TPA6101A2
- Minimal External Components Required
- 1.6 to 3.6 Supply Voltage Range
- 50-mW Stereo Output
- Low Supply Current...0.75 mA
- Low Shutdown Current...50 nA
- Gain Set Internally to 2 dB
- Pop Reduction Circuitry
- Internal Mid-Rail Generation
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- 3-mm × 5-mm MSOP Package (DGN)
- 5-mm × 6-mm SOIC Package (D)
- 2,5-mm × 2,5-mm MicroStar Junior™ BGA Package (ZQY)
MicroStar BGA is a trademark of Texas Instruments.
The TPA6101A2 is a stereo audio power amplifier packaged in an 8-pin SOIC package, an 8-pin MSOP package, or a 15-ball BGA package, capable of delivering 50 mW of continuous RMS power per channel into 16- loads. Amplifier gain is internally set to 2 dB (inverting) to save board space by eliminating six external resistors.
The TPA6101A2 is optimized for battery applications because of its low supply current, shutdown current, and THD+N. To obtain the low supply voltage range, the TPA6101A2 biases BYPASS to VDD/4.
When driving a 16- loads, the THD+N is reduced to less than 0.06% at 1 kHz, and is less than 0.3% across the audio band of 20 Hz to 20 kHz.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 50-mW Ultralow-Voltage, Fixed-Gain Stereo Headphone Audio Power Amp 数据表 (Rev. C) | 2007年 3月 2日 | |||
用户指南 | TPA6101A2EVM - User Guide (Rev. A) | 2001年 4月 6日 | ||||
应用手册 | A Low-Cost, Single Coupling Capacitor Config. for Stereo Headphone Amplifiers | 1999年 12月 22日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TPA6101A2EVM — TPA6101A2 评估模块 (EVM)
The TPA6101A2 is a stereo headphone amplifier capable of delivering 50mW of continuous RMS power per channel into 16-Ohm speakers. The amplifier's gain is internally set to 2dB (inverting) to save board space by eliminating six external resistors.
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | 下载 |
---|---|---|
SOIC (D) | 8 | 查看选项 |
VSSOP (DGK) | 8 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点