SLDS231 August   2018 PGA305

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      PAG305 Simplified Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics – Reverse Voltage Protection
    6. 6.6  Electrical Characteristics – Regulators
    7. 6.7  Electrical Characteristics – Internal Reference
    8. 6.8  Electrical Characteristics – Bridge Sensor Supply
    9. 6.9  Electrical Characteristics – Temperature Sensor Supply
    10. 6.10 Electrical Characteristics – Internal Temperature Sensor
    11. 6.11 Electrical Characteristics – P Gain (Chopper Stabilized)
    12. 6.12 Electrical Characteristics – P Analog-to-Digital Converter
    13. 6.13 Electrical Characteristics – T Gain (Chopper Stabilized)
    14. 6.14 Electrical Characteristics – T Analog-to-Digital Converter
    15. 6.15 Electrical Characteristics – One-Wire Interface
    16. 6.16 I2C Interface
    17. 6.17 Electrical Characteristics – DAC Output
    18. 6.18 Electrical Characteristics – DAC Gain
    19. 6.19 Electrical Characteristics – Non-Volatile Memory
    20. 6.20 Electrical Characteristics – Diagnostics
    21. 6.21 Operating Characteristics
    22. 6.22 I2C Interface Timing Requirements
    23. 6.23 Timing Diagram
    24. 6.24 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reverse-Voltage Protection Block
      2. 7.3.2  Linear Regulators
      3. 7.3.3  Internal Reference
        1. 7.3.3.1 High-Voltage Reference
        2. 7.3.3.2 Accurate Reference
      4. 7.3.4  BRG+ to BRG– Supply for the Resistive Bridge
      5. 7.3.5  ITEMP Supply for the Temperature Sensor
      6. 7.3.6  Internal Temperature Sensor
      7. 7.3.7  P Gain
      8. 7.3.8  P Analog-to-Digital Converter
        1. 7.3.8.1 P Sigma-Delta Modulator for P ADC
        2. 7.3.8.2 P Decimation Filter for P ADC
      9. 7.3.9  T Gain
      10. 7.3.10 T Analog-to-Digital Converter
        1. 7.3.10.1 T Sigma-Delta Modulator for T ADC
        2. 7.3.10.2 T Decimation Filters for T ADC
      11. 7.3.11 P GAIN and T GAIN Calibration
      12. 7.3.12 One-Wire Interface (OWI)
        1. 7.3.12.1 Overview of OWI
        2. 7.3.12.2 Activating and Deactivating the OWI Interface
          1. 7.3.12.2.1 Activating OWI Communication
          2. 7.3.12.2.2 Deactivating OWI Communication
        3. 7.3.12.3 OWI Protocol
          1. 7.3.12.3.1 OWI Frame Structure
            1. 7.3.12.3.1.1 Standard Field Structure
            2. 7.3.12.3.1.2 Frame Structure
            3. 7.3.12.3.1.3 Sync Field
            4. 7.3.12.3.1.4 Command Field
            5. 7.3.12.3.1.5 Data Fields
          2. 7.3.12.3.2 OWI Commands
            1. 7.3.12.3.2.1 OWI Write Command
            2. 7.3.12.3.2.2 OWI Read Initialization Command
            3. 7.3.12.3.2.3 OWI Read-Response Command
            4. 7.3.12.3.2.4 OWI Burst-Write Command (EEPROM Cache Access)
            5. 7.3.12.3.2.5 OWI Burst Read Command (EEPROM Cache Access)
          3. 7.3.12.3.3 OWI Operations
            1. 7.3.12.3.3.1 Write Operation
            2. 7.3.12.3.3.2 Read Operation
            3. 7.3.12.3.3.3 EEPROM Burst Write
            4. 7.3.12.3.3.4 EEPROM Burst Read
        4. 7.3.12.4 OWI Communication-Error Status
      13. 7.3.13 I2C Interface
        1. 7.3.13.1 Overview of I2C Interface
        2. 7.3.13.2 Clocking Details of I2C Interface
        3. 7.3.13.3 I2C Interface Protocol
        4. 7.3.13.4 PGA305 I2C Runtime Commands
        5. 7.3.13.5 PGA305 I2C Transfer Example
      14. 7.3.14 DAC Output
        1. 7.3.14.1 Ratiometric vs Absolute
      15. 7.3.15 DAC Gain
      16. 7.3.16 Memory
        1. 7.3.16.1 EEPROM Memory
          1. 7.3.16.1.1 EEPROM Cache
          2. 7.3.16.1.2 EEPROM Programming Procedure
          3. 7.3.16.1.3 EEPROM Programming Current
          4. 7.3.16.1.4 CRC
        2. 7.3.16.2 Control and Status Registers Memory
      17. 7.3.17 Diagnostics
        1. 7.3.17.1 Power Supply Diagnostics
        2. 7.3.17.2 Signal Chain Faults
          1. 7.3.17.2.1 P Gain and T Gain Input Faults
          2. 7.3.17.2.2 P Gain and T Gain Output Diagnostics
          3. 7.3.17.2.3 Masking Signal Chain Faults
          4. 7.3.17.2.4 Fault Detection Timing
      18. 7.3.18 Reading Diagnostics Information Through I2C
      19. 7.3.19 Digital Compensation and Filter
        1. 7.3.19.1 Digital Gain and Offset
        2. 7.3.19.2 TC and NL Correction
          1. 7.3.19.2.1 TC and NL Coefficients
            1. 7.3.19.2.1.1 No TC and NL Coefficients
          2. 7.3.19.2.2 TC Compensation Using the Internal Temperature Sensor
        3. 7.3.19.3 Clamping
        4. 7.3.19.4 Filter
      20. 7.3.20 Filter Coefficients
        1. 7.3.20.1 No Filtering
        2. 7.3.20.2 Filter Coefficients for P ADC Sampling Rate = 1024 µs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Mode
      2. 7.4.2 Current Mode
    5. 7.5 Register Maps
      1. 7.5.1 Register Settings
      2. 7.5.2 Control and Status Registers
        1. 7.5.2.1  Digital Interface Control (M0 Address = 0x40000506) (DI Page Address = 0x2) (DI Page Offset = 0x06)
        2. 7.5.2.2  DAC_CTRL_STATUS (M0 Address: 0x40000538) (DI Page Address: 0x2) (DI Page Offset: 0x38)
        3. 7.5.2.3  DAC_CONFIG (EEPROM Address = 0x40000032) (DI Page Address: 0x2) (DI Page Offset: 0x39)
        4. 7.5.2.4  OP_STAGE_CTRL (EEPROM Address = 0x40000033) (DI Page Address: 0x2) (DI Page Offset: 0x3B)
        5. 7.5.2.5  BRDG_CTRL (EEPROM Address = 0x40000034) (DI Page Address: 0x2) (DI Page Offset: 0x46)
        6. 7.5.2.6  P_GAIN_SELECT (EEPROM Address = 0x40000035) (DI Page Address: 0x2) (DI Page Offset: 0x47)
        7. 7.5.2.7  T_GAIN_SELECT (EEPROM Address = 0x40000036) (DI Page Address: 0x2) (DI Page Offset: 0x48)
        8. 7.5.2.8  TEMP_CTRL (EEPROM Address = 0x40000037) (DI Page Address: 0x2) (DI Page Offset: 0x4C)
        9. 7.5.2.9  TEMP_SE (EEPROM Address = 0x4000003A)
        10. 7.5.2.10 DIAG_ENABLE (EEPROM Address = 0x40000056)
        11. 7.5.2.11 EEPROM_LOCK (EEPROM Address = 0x40000057)
        12. 7.5.2.12 AFEDIAG_CFG (EEPROM Address = 0x40000058)
        13. 7.5.2.13 AFEDIAG_MASK (EEPROM Address = 0x40000059)
        14. 7.5.2.14 ADC_24BIT_ENABLE (EEPROM Address = 0x40000068)
        15. 7.5.2.15 OFFSET_ENABLE (EEPROM Address = 0x40000069)
        16. 7.5.2.16 COMPENSATION_CONTROL (EEPROM Address = N/A) (DI Page Address: 0x0) (DI Page Offset: 0x0C)
        17. 7.5.2.17 EEPROM_PAGE_ADDRESS (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x88)
        18. 7.5.2.18 EEPROM_CTRL (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x89)
        19. 7.5.2.19 EEPROM_CRC (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x8A)
        20. 7.5.2.20 EEPROM_STATUS (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x8B)
        21. 7.5.2.21 EEPROM_CRC_STATUS (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x8C)
        22. 7.5.2.22 EEPROM_CRC_VALUE (EEPROM Address = 0x4000007F) (DI Page Address: 0x5) (DI Page Offset: 0x8D)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 4-mA to 20-mA Output With Internal Sense Resistor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calibration Tips
            1. 8.2.1.2.1.1 Programming the EEPROM for 4-mA to 20-mA Output
        3. 8.2.1.3 Application Curve
      2. 8.2.2 0- to 10-V Absolute Output With Internal Drive
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 0- to 5-V Ratiometric Output With Internal Drive
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Programmer Tips
            1. 8.2.3.2.1.1 Resetting the Microprocessor and Enable Digital Interface
            2. 8.2.3.2.1.2 Turning On the Accurate Reference Buffer (REFCAP Voltage)
            3. 8.2.3.2.1.3 Turning On DAC and DAC GAIN
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Analog Features
    • Analog Front-End for Resistive Bridge Sensors
    • Accommodates Sensor Sensitivities From 1 mV/V to 135 mV/V
    • On-Chip Temperature Sensor
    • Programmable Gain
    • 24-Bit Sigma-Delta Analog-to-Digital Converter for Signal Channel
    • 24-Bit Sigma-Delta Analog-to-Digital Converter for Temperature Channel
    • 14-Bit Output DAC
  • Digital Features
    • < 0.1% FSO Accuracy Across Temperature
    • System Response Time < 220 µs
    • Third-Order Offset, Gain, and Nonlinearity Temperature Compensation
    • Diagnostic Functions
    • Integrated EEPROM for Device Operation, Calibration Data and User Data
  • Peripheral Features
    • I2C interface for Data Reading and Device Configuration
    • One-Wire Interface Enables Communication Through the Power Supply Pin Without Using Additional Lines
    • 4-mA to 20-mA Current Loop Interface
    • Ratiometric and Absolute Voltage Output
    • Power Management Control
    • Analog Low-Voltage Detect
  • General Features
    • Industrial Temperature Range: –40°C to 150°C
    • Power Supply:
      • On-Chip Power Management Accepts Wide Power-Supply Voltage From 3.3 V to 30 V
      • Integrated Reverse-Protection Circuit