SWRS205E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)

1 Features

  • The CC3120MOD is a Wi-Fi® module that includes the CC3120RNMARGK Wi-Fi network processor (NWP). The fully integrated, industrial temperature grade, green module includes all required clocks, serial peripheral interface (SPI) flash, and passives.
  • FCC, IC, CE, MIC, and SRRC certified
  • Wi-Fi CERTIFIED™ modules, with ability to request certificate transfer for Wi-Fi Alliance members
  • Featuring a dedicated Internet-on-a chip™ Wi-Fi NWP that completely offloads Wi-Fi and Internet protocols from the application MCU
  • Wi-Fi® modes
    • 802.11b/g/n station
    • 802.11b/g/n access point (AP) supporting up to four stations
    • Wi-Fi Direct® client/group owner
  • WPA2 personal and enterprise security: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x), WPA3 Persona, and WPA3 Enterprise
  • IPv4 and IPv6 TCP/IP stack
    • Industry-standard BSD socket application programming interfaces (APIs)
      • 16 simultaneous TCP or UDP sockets
      • 6 simultaneous TLS and SSL sockets
  • IP addressing: static IP, LLA, DHCPv4, and DHCPv6 with duplicate address detection (DAD)
  • SimpleLink™ connection manager for autonomous and fast Wi-Fi connections
  • Flexible Wi-Fi provisioning with SmartConfig™ technology, AP mode, and WPS2 options
  • RESTful API support using internal HTTP server
  • Wide set of security features
    • Hardware features
      • Separate execution environments
      • Device identity
    • Networking security
      • Personal and enterprise Wi-Fi security
      • Secure sockets (SSLv3, TLS1.0/1.1/TLS1.2)
      • HTTPS server
      • Trusted root-certificate catalog
      • TI root-of-trust public key
    • Software IP protection
      • Secure key storage
      • File system security
      • Software tamper detection
      • Cloning protection
  • Embedded network applications running on a dedicated NWP
    • HTTP/HTTPS web server with dynamic user callbacks
    • mDNS, DNS-SD, DHCP server
    • Ping
  • Recovery mechanism – ability to recover to factory defaults
  • Wi-Fi TX power
    • 17.0 dBm at 1 DSSS
    • 13.5 dBm at 54 OFDM
  • Wi-Fi RX sensitivity
    • –95.0 dBm at 1 DSSS
    • –73.5 dBm at 54 OFDM
  • Application throughput
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Power-management subsystem
    • Integrated DC-DC converters support a wide range of supply voltage:
      • VBAT wide-voltage mode: 2.3 V to 3.6 V
    • Advanced low-power modes
      • Shutdown: 1 μA
      • Hibernate: 5 μA
      • Low-power deep sleep (LPDS): 115 μA
      • RX traffic: 59 mA at 54 OFDM
      • TX traffic: 229 mA at 54 OFDM, maximum power
      • Idle connected (MCU in LPDS): 690 μA at DTIM = 1
  • Additional integrated components on module
    • 40.0-MHz crystal with internal oscillator
    • 32.768-kHz crystal (RTC)
    • 32-Mbit SPI serial flash
    • RF filter and passive components
  • 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm LGA package for easy assembly and low-cost PCB design
  • Ambient temperature range: –40°C to +85°C
  • Module supports SimpleLink Developers Ecosystem