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BOOST-CC2564MODA

TMP107 BoosterPack 模块

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BOOST-CC2564MODA

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概述

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design effort and enables fast time to market. The CC2564MODA modules provides best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions.

For a complete evaluation solution, the BOOST-CC2564MODA board plugs directly into TI LaunchPad™ development kits and BoosterPack plug-in modules such as: MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST. Moreover, a certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430™ and MSP432™ MCUs.

特性

  • Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1

  • Integrated antenna on CC2564MODA  for ready to use application

  • FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface

  • Class 1.5 Transmit Power (+10dBm) and High sensitivity (-93 dBm typ.)

  • BoosterPack connectors compatible with TI LaunchPads and BoosterPacks such as:

    • MSP-EXP432P401R

    • CC3200AUDBOOST

    • CC31XXEMUBOOST

  • 1 BOOST-CC2564MODA board with TI CC2564MODA device
  • MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST boards sold separately
Wi-Fi 产品
CC2560 — 具有增强数据速率 (EDR) 的 Bluetooth® 4.0 CC2564 — 具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0 CC2564MODA — 具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1 CC2564MODN — 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.1

 

线性和低压降 (LDO) 稳压器
TLV717P — 具有主动输出放电和使能功能的 150mA、低 IQ、低压降稳压器 TPS735 — 具有使能功能的 500mA、低 IQ、低压降稳压器
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评估板

BOOST-CC2564MODA — 具有集成天线 BoosterPack 插件模块的双模蓝牙 CC2564 模块

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CC256X-REPORTS — 报告：CC256x 法规认证报告

支持的产品和硬件
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CC256X-REPORTS — 报告：CC256x 法规认证报告

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最新版本
版本: 5.20.00.00
发布日期: 14 四月 2021
open-in-new 发布说明
open-in-new 查看所有版本
产品
Wi-Fi 产品
CC2564 — 具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0 CC2564C — 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 5.1 CC2564MODA — 具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1 CC2564MODN — 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.1
硬件开发
BOOST-CC2564MODA — TMP107 BoosterPack 模块 CC2564MODAEM — CC2564 具有集成天线的双模蓝牙模块评估板 CC2564MODNEM — CC2564 Bluetooth® 双路模式模块评估版 CC256XCQFN-EM — CC2564C 双模 Bluetooth® 控制器评估模块 CC256XQFNEM — 双模 Bluetooth® CC2564 评估板

文档

open-in-new CC2564MODN Module Certification Reports

Link to FCC, ISED, & Certification Reports

open-in-new CC2564MODA Module Certification Reports

Link to FCC, ISED, & Certification Reports

open-in-new CC2564MODNEM

Link to CC2564MODNEM Reference Only Certification Reports

open-in-new CC2564MODAEM

Link to CC2564MODAEM Reference Only Certification Reports

open-in-new CC256xQFNEM

Link to CC256xQFNEM Reference Only Certification Reports

open-in-new CC256xCQFN-EM

Link to CC256xCQFN-EM Reference Only Certification Reports

open-in-new BOOST-CC2564MODA

Link to BOOST-CC2564MODA Reference Only Certification Reports

发布信息

This page provides access to the Dual Mode BT certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.

最新信息

  • Updated CE certification reports for CC2564 Modules
应遵守 TI 的评估模块标准条款与条件.

技术文档

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类型 标题 下载最新的英文版本 日期
证书 BOOST-CC2564MODA EU Declaration of Conformity (DoC) (Rev. C) 2021年 3月 3日
更多文献资料 CC2564 Dual-Mode Bluetooth Module With Integrated Antenna BoosterPack Plug-in (Rev. B) 2018年 8月 30日
用户指南 Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna BoosterPack™ Plug-in (Rev. A) 2017年 11月 2日
用户指南 TI Dual-mode Bluetooth® stack on MSP432 MCUs User Guide (Rev. B) 2017年 10月 30日

相关设计资源

硬件开发

评估板
CC31XXEMUBOOST — 用于 SimpleLink Wi-Fi CC3100 BoosterPack 的高级仿真 BoosterPack CC3200AUDBOOST — SimpleLink Wi-Fi CC3200 音频·BoosterPack
开发套件
MSP-EXP430F5529LP — MSP430F5529 LaunchPad™ development kit for USB

软件开发

驱动程序或库
CC256XB-BT-SP — 用于 CC256xB 的蓝牙服务包 CC256XMS432BTBLESW — 基于 MSP432 MCU 的 TI 双模蓝牙协议栈

设计工具和仿真

计算工具
SWRC256 — CC256x 蓝牙硬件评估工具

参考设计

参考设计
BT-MSPAUDSINK-RD — 蓝牙 和 MSP430 音频信宿参考设计 BT-MSPAUDSOURCE-RD — 蓝牙和 MSP430 音频源参考设计 TIDA-00554 — 面向便携式化学分析应用的蓝牙连接型 DLP 超级移动 NIR 光谱仪 TIDC-CC3200AUDBOOST — 用于 SimpleLink Wi-Fi CC3200 Launchpad 的 Wi-Fi 音频流应用

支持与培训

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查看所有论坛主题 查看英文版所有论坛主题

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