ZHCSIP9A
July 2018 – September 2018
DLP230KP
PRODUCTION DATA.
1
特性
2
显示 应用
3
说明
Device Images
简化应用
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions – Connector Pins
Pin Functions – Test Pads
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Switching Characteristics
6.9
System Mounting Interface Loads
6.10
Micromirror Array Physical Characteristics
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Low-Speed Interface
7.3.3
High-Speed Interface
7.3.4
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Numerical Aperture and Stray Light Control
7.5.2
Pupil Match
7.5.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
9.1
Power Supply Power-Up Procedure
9.2
Power Supply Power-Down Procedure
9.3
Power Supply Sequencing Requirements
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
器件支持
11.1.1
器件命名规则
11.1.2
器件标记
11.2
相关链接
11.3
社区资源
11.4
商标
11.5
静电放电警告
11.6
术语表
12
机械、封装和可订购信息
12.1
Package Option Addendum
12.1.1
Packaging Information
封装选项
机械数据 (封装 | 引脚)
FQP|54
MGCC003A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsip9a_oa
6.3
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.