TPS5130-Q1
- Qualified for Automotive Applications
- Three Independent Step-Down DC/DC Controllers
and One LDO Controller - Input Voltage Range
- Switcher: 4.5 V to 28 V
- LDO: 1.1 V to 3.6 V
- Output Voltage Range
- Switcher: 0.9 V to 8.5 V
- LDO: 0.9 V to 2.5 V
- Synchronous for High Efficiency
- Precision Vref (±1.5%)
- PWM Mode Control : 500-kHz Operation (Max)
- Auto PWM/SKIP Mode Available
- High-Speed Error Amplifier
- Overcurrent Protection With Temperature Compensation
Circuit for Each Channel - Overvoltage and Undervoltage Protection
- Programmable Short-Circuit Protection
- Power Good Output (PGOUT) With Programmable
Delay Time - 5-V and 3.3-V Linear Regulators
- APPLICATIONS
- Notebook PCs, PDAs
- Consumer Game Systems
- DSP Applications
The TPS5130 is composed of three independent synchronous buck regulator controllers (SBRC) and one low dropout (LDO) regulator controller. On-chip high-side and low-side synchronous rectifier drivers are integrated to drive less expensive N-channel MOSFETs. The LDO controller can also drive an external N-channel MOSFET. Because the input current ripple is minimized by operating 180° out of phase, it allows a smaller input capacitance, resulting in reduced power supply cost. The SBRC of the TPS5130 automatically adjusts from PWM mode to SKIP mode to maintain high efficiency under light-load conditions. Resistorless current protection for the synchronous buck controller and the fixed high-side driver voltage simplifies the system design and reduces the external parts count. The LDO controller has a current-limit protection and overshoot protection to suppress output voltage spikes at load transient. To further extend battery life, the TPS5130 features dead-time control and very low quiescent current.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Triple Synchronous Buck Controller with NMOS LDO Controller 数据表 | 2009年 3月 5日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点