产品详情

DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
LQFP (PGE) 144 484 mm² 22 x 22
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

下载 观看带字幕的视频 视频

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 2
类型 标题 下载最新的英语版本 日期
* 数据表 SM320VC5416-EP Fixed-Point Digital Signal Processor 数据表 2003年 6月 18日
* VID SM320VC5416-EP VID V6204610 2016年 6月 21日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

调试探针

TMDSEMU200-U — XDS200 USB 调试探针

XDS200 是用于调试 TI 嵌入式器件的调试探针(仿真器)。与低成本的 XDS110 和高性能的 XDS560v2 相比,XDS200 在低成本和高性能之间实现了平衡;并在单个仓体中支持广泛的标准(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 Arm® 和 DSP 处理器中均支持内核和系统跟踪。对于引脚上的内核跟踪,则需要使用 XDS560v2 PRO TRACE

XDS200 通过 TI 20 引脚连接器(带有适用于 TI 14 引脚、Arm Cortex® 10 引脚和 Arm 20 (...)

TI.com 上无现货
调试探针

TMDSEMU560V2STM-U — XDS560™ 软件 v2 系统跟踪 USB 调试探针

XDS560v2 是 XDS560™ 系列调试探针中性能非常出色的产品,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。请注意,它不支持串行线调试 (SWD)。

所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 ARM 和 DSP 处理器中均支持内核和系统跟踪。对于引脚上的跟踪,需要 XDS560v2 PRO TRACE

XDS560v2 通过 MIPI HSPT 60 引脚连接器(带有多个用于 TI 14 引脚、TI 20 引脚和 ARM 20 引脚的适配器)连接到目标板,并通过 USB2.0 高速 (480Mbps) (...)

TI.com 上无现货
调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS (...)

TI.com 上无现货
设计工具

PROCESSORS-3P-SEARCH — 基于 Arm® 的 MPU、基于 Arm 的 MCU 和 DSP 第三方搜索工具

TI 已与多家公司合作,提供各种使用 TI 处理器的软件、工具和 SOM,从而加快您的量产速度。下载此搜索工具,快速浏览我们的第三方解决方案,并寻找合适的第三方来满足您的需求。此处所列的软件、工具和模块由独立的第三方生产和管理,而非德州仪器 (TI)。

搜索工具按产品类型划分为以下类别:

  • 工具包括 IDE/编译器、调试和跟踪、仿真和建模软件以及闪存编程器。
  • 操作系统包括 TI 处理器支持的操作系统。
  • 应用软件是指应用特定的软件,包括在 TI 处理器上运行的中间件和库。
  • SoM 是模块上系统解决方案
封装 引脚 下载
LQFP (PGE) 144 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频