TQ-3P-SOM-TQMA62XX

TQ-Group TQMa62xx system on modules for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors

TQ-3P-SOM-TQMA62XX

来自 : TQ-Group
立即订购

概述

The embedded module TQMa62xx, is based on the processor family AM623 and AM625 processor family. This module is designed to use the pin-compatible processors on one module design. This module is ideal for applications that require advanced computing power and scalable graphics performance. The AM62x family is introduced as the successor to the AM335x family of general purpose processors.

This MPU family offers performance enhancements in graphics, computing power and a variety of industrial interfaces. The modules make peripherals, including 2x TSN-capable Gb Ethernet switches, USB 2.0, CAN-FD, UART, LVDS, Parallel RGB, and CSI, available for the designer without complex power and high-speed data routing such as DDR.

特性
  • 38 mm x 55 mm HDI module, 38 mm x 38 mm LGA module
  • 320-pins, 0.5mm (HDI), 366-pin ball array (LGA)
  • 2-GB LPDDR4 with ECC, 64-GB eMMC, 256-MB NOR Flash
  • 2x Gb Ethernet switch (TSN), 3x CAN-FD, 2x USB 2.0
  • LVDS + Parallel RGB dual-display
  • Low power consumption (typ. 2W), integrated security functions
基于 Arm 的处理器
AM623 具有基于 Arm® Cortex®-A53 的对象和手势识别功能的物联网 (IoT) 和网关 SoC AM625 具有基于 Arm® Cortex®-A53 的边缘 AI 和全高清双显示的人机交互 SoC
下载 观看带字幕的视频 视频
照片提供方为 TQ-Group

立即订购并开发

开发套件

STKa62xx — Evaluation and development kit for TQMa62xx

开发套件

STKa62xxL — Evaluation and development kit for TQMa62xxL

评估板

TQMA62XXL — System on module in land-grid array (LGA) solder-down form factor, based on AM623 and AM625 processors

评估板

TQMA62XX — System on module with high density interconnects (HDI), based on AM623 and AM625 processors

应遵守 TI 的评估模块标准条款与条件.

支持与培训

第三方支持
TI 不会为此硬件提供持续且直接的设计支持。要在设计期间获得支持,请联系 TQ-Group.

视频

免责声明

以上特定信息和资源(包括非 TI 网站的链接)可能由 TI 第三方合作伙伴提供,仅供您方便查阅之用。TI 不是该类信息和资源等内容的提供方,也不对其负责,在您将其用于预期用途时,应由您自行对其进行认真评估。此处包含该类信息和资源并不意味着 TI 认可任何第三方公司,且无论任何第三方产品或服务是单独使用还是与任何 TI 产品或服务结合使用,均不得将该类信息和资源视为对任何第三方产品或服务适用性的保证或陈述。