产品详情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Stereo Rating Catalog Power stage supply (max) (V) 15 Power stage supply (min) (V) 7 Load (min) (Ω) 16 Output power (W) 3 SNR (dB) 102.5 THD + N at 1 kHz (%) 0.1 Iq (typ) (mA) 11 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 7 Analog supply voltage (max) (V) 15 PSRR (dB) 60 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Stereo Rating Catalog Power stage supply (max) (V) 15 Power stage supply (min) (V) 7 Load (min) (Ω) 16 Output power (W) 3 SNR (dB) 102.5 THD + N at 1 kHz (%) 0.1 Iq (typ) (mA) 11 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 7 Analog supply voltage (max) (V) 15 PSRR (dB) 60 Operating temperature range (°C) -40 to 85
HTSSOP (PWP) 28 62.08 mm² 9.7 x 6.4
  • 3 W Into 16 From 12-V Supply
  • Volume Control for Speakers (BTL) and Headphones (SE)
  • Differential Inputs
  • Depop Circuitry
  • 1 µA Shutdown Current
  • Surface Mount Package
  • APPLICATIONS
    • LCD Monitors and LCD TVs
    • Multimedia Speakers
    • Notebook Computers

PowerPAD is a trademark of Texas Instruments.

  • 3 W Into 16 From 12-V Supply
  • Volume Control for Speakers (BTL) and Headphones (SE)
  • Differential Inputs
  • Depop Circuitry
  • 1 µA Shutdown Current
  • Surface Mount Package
  • APPLICATIONS
    • LCD Monitors and LCD TVs
    • Multimedia Speakers
    • Notebook Computers

PowerPAD is a trademark of Texas Instruments.

The TPA6030A4 is designed to drive 3 W into 16- speakers using a surface-mount package without the need for an external heatsink. These features make it ideal for 15" – 17" LCD monitors, small multimedia speakers, and notebook computers.

To simplify system design, the speaker volume level is adjusted by applying a dc voltage to the VOLUME terminal. The delta between speaker volume and headphone volume can be adjusted by applying a dc voltage to the SEDIFF terminal. To avoid an unexpected high volume level through the headphones, a third terminal, SEMAX, limits the headphone volume level when a dc voltage is applied. Integrated depop circuitry and the fully differential design minimize pops, clicks, and unwanted noise to provide a high level of audio performance.

The device is available in a 28-pin TSSOP PowerPAD™ package. The PowerPAD™ package is designed to transfer heat into the ground plane, eliminating the need for external heat sinks—minimizing solution cost and size.

The TPA6030A4 is designed to drive 3 W into 16- speakers using a surface-mount package without the need for an external heatsink. These features make it ideal for 15" – 17" LCD monitors, small multimedia speakers, and notebook computers.

To simplify system design, the speaker volume level is adjusted by applying a dc voltage to the VOLUME terminal. The delta between speaker volume and headphone volume can be adjusted by applying a dc voltage to the SEDIFF terminal. To avoid an unexpected high volume level through the headphones, a third terminal, SEMAX, limits the headphone volume level when a dc voltage is applied. Integrated depop circuitry and the fully differential design minimize pops, clicks, and unwanted noise to provide a high level of audio performance.

The device is available in a 28-pin TSSOP PowerPAD™ package. The PowerPAD™ package is designed to transfer heat into the ground plane, eliminating the need for external heat sinks—minimizing solution cost and size.

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类型 标题 下载最新的英语版本 日期
* 数据表 3-W Stereo Audio Power Amplifier With Advanced DC Volume Control 数据表 (Rev. B) 2005年 1月 27日
用户指南 TPA6030A4EVM - User Guide (Rev. A) 2002年 11月 4日

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TPA6030A4EVM — TPA6030A4 评估模块 (EVM)

The TPA6030A4 is a 3-W stereo audio power amplifier designed for 12V applications with a 16-Ohm minimum speaker impedance. Features including DC volume control and integrated stereo headphone drive make this device ideal for 15" to 17" audio enhanced flat panel displays.

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TPA6030A4 Gerber Files

SLVC075.ZIP (140 KB)
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HTSSOP (PWP) 28 查看选项

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  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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