ZHCSFW7 December   2016 CC2640R2F

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 功能框图
  2. 2修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - YFV (Chip Scale, DSBGA) Package
    6. 4.6 Signal Descriptions - YFV (Chip Scale, DSBGA) Package
    7. 4.7 Pin Diagram - RSM Package
    8. 4.8 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  125-kbps Coded (Bluetooth 5) - RX
    7. 5.7  125-kbps Coded (Bluetooth 5) - TX
    8. 5.8  500-kbps Coded (Bluetooth 5) - RX
    9. 5.9  500-kbps Coded (Bluetooth 5) - TX
    10. 5.10 1-Mbps GFSK (Bluetooth low energy) - RX
    11. 5.11 1-Mbps GFSK (Bluetooth low energy) - TX
    12. 5.12 2-Mbps GFSK (Bluetooth 5) - RX
    13. 5.13 2-Mbps GFSK (Bluetooth 5) - TX
    14. 5.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 5.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 5.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 5.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 5.18 ADC Characteristics
    19. 5.19 Temperature Sensor
    20. 5.20 Battery Monitor
    21. 5.21 Continuous Time Comparator
    22. 5.22 Low-Power Clocked Comparator
    23. 5.23 Programmable Current Source
    24. 5.24 Synchronous Serial Interface (SSI)
    25. 5.25 DC Characteristics
    26. 5.26 Thermal Resistance Characteristics
    27. 5.27 Timing Requirements
    28. 5.28 Switching Characteristics
    29. 5.29 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具与软件
    3. 8.3  文档支持
    4. 8.4  德州仪器 (TI) 低功耗射频网站
    5. 8.5  低功耗射频电子新闻简报
    6. 8.6  社区资源
    7. 8.7  其他信息
    8. 8.8  商标
    9. 8.9  静电放电警告
    10. 8.10 出口管制提示
    11. 8.11 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RGZ|48
  • RHB|32
  • YFV|34
散热焊盘机械数据 (封装 | 引脚)
订购信息

Device Comparison

Table 3-1 Device Family Overview

Device PHY Support Flash (KB) RAM (KB) GPIO Package(1)
CC2640R2Fxxx(2) Bluetooth low energy (Normal, High Speed, Long Range) 128 20 31, 15, 14, 10 RGZ, RHB, YFV, RSM
CC2640F128xxx Bluetooth low energy (Normal) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2650F128xxx Multi-Protocol(3) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2630F128xxx IEEE 802.15.4 (/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 10 RGZ, RSM
Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is
5-mm × 5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA.
CC2640R2Fxxx devices contain Bluetooth 4.2 low energy Host & Controller libraries in ROM, leaving more of the 128KB flash available for the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and flash by the protocol stack may vary depending on device software configuration. See www.ti.com and Table 3-2 for more details.
The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.

Table 3-2 Typical(1) Flash Memory Available for Customer Applications

Device Simple BLE Peripheral (BT 4.0)(2) Simple BLE Peripheral (BT 4.2)(2)(3)
CC2640R2Fxxx(4) 83 KB 80 KB
CC2640F128xxx, CC2650F128xxx 41 KB 31 KB
Actual use of ROM and flash by the protocol stack will vary depending on device software configuration. The values in this table are provided as guidance only.
Application example with two services (GAP and Simple Profile). Compiled using IAR.
BT4.2 configuration including Secure Pairing, Privacy 1.2, and Data Length Extension
BLE applications running on the CC2640R2F device make use of up to 115 KB of system ROM and up to 32 KB of RF Core ROM in order to minimize the flash usage. The maximum amount of nonvolatile memory available for BLE applications on CC2640R2F is thus 275 KB (128-KB flash + 147-KB ROM).

Related Products

    Wireless Connectivity
    The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable for a broad range of applications. The offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol).
    Sub-1 GHz
    Long-range, low-power wireless connectivity solutions are offered in a wide range of
    Sub-1 GHz ISM bands.
    Companion Products
    Review products that are frequently purchased or used in conjunction with this product.
    SimpleLink™ CC2640R2 Wireless MCU LaunchPad™ Development Kit
    The CC2640R2 LaunchPad ™ development kit brings easy Bluetooth® low energy (BLE) connection to the LaunchPad ecosystem with the SimpleLink ultra-low power CC26xx family of devices. Compared to the CC2650 LaunchPad, the CC2640R2 LaunchPad provides the following:

    • More free flash memory for the user application in the CC2640R2 wireless MCU
    • Out-of-the-box support for Bluetooth 4.2 specification
    • 4× faster Over-the-Air download speed compared to Bluetooth 4.1

    SimpleLink™ Bluetooth low energy/Multi-standard SensorTag
    The new SensorTag IoT kit invites you to realize your cloud-connected product idea. The new SensorTag now includes 10 low-power MEMS sensors in a tiny red package. And it is expandable with DevPacks to make it easy to add your own sensors or actuators.
    Reference Designs for CC2640
    TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download designs at ti.com/tidesigns.