SNLS623 September   2018 DSLVDS1047

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1. 3.1 Application Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LVDS Fail-Safe
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Probing LVDS Transmission Lines
        2. 9.2.2.2 Data Rate vs Cable Length Graph Test Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Decoupling Recommendations
      2. 11.1.2 Differential Traces
      3. 11.1.3 Termination
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Designed for Signaling Rates up to 400-Mbps
  • 3.3-V Power Supply Design
  • 300-ps Typical Differential Skew
  • 400-ps Maximum Differential Skew
  • 1.7-ns Maximum Propagation Delay
  • ±350-mV Differential Signaling
  • Low Power Dissipation (13 mW at 3.3-V Static)
  • Interoperable With Existing 5-V LVDS Receivers
  • High impedance on LVDS Outputs on Power Down
  • Flow-Through Pinout Simplifies PCB Layout
  • Meets or Exceeds TIA/EIA-644 LVDS Standard
  • Industrial Operating Temperature Range
    (−40°C to +85°C)
  • Available in TSSOP Package