          			TSC2301EVM

              BOARD PART NO: 6438187
            BOARD DIMESIONS: 4" X 6"
            HOW MANY LAYERS: 2

Notes:
1) BOARD FILE DESCRITPTONS
	FILENAME		DESCRIPTION			COPPER LAYER SEQUENCE 
	6438187.GTL  		Top Layer Copper				1	
	6438187.GBL		Bottom Layer Copper				2	
        6438187.GKO		Board Outline					
	6438187.GTO		Top Silk Overlay
	6438187.GTS		Top Solder Mask
	6438187.GBS		Bottom Solder Mask
	6438187.GTP		Top Solder Paste
	6438187.GD1		Drill Drawing
	6438187.GG1		Drill Guide
	6438187.TXT		NC Drill Data in ASCII format
	6438187.DRL		NC Drill Data in binary format
	6438187.DRR		NC Drill Report
	6438187.APR		Aperature File
	6438187.PNP		Pick and Place Info (ASCII)
	6438187.ZIP		ZIP file of all files
	READMEFIRST.TXT		This File	
	

2)  BOARD MATERIAL
Base laminate material to be NEMA GRADE: FR4 or FR5. Natural color and UL rated 105 Degree C, 94V-0. Finished board thickness to be 0.060 (+/- .007).	
3)  SOLDER MASK
Solder masks shall be applied over bare copper with materials in accordance with IPC-SM-840 and the registration shall be .010 of the circumscribed land patterns. Material: Wet Film/Dry Film/Photo Imagable. If fabrication process does not allow soldermask over bare copper, dry film over solder plating shall be used.
4) SILKSCREENING
Silk-screening shall be applied to the board with permanent non-conductive white epoxy ink. The silk-screens shall be legible, defined, and registered to the board with a tolerance of +/- .020 mils.
5) DRILLING
Tooling holes shall be first drilled and free of plating. Non-critical unplated holes may be drilled in the second drilling operation, but plating shall not be allowed inside the barrels. Diameters in drill table (DRLDWG.GDO) are after plating.
6) ETCHING
Etching tolerance for all layers shall be +/- 10% of original artwork pattern. This tolerance shall be adjusted to +/- 5% if the artwork pattern contains trace widths of less than 10 mils, or surface mount land patterns of less than .050 inch pitch,.
7) SOLDER PLATING
All unmasked conductive copper areas shall be coated with a minimum of .001 inches of 60/40 solder and shall be finished by hot air/oil leveling or hydro squeegee method. Land patterns shall be smooth  and evenly coated. 
8) COPPER REQUIRMENTS
	Starting copper weights shall be as follows:
	Outer signal layers: 1oz.
	Inner signal layers: 1 oz.
	Gnd  plane: 1 oz.
	All plated through holes shall have a minimum of .0014 inches copper plating.


