TLV320DAC3120
- Mono Audio DAC With 95-dB SNR
- Instruction-Programmable Embedded miniDSP
- Supports 8-kHz to 192-kHz Sample Rates
- Mono Class-D BTL Speaker Driver (2.5 W Into 4 ύ or 1.6 W Into 8 ύ)
- Mono Headphone/Lineout Driver
- Two Single-Ended Inputs With Output Mixing and Level Control
- Microphone Bias
- Built-in Digital Audio Processing Blocks With User-Programmable Biquad, FIR
Filters, and DRC - Digital Sine-Wave Generator for Beeps and Clicks (PRB_P25)
- Programmable Digital Audio Processor for Bass Boost/Treble/EQ
With up to Six Biquads for Playback - Pin Control or Register Control for Digital Playback Volume-Control Settings
- Integrated PLL Used for Programmable Digital Audio Processor
- I2S, Left-Justified, Right-Justified, DSP, and TDM Audio Interfaces
- I2C Control With Register Auto-Increment
- Full Power-Down Control
- Power Supplies:
- Analog: 2.7 V–3.6 V
- Digital Core: 1.65 V–1.95 V
- Digital I/O: 1.1 V–3.6 V
- Class-D: 2.7 V–5.5 V (SPKVDD ≥ AVDD)
- 5-mm × 5-mm 32-QFN Package
- APPLICATIONS
- Portable Audio Devices
- eBook
- Portable Navigation Devices
All other trademarks are the property of their respective owners
The TLV320DAC3120 is a low-power, highly integrated, high-performance mono DAC with 24-bit mono playback.
The device integrates several analog features, such as a microphone bias, headphone drivers, and a mono speaker driver capable of driving a 4-Ω load. The TLV320DAC3120 has a fully programmable miniDSP for digital audio processing. The digital audio data format is programmable to work with popular audio standard protocols (I2S, left/right-justified) in master, slave, DSP, and TDM modes. Bass boost, treble, or EQ can be supported by the programmable digital-signal processing block. An on-chip PLL provides the high-speed clock needed by the digital signal-processing block. The volume level can be controlled by either a pin control or by register control. The audio functions are controlled using the I2C serial bus.
The TLV320DAC3120 is available in a 32-pin QFN package.
This data manual is designed using PDF document-viewing features that allow quick access to information. For example, performing a global search on "page 0 / register 27" produces all references to this page and register in a list. This makes is easy to traverse the list and find all information related to a page and register. Note that the search string must be of the indicated format. Also, this document includes document hyperlinks to allow the user to quickly find a document reference. To come back to the original page, click the green left arrow near the PDF page number at the bottom of the file. The hot-key for this function is alt-left arrow on the keyboard. Another way to find information quickly is to use the PDF bookmarks.
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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Low-Power Audio DAC With miniDSP and 2.5-W Mono Class-D Speaker Amplifier 数据表 (Rev. A) | 2012年 5月 1日 | |||
应用手册 | Audio Serial Interface Configurations for Audio Codecs (Rev. A) | 2019年 6月 27日 | ||||
应用手册 | TLV320AIC31xx and TLV320DAC31xx Power Consumption Characterization (Rev. B) | 2014年 9月 3日 | ||||
应用手册 | Coefficient RAM Access Mechanisms.. (Rev. D) | 2012年 1月 25日 | ||||
应用手册 | Audio Serial Interface Configurations for Audio Codecs | 2010年 9月 22日 | ||||
EVM 用户指南 | ACEV-1A EVM User's Guide | 2009年 12月 17日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TLV320DAC3120EVM-U — TLV320DAC3120EVM-U 评估模块
TLV320DAC3120EVM-U (ACEV-1A) 是用于 TLV320DAC3120 音频编解码器的完整评估模块。
此 EVM 受 TI 的 CodecControl 软件支持,该软件是用于 TI 音频编解码器的基于方框图的图形用户界面。
支持通过 TI 的 PurePath Studio 综合开发环境来进行 TLV320DAC3120 软件开发。该套功能强大、易于使用的工具专为简化 miniDSP 平台上的软件开发而设计。图形开发环境包括一系列通用音频功能,它可被拖放至音频信号流并以图形的方式互连。可从图形信号流汇编 DSP 代码。
TLV320DAC3120EVM-U 可连接到 PC (...)
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | 下载 |
---|---|---|
VQFN (RHB) | 32 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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