ZHCSR89A December   2022  – August 2023 ADS131B23

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Offset Drift Measurement
    2. 7.2 Gain Drift Measurement
    3. 7.3 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Naming Conventions
      2. 8.3.2 Precision Voltage References (REFA, REFB)
      3. 8.3.3 Clocking (MCLK, OSCM, OSCD)
      4. 8.3.4 ADC1y
        1. 8.3.4.1 ADC1y Input Multiplexer
        2. 8.3.4.2 ADC1y Programmable Gain Amplifier (PGA)
        3. 8.3.4.3 ADC1y ΔΣ Modulator
        4. 8.3.4.4 ADC1y Digital Filter
        5. 8.3.4.5 ADC1y Offset and Gain Calibration
        6. 8.3.4.6 ADC1y Conversion Data
      5. 8.3.5 ADC2y
        1. 8.3.5.1 ADC2y Input Multiplexer
        2. 8.3.5.2 ADC2y Programmable Gain Amplifier (PGA)
        3. 8.3.5.3 ADC2y ΔΣ Modulator
        4. 8.3.5.4 ADC2y Digital Filter
        5. 8.3.5.5 ADC2y Offset and Gain Calibration
        6. 8.3.5.6 ADC2y Sequencer
        7. 8.3.5.7 VCMy Buffers
        8. 8.3.5.8 ADC2y Measurement Configurations
        9. 8.3.5.9 ADC2y Conversion Data
      6. 8.3.6 General-Purpose Digital Inputs and Outputs (GPIO0 to GPIO4)
        1. 8.3.6.1 GPIOx PWM Output Configuration
        2. 8.3.6.2 GPIOx PWM Input Readback
      7. 8.3.7 General-Purpose Digital Inputs and Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B)
      8. 8.3.8 Monitors and Diagnostics
        1. 8.3.8.1  Supply Monitors
        2. 8.3.8.2  Clock Monitors
        3. 8.3.8.3  Digital Monitors
          1. 8.3.8.3.1 Register Map CRC
          2. 8.3.8.3.2 Memory Map CRC
          3. 8.3.8.3.3 GPIO Readback
        4. 8.3.8.4  Communication Monitors
        5. 8.3.8.5  Fault Flags and Fault Masking
        6. 8.3.8.6  FAULT Pin
        7. 8.3.8.7  Diagnostics and Diagnostic Procedure
        8. 8.3.8.8  Indicators
        9. 8.3.8.9  Conversion and Sequence Counters
        10. 8.3.8.10 Supply Voltage Readback
        11. 8.3.8.11 Temperature Sensor (TSA)
        12. 8.3.8.12 Test DACs (TDACA, TDACB)
        13. 8.3.8.13 Open-Wire Detection
        14. 8.3.8.14 Missing Host Detection and MHD Pin
        15. 8.3.8.15 Overcurrent Comparators (OCCA, OCCB)
          1. 8.3.8.15.1 OCCA and OCCB Pins
          2. 8.3.8.15.2 Overcurrent Indication Response Time
    4. 8.4 器件功能模式
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset (POR)
        2. 8.4.1.2 RESETn Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Active Mode
        2. 8.4.2.2 Standby Mode
        3. 8.4.2.3 Power-Down Mode
      3. 8.4.3 ADC Conversion Modes
        1. 8.4.3.1 ADC1y Conversion Modes
          1. 8.4.3.1.1 Continuous-Conversion Mode
          2. 8.4.3.1.2 Single-Shot Conversion Mode
          3. 8.4.3.1.3 Global-Chop Mode
            1. 8.4.3.1.3.1 Overcurrent Indication Response Time in Global-Chop Mode
        2. 8.4.3.2 ADC2y Sequencer Operation and Sequence Modes
          1. 8.4.3.2.1 Continuous Sequence Mode
          2. 8.4.3.2.2 Single-Shot Sequence Mode
          3. 8.4.3.2.3 Synchronized Single-Shot Sequence Mode Based on ADC1y Conversion Starts
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Serial Interface Signals
          1. 8.5.1.1.1 Chip Select (CSn)
          2. 8.5.1.1.2 Serial Data Clock (SCLK)
          3. 8.5.1.1.3 Serial Data Input (SDI)
          4. 8.5.1.1.4 Serial Data Output (SDO)
          5. 8.5.1.1.5 Data Ready (DRDYn)
        2. 8.5.1.2 Serial Interface Communication Structure
          1. 8.5.1.2.1 SPI Communication Frames
          2. 8.5.1.2.2 SPI Communication Words
          3. 8.5.1.2.3 STATUS Word
          4. 8.5.1.2.4 Communication Cyclic Redundancy Check (CRC)
          5. 8.5.1.2.5 Commands
            1. 8.5.1.2.5.1 NULL (0000 0000 0000 0000b)
            2. 8.5.1.2.5.2 RESET (0000 0000 0001 0001b)
            3. 8.5.1.2.5.3 LOCK (0000 0101 0101 0101b)
            4. 8.5.1.2.5.4 UNLOCK (0000 0110 0101 0101b)
            5. 8.5.1.2.5.5 WREG (011a aaaa aaa0 0nnnb)
            6. 8.5.1.2.5.6 RREG (101a aaaa aaan nnnnb)
          6. 8.5.1.2.6 SCLK Counter
          7. 8.5.1.2.7 SPI Timeout
          8. 8.5.1.2.8 Reading ADC1A, ADC1B, and ADC2A Conversion Data
          9. 8.5.1.2.9 DRDYn Pin Behavior
    6. 8.6 Register Map
      1. 8.6.1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unused Inputs and Outputs
      2. 9.1.2 Minimum Interface Connections
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current-Shunt Measurement
        2. 9.2.2.2 Battery-Pack Voltage Measurement
        3. 9.2.2.3 Shunt Temperature Measurement
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Supply Options
        1. 9.3.1.1 Single Unregulated External 4-V to 16-V Supply (3.3-V Digital I/O Levels)
        2. 9.3.1.2 Single Regulated External 3.3-V Supply (3.3-V Digital IO Levels)
        3. 9.3.1.3 Single Regulated External 5-V Supply (5-V Digital I/O Levels)
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10器件和文档支持
    1. 10.1 文档支持
      1. 10.1.1 相关文档
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 商标
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from December 23, 2022 to August 21, 2023 (from Revision * (December 2022) to Revision A (August 2023))

  • 更改了文档标题Go
  • 将特性 部分中的 ADC1y 增益漂移 规格从 25ppm/°C 更改为 20ppm/°C Go
  • 更改了说明 部分的第一段Go
  • 将英文版中封装信息 表中的 Body Size 更改为 Package Size Go
  • 更改了说明 部分中的系统方框图 Go
  • Changed description of IOVDD pin in Pin Functions tableGo
  • Changed AVDD to AGND maximum specification in Absolute Maximum Ratings table.  Go
  • Changed ADC1y gain drift typical and maximum specifications in Electrical Characteristics table.Go
  • Changed ADC1y gain match minimum, typical, and maximum specifications in Electrical Characteristics table.Go
  • Changed ADC2A gain drift typical and maximum specifications in Electrical Characteristics table.Go
  • Changed REFy temperature drift typical and maximum specifications in Electrical Characteristics table.Go
  • Changed TDACy drift, negative output voltages maximum specification in Electrical Characteristics table.Go
  • Added Digital Inputs/Outputs (GPIO0A, GPIO1A, GPIO0B, GPIO1B) input current specification to Electrical Characteristics table.Go
  • Removed ADC1y_OR_TH and  ADC2y_OR_TH specifications from Electrical Characteristics table.Go
  • Added tp(AVDD_POR) , tp(IOVDD_POR) , and tp(DVDD_POR)  specifications to Electrical Characteristics table.Go
  • Changed APWR supply current in active mode, all ADCs disabled typical specification in Electrical Characteristics table.Go
  • Changed APWR supply current per individual ADC for ADC1y typical specification in Electrical Characteristics table.Go
  • Changed ADC1y Gain Error vs Temperature, ADC2A Gain Error vs Temperature, REFy Output Voltage vs Temperature, and OCCy Gain Error vs Temperature curves in Typical Characteristics sectionGo
  • Added Analog GPIO Pin Output Voltage vs Sinking Current, Analog GPIO Pin Output Voltage vs Sourcing Current, Digital Pin Output Voltage vs Sinking Current, Digital Pin Output Voltage vs Sourcing Current, and Supply Current vs Supply Voltage curves to Typical Characteristics sectionGo
  • Removed ADC overrange monitors from bulleted list and changed first paragraph of Overview sectionGo
  • Deleted ADC Monitors and Diagnostics section from Monitor and Diagnostic Overview table in Monitors and Diagnostics sectionGo
  • Changed register name from ADC_STATUS to CLOCK_STATUS in Monitor and Diagnostic Overview table in Monitors and Diagnostics sectionGo
  • Deleted ADC Monitors sectionGo
  • Deleted all occurrences of ADC fault flags from Fault Flags and Fault Masking sectionGo
  • Changed register names ADC_FAULTn to CLOCK_FAULTn, ADC_STATUS to CLOCK_STATUS, and ADC_FAULT_MASK to CLOCK_FAULT_MASK in Fault Flags and Fault Masking sectionGo
  • Changed equation in Temperature Sensor (TSA) sectionGo
  • Moved Missing Host Detection and MHD Pin sectionGo
  • Changed discussion of POR process in Power-On Reset (POR) section.Go
  • Changed Overcurrent Indication Response Time in Global-Chop Mode sectionGo
  • Changed bit name ADC_FAULTn to CLOCK_FAULTn in the STATUS_MSB register and changed all information in the ADC_FAULTn bit field from ADC fault to clock fault Go
  • Changed register name ADC_STATUS to CLOCK_STATUS and changed all ADCxy_ORn bits in the ADC_STATUS register to RO RESERVED bits.Go
  • Changed register name ADC_MONITOR_CFG to CLOCK_MONITOR_CFG and changed all ADCxy_OR_EN bits in the ADC_MONITOR_CFG register to RW RESERVED bits.Go
  • Changed register name ADC_MONITOR_DIAGNOSTIC_CFG to CLOCK_MONITOR_DIAGNOSTIC_CFG.Go
  • Changed register name ADC_FAULT_MASK to CLOCK_FAULT_MASK and changed all ADCxy_OR_MASK bits in the ADC_FAULT_MASK register to RW RESERVED bits.Go
  • Changed bit name ADC_FAULT_MASK to CLOCK_FAULT_MASK in the FAULT_PIN_MASK register and changed all information in the ADC_FAULT_MASK bit field from ADC fault to clock fault.Go
  • Changed reset values of SCLK_COUNTER_EN and TIMEOUT_EN bits from 1b to 0b in the DEVICE_MONITOR_CFG registerGo
  • Changed reset values of AVDD_OV_EN, AVDD_UV_EN, IOVDD_OV_EN, IOVDD_UV_EN, DVDD_OV_EN, DVDD_UV_EN, AVDD_OSC_EN, IOVDD_OSC_EN, DVDD_OSC_EN, AVDD_OTW_EN, IOVDD_OTW_EN, AVDD_CL_EN, IOVDD_CL_EN, AGNDA_DISC_EN, AGNDB_DISC_EN, and DGND_DISC_EN bits from 1b to 0b in the SUPPLY_MONITOR_CFG1 registerGo
  • Changed reset values of MCLK_MON_EN, OSCD_WD_EN, and MCLK_WD_EN bits from 1b to 0b in the ADC_MONITOR_CFG registerGo
  • Changed RESETn pin bullet in Unused Inputs and Outputs sectionGo
  • Changed Gain Error vs Temperature (ADC1A, ADC1B) figure in Application Curves sectionGo