SLOS708G April   2012  – December 2017 TPA3116D2 , TPA3118D2 , TPA3130D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Gain Setting and Master and Slave
      2. 7.3.2  Input Impedance
      3. 7.3.3  Startup and Shutdown Operation
      4. 7.3.4  PLIMIT Operation
      5. 7.3.5  GVDD Supply
      6. 7.3.6  BSPx AND BSNx Capacitors
      7. 7.3.7  Differential Inputs
      8. 7.3.8  Device Protection System
      9. 7.3.9  DC Detect Protection
      10. 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
      11. 7.3.11 Thermal Protection
      12. 7.3.12 Device Modulation Scheme
        1. 7.3.12.1 MODSEL = GND: BD-Modulation
        2. 7.3.12.2 MODSEL = HIGH: 1SPW-modulation
      13. 7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
      14. 7.3.14 Ferrite Bead Filter Considerations
      15. 7.3.15 When to Use an Output Filter for EMI Suppression
      16. 7.3.16 AM Avoidance EMI Reduction
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mono Mode (PBTL)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the PWM Frequency
        2. 8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
        3. 8.2.2.3 Select Input Capacitance
        4. 8.2.2.4 Select Decoupling Capacitors
        5. 8.2.2.5 Select Bootstrap Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heat Sink Used on the EVM
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Supports Multiple Output Configurations
    • 2 × 50 W Into a 4-Ω BTL Load at 21 V (TPA3116D2)
    • 2 × 30 W Into a 8-Ω BTL Load at 24 V (TPA3118D2)
    • 2 × 15 W Into a 8-Ω BTL Load at 15 V (TPA3130D2)
  • Wide Voltage Range: 4.5 V to 26 V
  • Efficient Class-D Operation
    • >90% Power Efficiency Combined With Low Idle Loss Greatly Reduces Heat Sink Size
    • Advanced Modulation Schemes
  • Multiple Switching Frequencies
    • AM Avoidance
    • Master and Slave Synchronization
    • Up to 1.2-MHz Switching Frequency
  • Feedback Power-Stage Architecture With High PSRR Reduces PSU Requirements
  • Programmable Power Limit
  • Differential and Single-Ended Inputs
  • Stereo and Mono Mode With Single-Filter Mono Configuration
  • Single Power Supply Reduces Component Count
  • Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, DC-Detect, and Short Circuit With Error Reporting
  • Thermally Enhanced Packages
    • DAD (32-Pin HTSSOP Pad Up)
    • DAP (32-Pin HTSSOP Pad Down)
  • –40°C to 85°C Ambient Temperature Range

2 Applications

  • Mini-Micro Component, Speaker Bar, Docks
  • After-Market Automotive
  • CRT TV
  • Consumer Audio Applications

3 Description

The TPA31xxD2 series are stereo efficient, digital amplifier power stage for driving speakers up to 100 W / 2 Ω in mono. The high efficiency of the TPA3130D2 allows it to do 2 × 15 W without external heat sink on a single layer PCB. The TPA3118D2 can even run 2 × 30 W / 8 Ω without heat sink on a dual layer PCB. If even higher power is needed the TPA3116D2 does 2 × 50 W / 4 Ω with a small heat-sink attached to its top side PowerPAD. All three devices share the same footprint enabling a single PCB to be used across different power levels.

The TPA31xxD2 advanced oscillator/PLL circuit employs a multiple switching frequency option to avoid AM interferences; this is achieved together with an option of either master or slave option, making it possible to synchronize multiple devices.

The TPA31xxD2 devices are fully protected against faults with short-circuit protection and thermal protection as well as overvoltage, undervoltage, and DC protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPA3116D2 DAD (32) 11.00 mm × 6.20 mm
TPA3118D2
TPA3130D2		 DAP (32) 11.00 mm × 6.20 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Application Circuit

TPA3116D2 TPA3118D2 TPA3130D2 app_cir_los708.gif