产品详情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 4 Output power (W) 2.5 SNR (dB) 97 THD + N at 1 kHz (%) 0.18 Iq (typ) (mA) 3.4 Control interface GPIO Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 75 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Load (min) (Ω) 4 Output power (W) 2.5 SNR (dB) 97 THD + N at 1 kHz (%) 0.18 Iq (typ) (mA) 3.4 Control interface GPIO Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 75 Operating temperature range (°C) -40 to 85
DSBGA (YZF) 9 3.0625 mm² 1.75 x 1.75
  • Pin-to-Pin Compatibility with TPA2010D1
  • 32 ms Start-up Time Eliminates CODEC Click/Pop noise
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8-Ω Speaker:
      • 88% at 400 mW
    • 2.8-mA Quiescent Current
    • 0.5-µA Shutdown Current
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • Improved PSRR (-75 dB) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
    • Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • Wafer Chip Scale Packaging (WCSP)
    • NanoFree™ (YZF)
  • APPLICATIONS
    • Ideal for Wireless or Cellular Handsets and PDAs
  • Pin-to-Pin Compatibility with TPA2010D1
  • 32 ms Start-up Time Eliminates CODEC Click/Pop noise
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8-Ω Speaker:
      • 88% at 400 mW
    • 2.8-mA Quiescent Current
    • 0.5-µA Shutdown Current
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • Improved PSRR (-75 dB) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
    • Fully Differential Design Reduces RF Rectification and Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • Wafer Chip Scale Packaging (WCSP)
    • NanoFree™ (YZF)
  • APPLICATIONS
    • Ideal for Wireless or Cellular Handsets and PDAs

The TPA2031D1 is a 2.5-W high efficiency filter-free class-D audio power amplifier in a 1,45 mm × 1,45 mm wafer chip scale package (WCSP) that requires only three external components.

Features like 88% efficiency, -75-dB PSRR, improved RF-rectification immunity, and 8 mm2 total PCB area make the TPA2031D1 class-D amp ideal for cellular handsets. 32 ms start-up time allows the TPA2031D1 to share the same GPIO enable/shutdown control as the CODEC without passing through the CODEC turn-on pop.

In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2031D1. The TPA2031D1 allows independent gain while summing signals from separate sources, and has a low 36 µV noise floor, A-weighted.

The TPA2031D1 is a 2.5-W high efficiency filter-free class-D audio power amplifier in a 1,45 mm × 1,45 mm wafer chip scale package (WCSP) that requires only three external components.

Features like 88% efficiency, -75-dB PSRR, improved RF-rectification immunity, and 8 mm2 total PCB area make the TPA2031D1 class-D amp ideal for cellular handsets. 32 ms start-up time allows the TPA2031D1 to share the same GPIO enable/shutdown control as the CODEC without passing through the CODEC turn-on pop.

In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2031D1. The TPA2031D1 allows independent gain while summing signals from separate sources, and has a low 36 µV noise floor, A-weighted.

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类型 标题 下载最新的英语版本 日期
* 数据表 2.5-W Mono Filter-Free Class-D Audio Power Amplifier 数据表 2008年 5月 28日
用户指南 TPA2031D1EVM User's Guide 2008年 5月 28日

设计和开发

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评估板

TPA2031D1EVM — TPA2031D1 评估模块 (EVM)

TPA2031D1 音频功率放大器评估模块是完整的低功耗单通道音频功率放大器。它由采用超小型 NanoFree? WCSP 封装的 TI TPA2031D1 2.5W 低压 D 类音频功率放大器 IC 和安装在电路板(约 1.25 平方英寸)上的其它少量部件组成。

单列直插式排针引脚安装在模块电路板的内侧。这些引脚允许将 EVM 插入到 TI 即插即用音频放大器评估平台中,或直接连接到现有电路和设备(当单独使用时)。

该平台能容纳一对 TPA2031D1 评估模块,它为演示 TI 的音频功率放大器及相关评估模块提供了方便。只需将 EVM (...)

用户指南: PDF
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订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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