ZHCSSP3B December   2022  – April 2024 CC2674R10

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy—Receive (RX)
    11. 7.11 Bluetooth Low Energy—Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Crystal Oscillator (XOSC_HF)
        2. 7.14.3.2 48MHz RC Oscillator (RCOSC_HF)
        3. 7.14.3.3 2MHz RC Oscillator (RCOSC_MF)
        4. 7.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 7.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
  11. 10Device and Documentation Support
    1. 10.1 Tools and Software
      1. 10.1.1 SimpleLink™ Microcontroller Platform
    2. 10.2 Documentation Support
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Signal Descriptions—RSK Package

Table 6-3 Signal Descriptions—RSK Package
PINI/OTYPEDESCRIPTION
NAMENO.
DCDC_SW47—PowerOutput from internal DC/DC converter(1)
DCOUPL31—PowerFor decoupling of internal 1.27V regulated digital-supply (2)
DIO_312I/ODigitalGPIO
DIO_413I/ODigitalGPIO
DIO_514I/ODigitalGPIO, high-drive capability
DIO_615I/ODigitalGPIO, high-drive capability
DIO_716I/ODigitalGPIO, high-drive capability
DIO_818I/ODigitalGPIO
DIO_919I/ODigitalGPIO
DIO_1020I/ODigitalGPIO
DIO_1121I/ODigitalGPIO
DIO_1226I/ODigitalGPIO
DIO_1327I/ODigitalGPIO
DIO_1428I/ODigitalGPIO
DIO_1529I/ODigitalGPIO
DIO_1634I/ODigitalGPIO, JTAG_TDO, high-drive capability
DIO_1735I/ODigitalGPIO, JTAG_TDI, high-drive capability
DIO_1836I/ODigitalGPIO
DIO_1937I/ODigitalGPIO
DIO_2038I/ODigitalGPIO
DIO_2139I/ODigitalGPIO
DIO_2240I/ODigitalGPIO
DIO_2350I/ODigital or AnalogGPIO, analog capability
DIO_2451I/ODigital or AnalogGPIO, analog capability
DIO_2552I/ODigital or AnalogGPIO, analog capability
DIO_2653I/ODigital or AnalogGPIO, analog capability
DIO_2754I/ODigital or AnalogGPIO, analog capability
DIO_2855I/ODigital or AnalogGPIO, analog capability
DIO_2956I/ODigital or AnalogGPIO, analog capability
DIO_3057I/ODigitalGPIO, analog capability
DIO_3410I/ODigitalGPIO
DIO_3511I/ODigitalGPIO
DIO_3622I/ODigitalGPIO
DIO_3723I/ODigitalGPIO
DIO_3824I/ODigitalGPIO
DIO_3925I/ODigitalGPIO
DIO_4041I/ODigitalGPIO
DIO_4142I/ODigitalGPIO
DIO_4243I/ODigitalGPIO
DIO_4344I/ODigitalGPIO
DIO_4445I/ODigitalGPIO
DIO_4546I/ODigitalGPIO
DIO_4658I/ODigitalGPIO
DIO_4759I/ODigitalGPIO
EGP——GNDGround—exposed ground pad(3)
JTAG_TMSC32I/ODigitalJTAG TMSC, high-drive capability
JTAG_TCKC33IDigitalJTAG TCKC
NC3——No Connect
NC4——No Connect
NC5——No Connect
NC6——No Connect
NC7——No Connect
RESET_N49IDigitalReset, active low. No internal pullup resistor
RF_P_2_4GHZ1—RFPositive 2.4GHz RF input signal to LNA during RX
Positive 2.4GHz RF output signal from PA during TX
RF_N_2_4GHZ2—RFNegative 2.4GHz RF input signal to LNA during RX
Negative 2.4GHz RF output signal from PA during TX
VDDR61—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(4)(6)
VDDR_RF64—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(5)(6)
VDDS60—Power1.8V to 3.8V main chip supply(1)
VDDS217—Power1.8V to 3.8V DIO supply(1)
VDDS330—Power1.8V to 3.8V DIO supply(1)
VDDS_DCDC48—Power1.8V to 3.8V DC/DC converter supply
X48M_N62—Analog48MHz crystal oscillator pin N
X48M_P63—Analog48MHz crystal oscillator pin P
X32K_Q18—Analog32kHz crystal oscillator pin 1
X32K_Q29—Analog32kHz crystal oscillator pin 2
(1) For more details, see technical reference manual listed in the documentation support section.
(2) Do not supply external circuitry from this pin.
(3) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is imperative for proper device operation.
(4) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.
(6) Output from internal DC/DC and LDO is trimmed to 1.68V.