ZHCSHB9E January   2018  – July 2019 CC1352R

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 Functional Block Diagram
  2. 2修订历史记录
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RGZ Package (Top View)
    2. 4.2 Signal Descriptions – RGZ Package
    3. 4.3 Connections for Unused Pins and Modules
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Supply and Modules
    5. 5.5  Power Consumption - Power Modes
    6. 5.6  Power Consumption - Radio Modes
    7. 5.7  Nonvolatile (Flash) Memory Characteristics
    8. 5.8  Thermal Resistance Characteristics
    9. 5.9  RF Frequency Bands
    10. 5.10 861 MHz to 1054 MHz - Receive (RX)
    11. 5.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 5.12 861 MHz to 1054 MHz - PLL Phase Noise
    13. 5.13 Bluetooth Low Energy - Receive (RX)
    14. 5.14 Bluetooth Low Energy - Transmit (TX)
    15. 5.15 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    16. 5.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    17. 5.17 Timing and Switching Characteristics
      1. Table 5-1 Reset Timing
      2. Table 5-2 Wakeup Timing
      3. 5.17.1    Clock Specifications
        1. Table 5-3 48 MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 48 MHz RC Oscillator (RCOSC_HF)
        3. Table 5-5 2 MHz RC Oscillator (RCOSC_MF)
        4. Table 5-6 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. Table 5-7 32 kHz RC Oscillator (RCOSC_LF)
      4. 5.17.2    Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
      5. 5.17.3    UART
        1. Table 5-9 UART Characteristics
    18. 5.18 Peripheral Characteristics
      1. 5.18.1 ADC
        1. Table 5-10 Analog-to-Digital Converter (ADC) Characteristics
      2. 5.18.2 DAC
        1. Table 5-11 Digital-to-Analog Converter (DAC) Characteristics
      3. 5.18.3 Temperature and Battery Monitor
        1. Table 5-12 Temperature Sensor
        2. Table 5-13 Battery Monitor
      4. 5.18.4 Comparators
        1. Table 5-14 Continuous Time Comparator
        2. Table 5-15 Low-Power Clocked Comparator
      5. 5.18.5 Current Source
        1. Table 5-16 Programmable Current Source
      6. 5.18.6 GPIO
        1. Table 5-17 GPIO DC Characteristics
    19. 5.19 Typical Characteristics
      1. 5.19.1 MCU Current
      2. 5.19.2 RX Current
      3. 5.19.3 TX Current
      4. 5.19.4 RX Performance
      5. 5.19.5 TX Performance
      6. 5.19.6 ADC Performance
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  System CPU
    3. 6.3  Radio (RF Core)
      1. 6.3.1 Proprietary Radio Formats
      2. 6.3.2 Bluetooth 5 low energy
      3. 6.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 6.4  Memory
    5. 6.5  Sensor Controller
    6. 6.6  Cryptography
    7. 6.7  Timers
    8. 6.8  Serial Peripherals and I/O
    9. 6.9  Battery and Temperature Monitor
    10. 6.10 µDMA
    11. 6.11 Debug
    12. 6.12 Power Management
    13. 6.13 Clock Systems
    14. 6.14 Network Processor
  7. 7Application, Implementation, and Layout
    1. 7.1 Reference Designs
  8. 8器件和文档支持
    1. 8.1 工具和软件
      1. 8.1.1 SimpleLink™ 微控制器平台
    2. 8.2 文档支持
    3. 8.3 Community Resources
    4. 8.4 商标
    5. 8.5 静电放电警告
    6. 8.6 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Consumption - Power Modes

When measured on the CC1352REM-XD7793-XD24 reference design with Tc = 25 °C, VDDS = 3.6 V with DC/DC enabled unless otherwise noted.
 
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption
Icore Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 nA
Shutdown. No clocks running, no retention 150
Standby
without cache retention
RTC running, CPU, 80KB RAM and (partial) register retention.
RCOSC_LF
0.85 µA
RTC running, CPU, 80KB RAM and (partial) register retention
XOSC_LF
0.99 µA
Standby
with cache retention
RTC running, CPU, 80KB RAM and (partial) register retention.
RCOSC_LF
2.78 µA
RTC running, CPU, 80KB RAM and (partial) register retention.
XOSC_LF
2.92 µA
Idle Supply Systems and RAM powered
RCOSC_HF
590 µA
Active MCU running CoreMark at 48 MHz
RCOSC_HF
2.89 mA
Peripheral Current Consumption
Iperi Peripheral power domain Delta current with domain enabled 82.3 µA
Serial power domain Delta current with domain enabled 5.5
RF Core Delta current with power domain enabled,
clock enabled, RF core idle
178.9
µDMA Delta current with clock enabled, module is idle 53.6
Timers Delta current with clock enabled, module is idle(3) 67.8
I2C Delta current with clock enabled, module is idle 8.2
I2S Delta current with clock enabled, module is idle 21.7
SSI Delta current with clock enabled, module is idle(2) 69.4
UART Delta current with clock enabled, module is idle(1) 140.8
CRYPTO (AES) Delta current with clock enabled, module is idle 21.1
PKA Delta current with clock enabled, module is idle 71.1
TRNG Delta current with clock enabled, module is idle 29.7
Sensor Controller Engine Consumption
ISCE Active mode 24 MHz, infinite loop, VDDS = 3.0 V 808.5 µA
Low-power mode 2 MHz, infinite loop, VDDS = 3.0 V 30.1
Only one UART running
Only one SSI running
Only one GPTimer running