SBOS932B February   2020  – October 2020 THP210

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Characterization Configuration
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Super-Beta Input Bipolar Transistors
      2. 8.3.2 Power Down
      3. 8.3.3 Flexible Gain Setting
      4. 8.3.4 Amplifier Overload Power Limit
      5. 8.3.5 Unity Gain Stability
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 I/O Headroom Considerations
      2. 9.1.2 DC Precision Analysis
        1. 9.1.2.1 DC Error Voltage at Room Temperature
        2. 9.1.2.2 DC Error Voltage Over Temperature
      3. 9.1.3 Noise Analysis
      4. 9.1.4 Mismatch of External Feedback Network
      5. 9.1.5 Operating the Power-Down Feature
      6. 9.1.6 Driving Capacitive Loads
      7. 9.1.7 Driving Differential ADCs
        1. 9.1.7.1 RC Filter Selection (Charge Kickback Filter)
        2. 9.1.7.2 Settling Time Driving the ADC Sample-and-Hold Operating Behavior
        3. 9.1.7.3 THD Performance
    2. 9.2 Typical Applications
      1. 9.2.1 MFB Filter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 ADS891x With Single-Ended RC Filter Stage
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 Measurement Results
      3. 9.2.3 Attenuation Configuration Drives the ADS8912B
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Measurement Results
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Layout Recommendations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Input offset voltage: ±40 µV (maximum)
  • Input offset voltage drift: 0.35 µV/°C (maximum)
  • Low supply current: 950 µA at ±18 V
  • Low input bias current: 2 nA (maximum)
  • Low input bias current drift: 15 pA/°C (maximum)
  • Gain-bandwidth product: 9.2 MHz
  • Differential output slew rate: 15 V/µs
  • Low input voltage noise: 3.7 nV/√ Hz at 1 kHz
  • Low THD + N: –120 dB at 10 kHz
  • Wide input and output common-mode range
  • Wide single-supply operating range: 3 V to 36 V
  • Low supply current power-down feature: < 20 µA
  • Overload power limit
  • Current limit
  • Package: 8-pin VSSOP, 8-pin SOIC
  • Temperature range: –40°C to +125°C