SLLSEP3F November   2016  – April 2023 ISO7720 , ISO7721

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 100 Mbps data rate
  • Robust isolation barrier:
    • >100-Year projected lifetime at 1.5 kVRMS working voltage
    • Up to 5000 VRMS Isolation Rating
    • Up to 12.8 kV surge capability
    • ±100 kV/μs Typical CMTI
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V level translation
  • Default output High (ISO772x) and Low (ISO772xF) Options
  • Wide temperature range: –55°C to +125°C
  • Low power consumption, typical 1.7 mA per channel at 1 Mbps
  • Low propagation delay: 11 ns typical
  • Robust electromagnetic compatibility (EMC)
    • System-Level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16, DWV-8) and Narrow-SOIC (D-8) package options
  • Automotive Version Available: ISO772x-Q1
  • Safety-Related Certifications
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 61010-1, IEC 62368-1, IEC 60601-1, and GB 4943.1 certifications