TPA2035D1
- Maximize Battery Life and Minimize Heat
- 0.5-µA Shutdown Current
- 3-mA Quiescent Current
- High Efficiency Class-D 88% at 400mW at 8Ω 80% at 100mW at 8Ω
- Short Circuit Auto-recovery
- Gain of 2 V/V (6dB)
- Only One External Component Required
- Internal Matched Input Gain and Feedback Resistors for Excellent PSRR and CMRR
- Optimized PWM Output Stage Eliminates LC Output Filter
- PSRR (-75 dB) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Dedicated Voltage Regulator
- Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
- CMRR (-69 dB)Eliminates Two Input Coupling Capacitors
- Thermal and Short-Circuit Protection
- Pinout Similar to the TPA2010D1
- Wafer Chip Scale Packaging (WCSP)
- NanoFree (YZF)
- APPLICATIONS
- Wireless Handsets, PDAs, and other mobile devices
The TPA2035D1 is a 2.75-W high efficiency filter-free class-D audio power amplifier in an approximately 1.5-mm × 1.5-mm wafer chip scale package (WCSP) that requires only one external component. The pinout is the same as the TPA2010D1 (SLOS417) except that the external gain setting input resistors required by the TPA2010D1 are integrated into the fixed gain of the TPA2035D1.
Features like -75dB PSRR and improved RF-rectification immunity with a small PCB footprint (WCSP amplifier plus single decoupling cap) make the TPA2035D1 ideal for wireless handsets. A fast start-up time of 3.2 ms with minimal pop makes the TPA2035D1 ideal for PDA applications.
In wireless handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2035D1. The TPA2035D1 has a low 27-µV noise floor, A-weighted.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 2.75-W Fixed Gain Mono Filter-Free Class-D Audio Power Amplifier 数据表 | 2008年 8月 4日 | |||
用户指南 | TPA2035D1 Audio Power Amplifier Evaluation Module (Rev. A) | 2009年 12月 12日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TPA2035D1EVM — TPA2035D1EVM Evalution Module
TPA2035D1 音频功率放大器评估模块是一款能提供 2.75W 功率的完整低功耗 D 类立体声音频功率放大器(YZF 封装)。所有组件和评估模块皆无铅。该评估模块包含一个 TPA2035D1,后者位于电路板的主电路上。它还包含一个 TPA2035D1 微型 EVM。
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借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | 下载 |
---|---|---|
DSBGA (YZF) | 9 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点