产品详情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 4 Output power (W) 2.5 SNR (dB) 97 THD + N at 1 kHz (%) 0.18 Iq (typ) (mA) 3.4 Control interface GPIO Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 75 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 4 Output power (W) 2.5 SNR (dB) 97 THD + N at 1 kHz (%) 0.18 Iq (typ) (mA) 3.4 Control interface GPIO Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 75 Operating temperature range (°C) -40 to 85
DSBGA (YZF) 9 3.0625 mm² 1.75 x 1.75
  • Pin-to-pin compatibility with TPA2010D1
  • Short Circuit Auto-recovery
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8- Speaker:
      • 88% at 400 mW
      • 80% at 100 mW
    • 2.8-mA Quiescent Current
    • 0.5-µA Shutdown Current
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • High PSRR (–75 dB) and Wide Supply Voltage (2.5 V to 5.5 V)
    • Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • 1,45mm × 1,45 mm 9-Ball WCSP
    • NanoFree™ Lead-Free (YZF)
  • APPLICATIONS
    • Wireless or Cellular Handsets and PDAs
    • Personal Navigation Devices
    • General Portable Audio Devices
    • Linear Vibrator Drivers
  • See Also
    • TPA2031D1, TPA2032D1, TPA2033D1, TPA2034D1, TPA2035D1

NanoFree is a trademark of Texas Instruments.

  • Pin-to-pin compatibility with TPA2010D1
  • Short Circuit Auto-recovery
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8- Speaker:
      • 88% at 400 mW
      • 80% at 100 mW
    • 2.8-mA Quiescent Current
    • 0.5-µA Shutdown Current
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • High PSRR (–75 dB) and Wide Supply Voltage (2.5 V to 5.5 V)
    • Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • 1,45mm × 1,45 mm 9-Ball WCSP
    • NanoFree™ Lead-Free (YZF)
  • APPLICATIONS
    • Wireless or Cellular Handsets and PDAs
    • Personal Navigation Devices
    • General Portable Audio Devices
    • Linear Vibrator Drivers
  • See Also
    • TPA2031D1, TPA2032D1, TPA2033D1, TPA2034D1, TPA2035D1

NanoFree is a trademark of Texas Instruments.

The TPA2036D1 is a 2.5-W high efficiency filter-free class-D audio power amplifier (class-D amp) in a 1,45 mm × 1,45 mm wafer chip scale package (WCSP) that requires only three external components.

Features such as 88% efficiency, –75-dB PSRR, improved RF immunity, and 8 mm2 total PCB area make TPA2036D1 ideal for cellular handsets. A fast start-up time of 1 ms with minimal pop makes TPA2036D1 ideal for portable applications.

In cellular handsets, TPA2036D1 is capable of driving the earpiece, speaker phone, and melody ringer. TPA2036D1 allows independent gain while summing signals from separate sources, and has a low 36 µVRMS noise floor, A-weighted.

The TPA2036D1 is a 2.5-W high efficiency filter-free class-D audio power amplifier (class-D amp) in a 1,45 mm × 1,45 mm wafer chip scale package (WCSP) that requires only three external components.

Features such as 88% efficiency, –75-dB PSRR, improved RF immunity, and 8 mm2 total PCB area make TPA2036D1 ideal for cellular handsets. A fast start-up time of 1 ms with minimal pop makes TPA2036D1 ideal for portable applications.

In cellular handsets, TPA2036D1 is capable of driving the earpiece, speaker phone, and melody ringer. TPA2036D1 allows independent gain while summing signals from separate sources, and has a low 36 µVRMS noise floor, A-weighted.

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类型 标题 下载最新的英语版本 日期
* 数据表 2.5-W MONO CLASS-D AUDIO AMPLIFIER WITH AUTO-RECOVERY 数据表 2008年 10月 20日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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