ZHCSJN3B March   2019  – May 2022 DLP2000

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Physical Characteristics of the Micromirror Array
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Control Serial Interface
      3. 7.3.3 High Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
        1. 7.5.1.1 Numerical Aperture and Stray Light Control
        2. 7.5.1.2 Pupil Match
        3. 7.5.1.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 第三方产品免责声明
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Related Links
    4. 11.4 接收文档更新通知
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

DLP2000 数字微镜器件 (DMD) 是一款数控微光机电系统 (MOEMS) 空间照明调制器 (SLM)。当与适当的光学系统配合使用时，DLP2000 DMD 可显示非常清晰的高质量图像或视频。DLP2000 是 DLP2000 DMD 和 DLPC2607 显示控制器所组成的芯片组的一部分。DLPA1000 PMIC/LED 驱动器也支持此芯片组。DLP2000 紧凑的物理尺寸非常适合于注重小外形尺寸和低功耗的便携式设备。紧凑封装弥补了小尺寸 LED 的不足，从而可实现高效、可靠耐用的光引擎。

请访问 TI DLP® Pico™ 显示技术入门页，了解如何开始使用 DLP2000 DMD。

DLP2000 提供成的资源，可帮助用户加快设计周期。这些资源包括量产就绪型光学模块、光学模块制造商和设计公司。

器件信息(1)
器件型号 封装 封装尺寸（标称值）
DLP2000 FQC (42) 14.12mm × 4.97mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
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