ZHCSQ92B march   2022  – june 2023 AFE7903

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4说明（续）
  6. 5Revision History
  7. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Transmitter Electrical Characteristics
    6. 6.6  RF ADC Electrical Characteristics
    7. 6.7  PLL/VCO/Clock Electrical Characteristics
    8. 6.8  Digital Electrical Characteristics
    9. 6.9  Power Supply Electrical Characteristics
    10. 6.10 Timing Requirements
    11. 6.11 Switching Characteristics
    12. 6.12 Typical Characteristics
      1. 6.12.1  RX Typical Characteristics 30 MHz and 400 MHz
      2. 6.12.2  RX Typical Characteristics at 800 MHz
      3. 6.12.3  RX Typical Characteristics 1.75 GHz to 1.9 GHz
      4. 6.12.4  RX Typical Characteristics 2.6 GHz
      5. 6.12.5  RX Typical Characteristics 3.5 GHz
      6. 6.12.6  RX Typical Characteristics 4.9 GHz
      7. 6.12.7  RX Typical Characteristics 6.8 GHz
      8. 6.12.8  TX Typical Characteristics at 30 MHz and 600 MHz
      9. 6.12.9  TX Typical Characteristics at 800 MHz
      10. 6.12.10 TX Typical Characteristics at 1.8 GHz
      11. 6.12.11 TX Typical Characteristics at 2.6 GHz
      12. 6.12.12 TX Typical Characteristics at 3.5 GHz
      13. 6.12.13 TX Typical Characteristics at 4.9 GHz
      14. 6.12.14 TX Typical Characteristics at 7.1 GHz
      15. 6.12.15 PLL and Clock Typical Characteristics
  8. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3. 7.3 Trademarks
    4. 7.4 静电放电警告
    5. 7.5 术语表
  9. 9Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

6.4 Thermal Information

THERMAL METRIC(1) 17x17mm FC-BGA UNIT
400 PINS
RθJA Junction-to-ambient thermal resistance 16.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.42 °C/W
RθJB Junction-to-board thermal resistance 4.85 °C/W
ΨJT Junction-to-top characterization parameter 0.12 °C/W
ΨJB Junction-to-board characterization parameter 4.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.