions unless otherwise noted.
(4) Specification is for LVCMOS input pins, which do not have pull up or pull down resistors. See Pin Configuration and Functions section.
(5) Specification is for LVCMOS input pins which do have pull up resistors (JTAG: TDI, TMS). See Pin Configuration and Functions section.
(6) Specification is for LVCMOS input pins which do have pull down resistors. See Pin Configuration and Functions section.
(7) Specification is for LVCMOS JTAG output pin TDO.