微控制器 (MCU)

MSP430 超低功耗 MCU - 低耗能加速器 (LEA)

了解 MSP430™ MCU 低耗能加速器 (LEA)

MSP430FR5994MSP430FR6047 微控制器 (MCU) 系列中集成的低耗能加速器 (LEA) 模块是一种 32 位硬件引擎,专为涉及基于矢量的信号处理(如 FIR、IIR 和 FFT)的操作而设计。这些操作无需 CPU 干预即可完成,并且操作完成时会触发中断。LEA 模块可支持由 CPU 发出的多个命令,并且可执行矢量数学运算,速度最高比运行 CMSIS DSP 库的 ARM® Cortex®-M0+ MCU 快 40 倍,且能耗最低。

实施 LEA 仅需极少的数字信号处理 (DSP) 专业技能,因为 TI 提供免费的优化 DSP 库,且支持 50 多个数学函数和即插即用设计,使开发人员能够快速打开 MSP430FR5994 LaunchPad™ 开发套件并在 5 分钟内开始处理复杂的数学算法。

在以下部分中了解有关 LEA 模块的更多信息。

使用 TI 的低耗能加速器 (LEA) 获得更高的 MCU 性能

TI MSP430 微控制器上用于信号处理的集成式低耗能加速器 (LEA) 的介绍。了解 LEA 如何在不牺牲功耗的情况下执行复杂的矢量数学处理(例如,FFT 或 FIR 滤波器)。

培训视频

视频标题 说明
Signal processing overview A quick overview of two types of signal processing which are the most broadly used in the industry – FFT and FIR – that can be done in the low energy accelerator module.
What is the low energy accelerator (LEA) peripheral? An overview of the LEA module including cycle and energy performance.
Low energy accelerator (LEA) performance A review of LEA performance by looking at the cycle and energy efficiency of the LEA module.

应用示例

应用 说明 资源
Smart microphones for virtual assistants The low-energy accelerator can be used to filter out background noise for speech recognition for smart microphones that are included in home automation products. Read more
Ultrasonic gas meter This reference design helps designers to develop a ultrasonic gas metering sub-system using an ADC-based technique for superior metrology performance with lower power based on the MSP430FR5994 with the integrated LEA module. Download design
Glass break detectors Using the LEA module’s fast vector math computation allows for truly smart glass break detectors that can be “glass independent” to extract important signatures from the glass breaking sound to make decisions. Read more
Smart fault indicators The integrated LEA module and 12-bit ADC in the MSP430FR5994 allow smart fault indicators to monitor the health of overhead or underground power lines and cables to reduce power downtime and even take action before failure occurs. Download whitepaper
Ultrasonic sensing in condition monitoring Adding an MSP430 MCU with the LEA module in ultrasonic sensors for predictive or proactive maintenance provides a much more complete picture of equipment operation, and reduces the need for an inspector to tune the frequency. Read more
Holter monitor Having an integrated LEA module and 12-bit ADC in the MSP430FR5994 MCU logs the data, filters out unwanted noise and processes events for reporting. Additionally, with power consumption of 0.4mA on average the MSP430FR5994 helps maintain a longer battery life. Read more

使用 MSP430 MCU 低能耗加速器进行开发

使用 MSP430FR5994 和 MSP430FR6047 系列上具有增强的矢量数学运算信号处理功能的全新低能耗加速器 (LEA) 外设开发您的智能应用,并在不牺牲性能的情况下实现更低的系统功耗。TI 为您提供入门所需的一切资源,包括培训、文档、参考设计、开发套件和软件库。

这些资源的链接如下所示。如需更多帮助,请访问 TI E2E 论坛。您可以在这里参加有关 MSP430 MCU 主题(包括 LEA 模块)的讨论。

培训和演示视频

视频标题 说明
In-depth on Low Energy Accelerator (LEA) peripheral An in-depth view of the LEA peripheral, how applications interact with the module and memory usage.
Low Energy Accelerator (LEA) programmers model A look at the programmers model on how to get started with the LEA module using the MSP DSP Library.
Meet the New MSP430FR5994 LaunchPad™ Development Kit A board tour of the MSP-EXP430FR5994 LaunchPad development kit including the LEA module for signal processing and the associated reference design.

参考设计

TI 提供多种将 MSP430 微控制器与集成 LEA 模块配合使用的参考设计,以突出不同的应用和用途。每个设计均包含材料清单、原理图、光绘文件和文档。此外,TI 为我们的开发套件提供设计文件,以加速您的原型设计。

带有 LEA 模块的器件

MSP430FR5994 微控制器

MSP430FR599x 系列

带有 LEA 模块的 128-256KB 统一存储器

MSP430FR6047 微控制器

MSP430FR6047

带有 LEA 模块的 256KB 统一存储器和集成超声波感应模拟前端

软件

适用于 MSP 微控制器的数字信号处理 (DSP) 库

DSP 库是一组经高度优化的函数,适用于包括 MSP430FR599x 和 MSP430FR6047 系列在内的 MSP430™ 微控制器,这些函数可对定点数字执行许多常见的信号处理运算。

软件 说明
MSP430FR5994 Launchpad Development Kit – Software Examples Software examples for the MSP-EXP430FR5994 LaunchPad kit.
MSP430Ware™ software MSP430Ware is a collection of resources that help users to effectively create and build MSP430 code.
Code Composer Studio™ IDE Code Composer Studio is an integrated development environment (IDE) that supports TI's MSP430 MCU portfolio.
IAR Embedded Workbench® IAR Embedded Workbench for MSP430 is a complete debugger and C/C++ compiler toolchain for building and debugging embedded applications based on MSP430 microcontrollers.

用户指南

DSP 库 API 指南

MSP 数字信号处理库用户指南

购买带有 MSP430 MCU 低能耗加速器的器件和工具

我们提供多个带有集成 LEA 模块的 MSP430 MCU 和开发工具供您选购并着手进行开发。如果在此过程中需要任何帮助,请务必查看我们的开发资源并访问 TI E2E 论坛。

Devices

MSP430FR5994

256KB FRAM / 8KB RAM with UART Bootloader

64- and 80-pin LQFP

48-pin QFN

87-pin BGA

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MSP430FR59941

256KB FRAM / 8KB RAM with 12C Bootloader

64- and 80-pin LQFP

48-pin QFN

87-pin BGA

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MSP430FR5992

128KB FRAM / 8KB RAM with UART Bootloader

64- and 80-pin LQFP

48-pin QFN

87-pin BGA

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MSP430FR6047

256KB FRAM / 8KB RAM with ultrasonic sensing analog front end

100-pin LQFP

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Tools

MSP-EXP430FR5994
MSP430FR5994 LaunchPad development kit Order now
MSP-TS430PN80B Target board for the MSP430FR5994, 80-pin Order now
MSP-TS430PZ100E Target board for the MSP430FR6047, 100-pin Order now
EVM430-FR6047 Ultrasonic sensing EVM for the MSP430FR6047 Order now
MSP-FET MSP430 Flash emulation tool Order now
MSP-GANG MSP430 production programmer Order now