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DSP type 1 C64x DSP (max) (MHz) 594, 729 CPU 32-/64-bit Operating system DSP/BIOS, Linux, VLX Ethernet MAC 10/100/1000 Rating Catalog Operating temperature range (°C) -40 to 105
DSP type 1 C64x DSP (max) (MHz) 594, 729 CPU 32-/64-bit Operating system DSP/BIOS, Linux, VLX Ethernet MAC 10/100/1000 Rating Catalog Operating temperature range (°C) -40 to 105
FCBGA (CUT) 529 361 mm² 19 x 19
  • Get started today with production-ready, easy-to-use audio and video codecs for digital media processors based on DaVinci™ technology. Also available are various O/S Board Support Packages and software updates. All codecs are available for FREE evaluation. REQUEST FREE SOFTWARE!
  • High-Performance Digital Media SoC
    • 594-, 729-MHz C64x+™ Clock Rate
    • 297-, 364.5-MHz ARM926EJ-Strade; Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 4752, 5832 C64x+ MIPS
    • Fully Software-Compatible With C64x/ARM9™
    • Supports SmartReflex™ [-594 only]
      • Class 0
      • 1.05-V and 1.2-V Adaptive Core Voltage
    • Extended Temp Available [-594 only]
    • Industrial Temp Available [-729 only]
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 ×: 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 32K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 128K-Byte L2 Unified Mapped RAM/Cache (Flexible RAM/Cache Allocation)
  • ARM926EJ-S Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 8K-Byte ROM
  • Embedded Trace Buffer™ (ETB11™) With 4KB Memory for ARM9 Debug
  • Endianness: Little Endian for ARM and DSP
  • Dual Programmable High-Definition Video Image Co-Processor (HDVICP) Engines
    • Supports a Range of Encode, Decode, and Transcode Operations
      • H.264, MPEG2, VC1, MPEG4 SP/ASP
  • Video Port Interface (VPIF)
    • Two 8-Bit SD (BT.656), Single 16-Bit HD (BT.1120), or Single Raw (8-/10-/12-Bit) Video Capture Channels
    • Two 8-Bit SD (BT.656) or Single 16-Bit HD (BT.1120) Video Display Channels
  • Video Data Conversion Engine (VDCE)
    • Horizontal and Vertical Downscaling
    • Chroma Conversion (4:2:2↔4:2:0)
  • Two Transport Stream Interface (TSIF) Modules
    (One Parallel/Serial and One Serial Only)
    • TSIF for MPEG Transport Stream
    • Simultaneous Synchronous or Asynchronous Input/Output Streams
    • Absolute Time Stamp Detection
    • PID Filter With 7 PID Filter Tables
    • Corresponding Clock Reference Generator (CRGEN) Modules for System Time-Clock Recovery
  • External Memory Interfaces (EMIFs)
    • 297-.310.5-MHz 32-Bit DDR2 SDRAM Memory Controller With 256M-Byte Address Space (1.8-V I/O)
    • Asynchronous 16-Bit-Wide EMIF (EMIFA) With 128M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
    • Programmable Default Burst Size
  • 10/100/1000 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • Supports MII and GMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
  • USB Port With Integrated 2.0 PHY
    • USB 2.0 High-/Full-Speed Client
    • USB 2.0 High-/Full-/Low-Speed Host (Mini-Host, Supporting One External Device)
  • 32-Bit, 33-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface
    • Conforms to PCI Specification 2.3
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watchdog Timer
  • Three Configurable UART/IrDA/CIR Modules (One With Modem Control Signals)
    • Supports up to 1.8432 Mbps UART
    • SIR and MIR (0.576 MBAUD)
    • CIR With Programmable Data Encoding
  • One Serial Peripheral Interface (SPI) With Two Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Audio Serial Ports (McASPs)
    • One Four-Serializer Transmit/Receive Port
    • One Single DIT Transmit Port for S/PDIF
  • 32-Bit Host Port Interface (HPI)
  • VLYNQ™ Interface (FPGA Interface)
  • Two Pulse Width Modulator (PWM) Outputs
  • ATA/ATAPI I/F (ATA/ATAPI-6 Specification)
  • Up to 33 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • On-Chip ARM ROM Bootloader (RBL)
  • Individual Power-Saving Modes for ARM/DSP
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 529-Pin Pb-Free BGA Package (CUT Suffix), 0.8-mm Ball Pitch
  • 0.09-µm/7-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2/1.05-V Internal

All trademarks are the property of their respective owners.

  • Get started today with production-ready, easy-to-use audio and video codecs for digital media processors based on DaVinci™ technology. Also available are various O/S Board Support Packages and software updates. All codecs are available for FREE evaluation. REQUEST FREE SOFTWARE!
  • High-Performance Digital Media SoC
    • 594-, 729-MHz C64x+™ Clock Rate
    • 297-, 364.5-MHz ARM926EJ-Strade; Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 4752, 5832 C64x+ MIPS
    • Fully Software-Compatible With C64x/ARM9™
    • Supports SmartReflex™ [-594 only]
      • Class 0
      • 1.05-V and 1.2-V Adaptive Core Voltage
    • Extended Temp Available [-594 only]
    • Industrial Temp Available [-729 only]
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 ×: 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 32K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 128K-Byte L2 Unified Mapped RAM/Cache (Flexible RAM/Cache Allocation)
  • ARM926EJ-S Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 8K-Byte ROM
  • Embedded Trace Buffer™ (ETB11™) With 4KB Memory for ARM9 Debug
  • Endianness: Little Endian for ARM and DSP
  • Dual Programmable High-Definition Video Image Co-Processor (HDVICP) Engines
    • Supports a Range of Encode, Decode, and Transcode Operations
      • H.264, MPEG2, VC1, MPEG4 SP/ASP
  • Video Port Interface (VPIF)
    • Two 8-Bit SD (BT.656), Single 16-Bit HD (BT.1120), or Single Raw (8-/10-/12-Bit) Video Capture Channels
    • Two 8-Bit SD (BT.656) or Single 16-Bit HD (BT.1120) Video Display Channels
  • Video Data Conversion Engine (VDCE)
    • Horizontal and Vertical Downscaling
    • Chroma Conversion (4:2:2↔4:2:0)
  • Two Transport Stream Interface (TSIF) Modules
    (One Parallel/Serial and One Serial Only)
    • TSIF for MPEG Transport Stream
    • Simultaneous Synchronous or Asynchronous Input/Output Streams
    • Absolute Time Stamp Detection
    • PID Filter With 7 PID Filter Tables
    • Corresponding Clock Reference Generator (CRGEN) Modules for System Time-Clock Recovery
  • External Memory Interfaces (EMIFs)
    • 297-.310.5-MHz 32-Bit DDR2 SDRAM Memory Controller With 256M-Byte Address Space (1.8-V I/O)
    • Asynchronous 16-Bit-Wide EMIF (EMIFA) With 128M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
    • Programmable Default Burst Size
  • 10/100/1000 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • Supports MII and GMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
  • USB Port With Integrated 2.0 PHY
    • USB 2.0 High-/Full-Speed Client
    • USB 2.0 High-/Full-/Low-Speed Host (Mini-Host, Supporting One External Device)
  • 32-Bit, 33-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface
    • Conforms to PCI Specification 2.3
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watchdog Timer
  • Three Configurable UART/IrDA/CIR Modules (One With Modem Control Signals)
    • Supports up to 1.8432 Mbps UART
    • SIR and MIR (0.576 MBAUD)
    • CIR With Programmable Data Encoding
  • One Serial Peripheral Interface (SPI) With Two Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Audio Serial Ports (McASPs)
    • One Four-Serializer Transmit/Receive Port
    • One Single DIT Transmit Port for S/PDIF
  • 32-Bit Host Port Interface (HPI)
  • VLYNQ™ Interface (FPGA Interface)
  • Two Pulse Width Modulator (PWM) Outputs
  • ATA/ATAPI I/F (ATA/ATAPI-6 Specification)
  • Up to 33 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • On-Chip ARM ROM Bootloader (RBL)
  • Individual Power-Saving Modes for ARM/DSP
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 529-Pin Pb-Free BGA Package (CUT Suffix), 0.8-mm Ball Pitch
  • 0.09-µm/7-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2/1.05-V Internal

All trademarks are the property of their respective owners.

The TMS320DM6467 (also referenced as DM6467) leverages TI's DaVinci™ technology to meet the networked media encode and decode digital media processing needs of next-generation embedded devices.

The DM6467 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the DM6467 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C64x+ DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core incorporates:

  • A coprocessor 15 (CP15) and protection module
  • Data and program Memory Management Units (MMUs) with table look-aside buffers.
  • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT).

The TMS320C64x+™ DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. It is based on an enhanced version of the second-generation high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSP cores an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000™ DSP platform. The TMS320C64x+ DSP is an enhancement of the C64x+ DSP with added functionality and an expanded instruction set.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 5832 million instructions per second (MIPS) at a clock rate of 729 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units-two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2376 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4752 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide(literature number SPRU732).

The DM6467 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6467 core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 640K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 512K-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: a configurable video port; a 10/100/1000 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; a 4-bit transfer/4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus interface; a multichannel audio serial port (McASP0) with 4 serializers; a secondary multichannel audio serial port (McASP1) with a single transmit serializer; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; a configurable 32-bit host port interface (HPI); up to 33-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART/IrDA/CIR interfaces with modem interface signals on UART0; 2 pulse width modulator (PWM) peripherals; an ATA/ATAPI-6 interface; a 33-MHz peripheral component interface (PCI); and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM6467 and the network. The DM6467 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode; and 1000Base-TX (1 Gbps) in full-duplex mode with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the ARM, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the ARM, allowing the ARM to poll the link status of the device without continuously performing costly MDIO accesses.

The PCI, HPI, I2C, SPI, USB2.0, and VLYNQ ports allow the DM6467 to easily control peripheral devices and/or communicate with host processors.

The DM6467 also includes a High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) to offload many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. For more information on the HDVICP enhanced codecs, such as H.264 and MPEG4, please contact your nearest TI sales representative.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6467 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code

The TMS320DM6467 (also referenced as DM6467) leverages TI's DaVinci™ technology to meet the networked media encode and decode digital media processing needs of next-generation embedded devices.

The DM6467 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the DM6467 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C64x+ DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core incorporates:

  • A coprocessor 15 (CP15) and protection module
  • Data and program Memory Management Units (MMUs) with table look-aside buffers.
  • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT).

The TMS320C64x+™ DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. It is based on an enhanced version of the second-generation high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSP cores an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000™ DSP platform. The TMS320C64x+ DSP is an enhancement of the C64x+ DSP with added functionality and an expanded instruction set.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 5832 million instructions per second (MIPS) at a clock rate of 729 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units-two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2376 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4752 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide(literature number SPRU732).

The DM6467 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6467 core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 640K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 512K-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: a configurable video port; a 10/100/1000 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; a 4-bit transfer/4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus interface; a multichannel audio serial port (McASP0) with 4 serializers; a secondary multichannel audio serial port (McASP1) with a single transmit serializer; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; a configurable 32-bit host port interface (HPI); up to 33-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART/IrDA/CIR interfaces with modem interface signals on UART0; 2 pulse width modulator (PWM) peripherals; an ATA/ATAPI-6 interface; a 33-MHz peripheral component interface (PCI); and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM6467 and the network. The DM6467 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode; and 1000Base-TX (1 Gbps) in full-duplex mode with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the ARM, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the ARM, allowing the ARM to poll the link status of the device without continuously performing costly MDIO accesses.

The PCI, HPI, I2C, SPI, USB2.0, and VLYNQ ports allow the DM6467 to easily control peripheral devices and/or communicate with host processors.

The DM6467 also includes a High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) to offload many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. For more information on the HDVICP enhanced codecs, such as H.264 and MPEG4, please contact your nearest TI sales representative.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6467 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code

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类型 标题 下载最新的英语版本 日期
* 数据表 TMS320DM6467 Digital Media System-on-Chip 数据表 (Rev. H) 2012年 7月 11日
* 勘误表 TMS320DM6467 DMSoC Silicon Errata Silicon Revisions 3.0, 1.1, and 1.0 (Rev. G) 2010年 11月 2日
应用手册 高速接口布局指南 (Rev. J) PDF | HTML 英语版 (Rev.J) PDF | HTML 2023年 3月 23日
应用手册 构建小型嵌入式Linux 内核示例 (Rev. A) 英语版 (Rev.A) 2013年 7月 30日
应用手册 Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
用户指南 TMS320DM646x DMSoC Inter-Integrated Circuit (I2C) Module User's Guide (Rev. D) 2011年 3月 25日
用户指南 TMS320DM646x DMSoC DDR2 Memory Controller User's Guide (Rev. E) 2011年 3月 21日
用户指南 TMS320DM646x DMSoC Serial Peripheral Interface (SPI) User's Guide (Rev. B) 2011年 3月 17日
应用手册 Using the TMS320DM646x DMSoC Bootloader (Rev. D) 2011年 3月 4日
用户指南 TMS320DM646x DMSoC Enhanced Direct Memory Access Controller (EDMA) User's Guide (Rev. B) 2011年 1月 14日
用户指南 TMS320DM646x DMSoC 64-Bit Timer User's Guide (Rev. B) 2011年 1月 7日
用户指南 TMS320DM646x DMSoC EMAC/MDIO Module User's Guide (Rev. A) 2010年 12月 23日
用户指南 TMS320DM646x DMSoC Pulse-Width Modulator (PWM) User's Guide (Rev. A) 2010年 8月 6日
用户指南 TMS320DM646x DMSoC ARM Subsystem Reference Guide (Rev. E) 2010年 8月 4日
用户指南 TMS320C64x+ DSP Megamodule Reference Guide (Rev. K) 2010年 8月 3日
用户指南 TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J) 2010年 7月 30日
应用手册 Migrating from TMS320DM6467 to TMS320DM6467T (Rev. B) 2010年 6月 8日
应用手册 Using the Video Port of TMS320DM646x (Rev. A) 2010年 4月 6日
应用手册 USB Compliance Checklist (Rev. A) 2010年 3月 10日
用户指南 TMS320DM646x DMSoC Universal Serial Bus (USB) Controller User's Guide (Rev. E) 2009年 11月 20日
用户指南 TMS320DM646x DMSoC Peripheral Component Interconnect (PCI) User's Guide (Rev. B) 2009年 11月 16日
用户指南 TMS320DM646x DMSoC Peripherals Overview Reference Guide (Rev. B) 2009年 11月 16日
用户指南 TMS320DM646x DMSoC Video Port Interface (VPIF) User's Guide (Rev. D) 2009年 11月 16日
应用手册 TMS320DM6467 Power Consumption Summary (Rev. B) 2009年 10月 24日
应用手册 Running a TMS320C64x+ Codec Across TMS320C64x+ Based DSP Platforms 2009年 9月 24日
用户指南 TMS320DM646x DMSoC Video Data Conversion Engine (VDCE) User's Guide (Rev. A) 2009年 8月 26日
用户指南 TMS320DM646x DMSoC Asynchronous External Memory Interface (EMIF) User's Guide (Rev. C) 2009年 7月 14日
应用手册 LSP 2.10 DaVinci Linux Drivers (Rev. A) 2009年 7月 8日
用户指南 TMS320DM646x DMSoC Universal Asynchronous Receiver/Transmitter (UART) User's Gde (Rev. D) 2009年 6月 21日
应用手册 TMS320DM6467 SoC Architecture and Throughput Overview (Rev. B) 2009年 6月 10日
用户指南 TMS320DM646x DMSoC General-Purpose Input/Output (GPIO) User's Guide (Rev. A) 2009年 3月 13日
用户指南 TMS320C64x+ DSP Cache User's Guide (Rev. B) 2009年 2月 11日
应用手册 Multiple TMS320DM6467 PCI Interface 2009年 2月 10日
应用手册 PCI Express to TMS320DM646x PCI Interface Through XIO2000A Bridge 2009年 2月 3日
用户指南 TMS320DM646x DMSoC ATA Controller User's Guide (Rev. A) 2009年 1月 27日
用户指南 TMS320DM6467 DVEVM v2.0 Getting Started Guide (Rev. D) 2008年 12月 31日
应用手册 Migrating from TMS320DM642 to TMS320DM6467 2008年 11月 17日
应用手册 Migrating from TMS320DM6446 to TMS320DM6467 2008年 11月 17日
用户指南 TMS320DM646x DMSoC Host Port Interface (HPI) User's Guide (Rev. A) 2008年 11月 7日
应用手册 Enabling SmartReflex on the TMS320DM6467 2008年 9月 10日
更多文献资料 End-to-end video infrastructure solutions 2008年 8月 29日
更多文献资料 达芬奇技术概述手册 (Rev. B) 英语版 (Rev.B) 2008年 8月 12日
应用手册 Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A) 2008年 7月 17日
用户指南 TMS320DM646x DMSoC Transport Stream Interface (TSIF) Module User's Guide (Rev. E) 2008年 7月 2日
应用手册 TMS320DM6467 Universal Serial Bus Downstream Host Compliance Testing 2008年 5月 30日
应用手册 HDMI Transmitter/Receiver Support on TMS320DM6467 2008年 5月 5日
用户指南 TMS320DM646x DMSoC Multichannel Audio Serial Port (McASP) User's Guide (Rev. B) 2008年 3月 13日
应用手册 TMS320DM6467 Universal Serial Bus Upstream Device Compliance Testing 2008年 1月 30日
更多文献资料 DaVinci Newsletter 4Q 2007 - DM6467 Issue 2007年 12月 3日
更多文献资料 TMS320DM6467 DaVinci FAQ 2007年 12月 3日
用户指南 TMS320DM646x DMSoC Clock Reference Generator (CRGEN) User's Guide 2007年 12月 3日
用户指南 TMS320DM646x DMSoC DSP Subsystem Reference Guide 2007年 12月 3日
用户指南 TMS320DM646x DMSoC VLYNQ Port User's Guide 2007年 12月 3日
应用手册 Thermal Considerations for the DM64xx, DM64x, and C6000 Devices 2007年 5月 20日
应用手册 Migrating from TMS320C64x to TMS320C64x+ (Rev. A) 2005年 10月 20日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

调试探针

TMDSEMU200-U — XDS200 USB 调试探针

XDS200 是用于调试 TI 嵌入式器件的调试探针(仿真器)。与低成本的 XDS110 和高性能的 XDS560v2 相比,XDS200 在低成本和高性能之间实现了平衡;并在单个仓体中支持广泛的标准(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 Arm® 和 DSP 处理器中均支持内核和系统跟踪。对于引脚上的内核跟踪,则需要使用 XDS560v2 PRO TRACE

XDS200 通过 TI 20 引脚连接器(带有适用于 TI 14 引脚、Arm Cortex® 10 引脚和 Arm 20 (...)

TI.com 上无现货
调试探针

TMDSEMU560V2STM-U — XDS560™ 软件 v2 系统跟踪 USB 调试探针

XDS560v2 是 XDS560™ 系列调试探针中性能非常出色的产品,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。请注意,它不支持串行线调试 (SWD)。

所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 ARM 和 DSP 处理器中均支持内核和系统跟踪。对于引脚上的跟踪,需要 XDS560v2 PRO TRACE

XDS560v2 通过 MIPI HSPT 60 引脚连接器(带有多个用于 TI 14 引脚、TI 20 引脚和 ARM 20 引脚的适配器)连接到目标板,并通过 USB2.0 高速 (480Mbps) (...)

TI.com 上无现货
调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS (...)

TI.com 上无现货
软件开发套件 (SDK)

LINUXDVSDK-DV — Linux 数字视频软件开发套件 (DVSDK) v2x/v3x - 达芬奇数字媒体处理器

2010 年 10 月生效 - Linux DVSDK v4 已发布。对于上面未列出的 DaVinci™ 器件,请在 TI.com 上搜索您的器件型号;此产品页面将提供指向您当前 DVSDK 的链接。

借助 Linux™ 数字视频软件开发套件 (DVSDK),DaVinci 系统集成人员能快速开发可在 DaVinci 系列不同器件间轻松移植的 Linux 多媒体应用。每个 DVSDK 都包含一套预先测试的操作系统、应用框架和具有示例程序的编解码器库,这些示例程序演示了从外设流入和流出音频和视频数据的实时解码和编码过程。对于配备 DSP 内核的 DaVinci 器件,DVSDK (...)

应用软件和框架

TMDMFP — 多媒体框架产品 (MFP) - 编解码器引擎,框架组件和 xDAIS

Multimedia Framework Products (MFP)

A major advantage of programmable DSPs over fixed-function devices is their ability to accelerate multiple multimedia functions in a single device. TI multimedia framework products are designed to enable users to easily share a DSP between algorithms by handling (...)

用户指南: PDF
代码示例或演示

DEMOAPP-DM6467 — 演示 - DM6467 应用示例和演示代码

Free Example Code - TI provides proof-of-concept application code to demonstrate some of the hardware and software capabilities of its devices.

  • Click GET SOFTWARE to access Application Demo and Documentation, based on the DM6467 EVM (evaluation module).
软件编解码器

C64XPLUSCODECS — 编解码器 - 视频和语音 - 基于 C64x+ 的器件(OMAP35x、C645x、C647x、DM646、DM644x 和 DM643x)

TI 编解码器免费提供,附带生产许可且现在可供下载。所有编解码器均经过生产环境测试,可轻松集成到视频和语音应用中。点击“获取软件”按钮(上方),获取经过测试的最新编解码器版本。该页面及每个安装程序中都包含有数据表和发布说明。

其他信息:

软件编解码器

DM6467CODECS 用于 DM6467 的编解码器 - 软件和文档

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)

支持的产品和硬件

支持的产品和硬件

产品
数字信号处理器 (DSP)
TMS320DM6467 数字媒体片上系统 TMS320DM6467T 数字媒体片上系统
下载选项
仿真模型

DM646x ZUT BSDL Model (Rev. A)

SPRM276A.ZIP (12 KB) - BSDL Model
仿真模型

DM646x ZUT IBIS Model (Rev. E)

SPRM277E.ZIP (753 KB) - IBIS Model
计算工具

SPRC815 Download: TMS320DM6467 Pin Mux Utility

The DM6467 uses a great deal of internal pin multiplexing to allow the most functionality in the smallest and lowest cost package. This utility allows the pin multiplexing registers of the device to be calculated with ease, as well as showing what peripherals can be used together. This software (...)
支持的产品和硬件

支持的产品和硬件

产品
数字信号处理器 (DSP)
TMS320DM6467 数字媒体片上系统
设计工具

PROCESSORS-3P-SEARCH — 基于 Arm® 的 MPU、基于 Arm 的 MCU 和 DSP 第三方搜索工具

TI 已与多家公司合作,提供各种使用 TI 处理器的软件、工具和 SOM,从而加快您的量产速度。下载此搜索工具,快速浏览我们的第三方解决方案,并寻找合适的第三方来满足您的需求。此处所列的软件、工具和模块由独立的第三方生产和管理,而非德州仪器 (TI)。

搜索工具按产品类型划分为以下类别:

  • 工具包括 IDE/编译器、调试和跟踪、仿真和建模软件以及闪存编程器。
  • 操作系统包括 TI 处理器支持的操作系统。
  • 应用软件是指应用特定的软件,包括在 TI 处理器上运行的中间件和库。
  • SoM 是模块上系统解决方案
原理图

TMS320DM646x Orcad Symbols

SPRR103.ZIP (10 KB)
封装 引脚 下载
FCBGA (CUT) 529 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频