BOOSTXL-CC2650MA

TI SimpleLink 低功耗 Bluetooth® CC2650 模块 BoosterPack 插件模块

BOOSTXL-CC2650MA

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概述

通过CC2650 模块 BoosterPack 套件可以简便快捷地将蓝牙低能耗添加到您的 LaunchPad 中。只需将 CC2650 模块 BoosterPack 插入 MSP432 LaunchPad!

CC2650 模块 BoosterPack 是一款具备无线网络处理器软件的编程套件,可以让您通过简单的 UART 接口将蓝牙低能耗连接添加到任何应用。模块 Boosterpack 还包括 JTAG 连接,可对 CC2650 模块进行编程和调试。如此,您就可以在 CC2650 模块上开发任何蓝牙低能耗应用。

特性
  • 蓝牙低能耗模块 BoosterPack 使用带有集成型天线的 CC2650 模块
  • 与 MSP432 LaunchPad 兼容
  • 经过预先认证的模块可快速推向市场
  • 调试用于在模块上开发任何蓝牙低能耗应用的接口

低功耗 2.4GHz 产品
CC2630 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN 无线 MCU CC2640 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU CC2650 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线 MCU CC2650MODA 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线模块
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BOOSTXL-CC2650MA — TI SimpleLink 低功耗 Bluetooth® CC2650 模块 BoosterPack 插件模块

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插件

SIMPLELINK-SDK-BLUETOOTH-PLUGIN — SimpleLink™ MCU SDK 蓝牙插件

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SIMPLELINK-SDK-BLUETOOTH-PLUGIN SimpleLink™ MCU SDK 蓝牙插件

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最新版本
版本: 3.20.00.24
发布日期: 31 七月 2019

Windows Installer for SimpleLink SDK BLE Plugin

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macOS Installer for SimpleLink SDK BLE Plugin

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Linux Installer for SimpleLink SDK BLE Plugin

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lock = 需要出口许可(1分钟)
产品
Wi-Fi 产品
CC3220S 具有安全启动和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 Wi-Fi® 无线 MCU CC3220SF 具有 1MB 闪存和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 Wi-Fi® 无线 MCU CC3235S 具有 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU CC3235SF 具有 1MB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU
Arm Cortex-M4 MCU
MSP432E401Y 具有以太网、CAN、1MB 闪存和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4F MCU MSP432E411Y 具有以太网、CAN、TFT LCD、1MB 闪存和 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4F MCU
低功耗 2.4GHz 产品
CC2640 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU CC2642R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2650 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线 MCU CC2650MODA 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线模块 CC2652R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU
硬件开发
BOOSTXL-CC2650MA TI SimpleLink 低功耗 Bluetooth® CC2650 模块 BoosterPack 插件模块 CC3220S-LAUNCHXL CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC2640R2 CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 CC26x2R SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LAUNCHXL-CC3235S CC3235S dual-band LaunchPad™ development kit for Wi-Fi® SimpleLink™ MCU LAUNCHXL-CC3235SF CC3235SF dual-band LaunchPad™ development kit for Wi-Fi® SimpleLink™ MCU MSP-EXP432E401Y MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU

文档

SimpleLink SDK BLE Plugin User's Guide

最新信息

  • This version of the SimpleLink Bluetooth Plugin now enables a BLE two-chip solution to act as a GAP Central role. Previous versions of this plugin only included support for GAP Peripheral role. This new functionality is showcased through the addition of the new simple_central example, which uses the MSP432E401Y as the Host device and the CC26x2R1 as the NWP. The simple_central example demonstrates the following features:
    • Host: MSP432E401Y
    • NWP: CC26X2R1
    • GAP Central role support
    • Host Controller Interface (HCI) protocol used for communication with the NWP
    • BLE5 support
    • Power management
    • Low Energy Secure Connection (LESC) Pairing
    • Tested with up to 4 peripherals connected simultaneously (but can support more than 4 connections)
    • Supports a subset of TI Vendor Specific HCI commands and Bluetooth LE HCI commands/events. More information on these APIs can be found BLE Vendor Specific API Guide.
    • Works out-of-box with the Sensors BoosterPack and Project Zero examples that are also in the SimpleLink SDK Bluetooth Plugin.
    • The GAP Central source code is also showcased in a separate downloadable: the SimpleLink BLE Plugin Azure Gateway Example Pack. This example pack demonstrates enabling a user’s BLE two-chip solution to become a gateway to the Azure IoT cloud. The SimpleLink BLE Plugin Azure Gateway Example Pack can be found on www.ti.com.

发布信息

The SimpleLink™ SDK BLE Plugin is a companion software package that enables the use of a Bluetooth radio on any standard MSP432P4 platform, MSP432E4 or CC32XX platform, and enables this two-chip solution to act as either a GAP Peripheral role or a GAP Central role. By having the ability to seamlessly and modularly add Bluetooth functionality (more specifically Bluetooth Low Energy/BLE) to an embedded system, a programmer can enable their embedded device to become a gateway to various IOT infrastructures.

For examples demonstrating the two-chip solution in a peripheral role, the plugin leverages the use of the TI Simple Application Processor (SAP) driver connected to a CC26xx Simple Network Processor (SNP) to provide a highly customizable hardware configuration. For software connectivity between the SAP and the SNP, an architecture agnostic HAL/Drivers layer is used to promote software portability and maximize collateral reuse.

For examples demonstrating the two-chip solution in a central role, communication between the NWP and the Host occurs through a UART serial interface using the Host Controller Interface (HCI) protocol. TI Vendor Specific HCI commands and a limited subset of Bluetooth LE HCI commands/events to implement a Bluetooth application. By using TI Vendor Specific commands and events, the application can communicate with and access the BLE stack.

驱动程序或库

BLE-STACK-2-X — BLE-STACK V2.2(支持 CC2640/CC2650)

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BLE-STACK-2-X BLE-STACK V2.2(支持 CC2640/CC2650)

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最新版本
版本: 2.02.07.06
发布日期: 30 十一月 2021

Windows Installer for Simplelink BLE 2 x SDK

校验和

Link to Windows Installer for Code Composer Studio IDE

lock = 需要出口许可(1分钟)
产品
低功耗 2.4GHz 产品
CC2640 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 低功耗 Bluetooth® 无线 MCU CC2650 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线 MCU
硬件开发
BOOSTXL-CC2650MA TI SimpleLink 低功耗 Bluetooth® CC2650 模块 BoosterPack 插件模块 CC2650RC SimpleLink™ 低功耗 Bluetooth®/ZigBee® RF4CE™ CC2650 远程控制 CC2650STK SimpleLink SensorTag LAUNCHXL-CC2650 SimpleLink™ CC2650 无线 MCU LaunchPad™ 开发套件

文档

Archive Installers for Simplelink BLE 2 x SDK

发布信息

This is version 2.2.7 of the TI Bluetooth® low energy protocol stack Software Development Kit (SDK). The BLE-Stack SDK allows for the development of single-mode Bluetooth low energy (BLE) applications on TI's first generation SimpleLink Bluetooth low energy CC2640 and Multi-Standard CC2650 wireless microcontroller units (MCUs) supporting version 5.1 of the Bluetooth specification with features defined by version 4.2 of the Bluetooth specification. The CC26x0 family of wireless MCUs includes a 32-bit Arm® Cortex™-M3 as the main application CPU running at 48 MHz, a dedicated Cortex-M0 processor for the radio / Physical Layer (PHY), and an autonomous Sensor Controller Engine for low-power sensing applications. The BLE protocol stack is built on top of the TI Real-time Operating System (TI-RTOS) which provides advanced power management and flexible peripheral driver capabilities allowing the development of highly optimized and power efficient standalone or network processor applications. The TI-RTOS SDK is installed during the BLE-Stack SDK installation.

Version 2.2.7 of the BLE-Stack is a maintenance update to TI's existing royalty-free Bluetooth low energy software protocol stack which is certified for Bluetooth specification version 5.1. This release includes support for all core specification version 4.2 Low Energy (LE) features as well as several development kits. This protocol stack update is in addition to support of all major Bluetooth LE core specification version 4.1 features, including support for up to 8 master or slave BLE connections. Please note that no Bluetooth 5 or Bluetooth 5.1 features are supported. A few examples of what can be created using the sample applications in this SDK and/or the additional resources found in the Examples section below include Bluetooth beacons incorporating the popular Apple iBeacon® and Eddystone™ formats, glucose, heart rate and fitness monitors, dongles for cable replacement via a BLE Serial Port Bridge and industrial motor monitors.

See What's New section for an overview of the changes included in this release. The Bluetooth core specification version 4.2 features supported in this release allow development of the most secure and power efficient products incorporating the Bluetooth low energy specification.

最新信息

  • [Errata 17113] Impersonation the Passkey Entry Protocol -- do not except the same x coordinate of the public key during pairing.
  • Impersonation the Passkey Entry Protocol -- exclude debug keys from rejection of mirror attack.
认证

CC26XX-REPORTS — CC26xx 监管认证报告

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CC26XX-REPORTS CC26xx 监管认证报告

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最新版本
版本: 7.20.00.00
发布日期: 08 五月 2023
产品
低功耗 2.4GHz 产品
CC2642R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2650MODA 具有 128kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M3 多协议 2.4GHz 无线模块 CC2651R3SIPA 具有集成天线的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2652PSIP 具有集成式功率放大器的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2652R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652RSIP 具有 352KB 内存的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块
硬件开发
BOOSTXL-CC2650MA TI SimpleLink 低功耗 Bluetooth® CC2650 模块 BoosterPack 插件模块
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LP-CC2652PSIP CC2562PSIP SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件 LP-CC2651R3SIPA CC2651R3SIPA SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件

文档

Link to FCC, ISED, CE, & Japan Certification Reports

Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports

Link to FCC, ISED, CE, & UK Certification Reports

Link to FCC, ISED, CE, & UK Certification Reports

Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports

发布信息

This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.

最新信息

  • Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
  • Updated CC2652RSIPMOT CE with missing safety report
应遵守 TI 的评估模块标准条款与条件.

设计文件

技术文档

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类型 标题 下载最新的英文版本 日期
* 用户指南 CC2650 Module BoosterPack™ Getting Started Guide (Rev. A) 2016年 6月 29日
证书 BOOSTXL-CC2650MA EU Declaration of Conformity (DoC) 2019年 1月 2日
电子书 TI-RSLK modules 1 - 20 (Rev. A) 2018年 5月 30日
更多文献资料 简介:传感器集成 2017年 11月 17日
更多文献资料 实验室:传感器集成 2017年 11月 17日
更多文献资料 Jacki Project Lecture 2017年 11月 17日
应用手册 Running Standalone Bluetooth® low energy Applications on CC2650 Module (Rev. A) PDF | HTML 2017年 6月 7日
应用手册 Running Standalone Bluetooth® low energy Applications on CC2650 Module 2017年 1月 18日

相关设计资源

硬件开发

开发套件
CC2650STK SimpleLink SensorTag LAUNCHXL-CC1350 CC1350 LaunchPad™ development kit for SimpleLink™ dual-band wireless MCU LAUNCHXL-CC2650 SimpleLink™ CC2650 无线 MCU LaunchPad™ 开发套件

软件开发

驱动程序或库
BLE-STACK 低功耗蓝牙软件栈

参考设计

参考设计
TIDC-SPPBLE-SW-RD UART 至 Bluetooth® 低能耗 (BLE) 桥参考设计

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