TLK2501EVM

TLK2501 串行器/解串器评估模块

TLK2501EVM

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概述

The TLK2501 serdes evaluation module (EVM) board is used to evaluate the TLK2501 device (VQFP) and associated optical interface (NetLight™) for point-to-point data transmission applications.

The board enables the designer to connect 50 ohm parallel buses to both transmiter and receiver connectors. The TLK2501, using high speed PLL technology, serializes, encodes (8 b/10 b) and transmits data along one differential pair. The receiver part of the device deserializes, decodes, and presents data on the parallel bus. The high speed (up to 2.5 Gbps) data lines interface to four 50 ohm controlled-impedance SMA connectors. The designer can either use this copper interface directly or loop back to the laser module section for an optical interface (not provided).

特性

Some of the advanced features offered by this board include:

  • PCB (printed-circuit board) is designed for high-speed signal integrity
  • Flexibility - the PCB can be configured for copper or optical interfaces
  • SMA and parallel fixtures are easily connected to test equipment
  • All input/output signals are accessible for rapid prototyping
  • Analog and digital power planes can be supplied through separate banana jacks for isolation or can be combined using ferrite bridging networks
  • Series termination resistors provide parallel RD outputs
  • Onboard capacitors provide ac coupling of high-speed signals
其他接口
TLK2501 1.5Gbps 至 2.5Gbps 收发器
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评估板

TLK2501EVM — TLK2501 串行器/解串器评估模块

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技术文档

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类型 标题 下载最新的英文版本 日期
* EVM 用户指南 TLK2501 Serdes EVM Kit Setup and Usage 2000年 9月 12日
证书 TLK2501EVM EU Declaration of Conformity (DoC) 2019年 1月 2日

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