产品详情

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 600 Coprocessors C64x DSP CPU 32-bit Display type 2 LCD, Parallel Digital Output, Support for Remote Frame Buffer, Up to 24-Bit RGB Compatible Operating system Linux, RTOS Security Secure boot Rating Catalog Power supply solution TPS65921, TPS65950 Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 600 Coprocessors C64x DSP CPU 32-bit Display type 2 LCD, Parallel Digital Output, Support for Remote Frame Buffer, Up to 24-Bit RGB Compatible Operating system Linux, RTOS Security Secure boot Rating Catalog Power supply solution TPS65921, TPS65950 Operating temperature range (°C) -40 to 105
FCCSP (CBB) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • OMAP3530 and OMAP3525 Devices:
    • OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 720-MHz ARM® Cortex™-A8 Core
      • NEON™ SIMD Coprocessor
    • High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 520-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only)
      • Tile-Based Architecture Delivering up to 10 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Programmable High-Quality Image Anti-Aliasing
    • Fully Software-Compatible with C64x and ARM9™
    • Commercial and Extended Temperature Grades
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture with Nonaligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ L1 and L2 Memory Architecture
    • 32KB of L1P Program RAM and Cache (Direct Mapped)
    • 80KB of L1D Data RAM and Cache (2-Way Set-Associative)
    • 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative)
    • 32KB of L2 Shared SRAM and 16KB of L2 ROM
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • TrustZone®
      • Thumb®-2
      • MMU Enhancements
    • In-Order, Dual-Issue, Superscalar Microprocessor Core
    • NEON Multimedia Architecture
    • Over 2x Performance of ARMv6 SIMD
    • Supports Both Integer and Floating-Point SIMD
    • Jazelle® RCT Execution Environment Architecture
    • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
    • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARM Cortex-A8 Memory Architecture:
    • 16-KB Instruction Cache (4-Way Set-Associative)
    • 16-KB Data Cache (4-Way Set-Associative)
    • 256-KB L2 Cache
  • 112KB of ROM
  • 64KB of Shared SRAM
  • Endianess:
    • ARM Instructions – Little Endian
    • ARM Data – Configurable
    • DSP Instruction and Data - Little Endian
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16- and 32-Bit Memory Controller with 1GB of Total Address Space
      • Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address and Data Bus
      • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
  • Camera Image Signal Processor (ISP)
    • CCD and CMOS Imager Interface
    • Memory Data Input
    • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
    • Glueless Interface to Common Video Decoders
    • Resize Engine
      • Resize Images From 1/4x to 4x
      • Separate Horizontal and Vertical Control
  • Display Subsystem
    • Parallel Digital Output
      • Up to 24-Bit RGB
      • HD Maximum Resolution
      • Supports Up to 2 LCD Panels
      • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
    • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
      • Composite NTSC and PAL Video
      • Luma and Chroma Separate Video (S-Video)
    • Rotation 90-, 180-, and 270-Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Serial Communication
    • 5 Multichannel Buffered Serial Ports (McBSPs)
      • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
      • 5-KB Transmit and Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
      • Direct Interface to I2S and PCM Device and TDM Buses
      • 128-Channel Transmit and Receive Mode
    • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
    • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
    • High-, Full-, and Low-Speed Multiport USB Host Subsystem
      • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
      • Supports Transceiverless Link Logic (TLL)
    • One HDQ™/1-Wire® Interface
    • Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces:
    • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management
    • SmartReflex™ Technology
    • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces
    • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
    • ETM Interface
    • Serial Data Transport Interface (SDTI)
  • 12 32-Bit General-Purpose Timers
  • 2 32-Bit Watchdog Timers
  • 1 32-Bit 32-kHz Sync Timer
  • Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • 65-nm CMOS Technologies
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface (Not Available in CBC Package)
  • Packages:
    • 515-pin s-PBGA Package (CBB Suffix),
      .5-mm Ball Pitch (Top), .4-mm Ball Pitch (Bottom)
    • 515-pin s-PBGA Package (CBC Suffix),
      .65-mm Ball Pitch (Top), .5-mm Ball Pitch (Bottom)
    • 423-pin s-PBGA Package (CUS Suffix),
      .65-mm Ball Pitch
  • 1.8-V I/O and 3.0-V (MMC1 Only),
    0.985-V to 1.35-V Adaptive Processor Core Voltage
    0.985-V to 1.35-V Adaptive Core Logic Voltage
    Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.
  • OMAP3530 and OMAP3525 Devices:
    • OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 720-MHz ARM® Cortex™-A8 Core
      • NEON™ SIMD Coprocessor
    • High-Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 520-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • PowerVR® SGX™ Graphics Accelerator (OMAP3530 Device Only)
      • Tile-Based Architecture Delivering up to 10 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Programmable High-Quality Image Anti-Aliasing
    • Fully Software-Compatible with C64x and ARM9™
    • Commercial and Extended Temperature Grades
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32- and 40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture with Nonaligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ L1 and L2 Memory Architecture
    • 32KB of L1P Program RAM and Cache (Direct Mapped)
    • 80KB of L1D Data RAM and Cache (2-Way Set-Associative)
    • 64KB of L2 Unified Mapped RAM and Cache (4-Way Set-Associative)
    • 32KB of L2 Shared SRAM and 16KB of L2 ROM
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • TrustZone®
      • Thumb®-2
      • MMU Enhancements
    • In-Order, Dual-Issue, Superscalar Microprocessor Core
    • NEON Multimedia Architecture
    • Over 2x Performance of ARMv6 SIMD
    • Supports Both Integer and Floating-Point SIMD
    • Jazelle® RCT Execution Environment Architecture
    • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
    • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARM Cortex-A8 Memory Architecture:
    • 16-KB Instruction Cache (4-Way Set-Associative)
    • 16-KB Data Cache (4-Way Set-Associative)
    • 256-KB L2 Cache
  • 112KB of ROM
  • 64KB of Shared SRAM
  • Endianess:
    • ARM Instructions – Little Endian
    • ARM Data – Configurable
    • DSP Instruction and Data - Little Endian
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16- and 32-Bit Memory Controller with 1GB of Total Address Space
      • Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address and Data Bus
      • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
  • Camera Image Signal Processor (ISP)
    • CCD and CMOS Imager Interface
    • Memory Data Input
    • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
    • Glueless Interface to Common Video Decoders
    • Resize Engine
      • Resize Images From 1/4x to 4x
      • Separate Horizontal and Vertical Control
  • Display Subsystem
    • Parallel Digital Output
      • Up to 24-Bit RGB
      • HD Maximum Resolution
      • Supports Up to 2 LCD Panels
      • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
    • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
      • Composite NTSC and PAL Video
      • Luma and Chroma Separate Video (S-Video)
    • Rotation 90-, 180-, and 270-Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Serial Communication
    • 5 Multichannel Buffered Serial Ports (McBSPs)
      • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
      • 5-KB Transmit and Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
      • Direct Interface to I2S and PCM Device and TDM Buses
      • 128-Channel Transmit and Receive Mode
    • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
    • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
    • High-, Full-, and Low-Speed Multiport USB Host Subsystem
      • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
      • Supports Transceiverless Link Logic (TLL)
    • One HDQ™/1-Wire® Interface
    • Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces:
    • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management
    • SmartReflex™ Technology
    • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces
    • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
    • ETM Interface
    • Serial Data Transport Interface (SDTI)
  • 12 32-Bit General-Purpose Timers
  • 2 32-Bit Watchdog Timers
  • 1 32-Bit 32-kHz Sync Timer
  • Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • 65-nm CMOS Technologies
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface (Not Available in CBC Package)
  • Packages:
    • 515-pin s-PBGA Package (CBB Suffix),
      .5-mm Ball Pitch (Top), .4-mm Ball Pitch (Bottom)
    • 515-pin s-PBGA Package (CBC Suffix),
      .65-mm Ball Pitch (Top), .5-mm Ball Pitch (Bottom)
    • 423-pin s-PBGA Package (CUS Suffix),
      .65-mm Ball Pitch
  • 1.8-V I/O and 3.0-V (MMC1 Only),
    0.985-V to 1.35-V Adaptive Processor Core Voltage
    0.985-V to 1.35-V Adaptive Core Logic Voltage
    Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

  • Linux®
  • Windows® CE
  • Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
  • IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
  • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3530 device only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
  • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP3530 and OMAP3525 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless otherwise indicated. This data manual consists of the following sections:

  • Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
  • Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
  • Section 4: Clock Specifications input and output clocks, DPLL and DLL
  • Section 5: Video Dac Specifications
  • Section 6: Timing Requirements and Switching Characteristics
  • Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging

OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

  • Linux®
  • Windows® CE
  • Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
  • IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
  • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3530 device only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
  • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP3530 and OMAP3525 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless otherwise indicated. This data manual consists of the following sections:

  • Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
  • Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
  • Section 4: Clock Specifications input and output clocks, DPLL and DLL
  • Section 5: Video Dac Specifications
  • Section 6: Timing Requirements and Switching Characteristics
  • Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging

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类型 标题 下载最新的英语版本 日期
* 数据表 OMAP3530 and OMAP3525 Applications Processors 数据表 (Rev. H) 2013年 10月 10日
* 勘误表 OMAP3530/25/15/03 Applications Processor Silicon Errata (Rev. F) 2010年 10月 12日
用户指南 SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 2020年 6月 1日
应用手册 (Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C) PDF | HTML 2020年 3月 3日
应用手册 OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019年 3月 20日
应用手册 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013年 11月 1日
用户指南 Delta for OMAP35x Technical Reference Manual Version X to Version Y (Rev. Y) 2012年 12月 10日
用户指南 OMAP35x Technical Reference Manual (Rev. Y) 2012年 12月 10日
应用手册 Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
应用手册 使用 TPS65023 为 OMAP™3 供电:设计指南 (Rev. B) 2010年 10月 8日
应用手册 PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010年 6月 23日
应用手册 PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010年 6月 23日
应用手册 Migrating from OMAP3530 to AM37x 2010年 6月 3日
应用手册 Migrating from OMAP3530 to AM35x 2010年 5月 24日
用户指南 OMAP35x Peripherals Overview Reference Guide (Rev. A) 2010年 1月 20日
应用手册 OMAP35x Linux PSP Data Sheet 2009年 10月 16日
设计指南 Powering OMAP35x with TPS65073x 2009年 10月 13日
应用手册 OMAP35x 0.65mm Pitch Layout Methods (Rev. B) 2008年 6月 26日

设计和开发

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调试探针

TMDSEMU200-U — XDS200 USB 调试探针

XDS200 是用于调试 TI 嵌入式器件的调试探针(仿真器)。与低成本的 XDS110 和高性能的 XDS560v2 相比,XDS200 在低成本和高性能之间实现了平衡;并在单个仓体中支持广泛的标准(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 Arm® 和 DSP 处理器中均支持内核和系统跟踪。对于引脚上的内核跟踪,则需要使用 XDS560v2 PRO TRACE

XDS200 通过 TI 20 引脚连接器(带有适用于 TI 14 引脚、Arm Cortex® 10 引脚和 Arm 20 (...)

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调试探针

TMDSEMU560V2STM-U — XDS560™ 软件 v2 系统跟踪 USB 调试探针

XDS560v2 是 XDS560™ 系列调试探针中性能非常出色的产品,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。请注意,它不支持串行线调试 (SWD)。

所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 ARM 和 DSP 处理器中均支持内核和系统跟踪。对于引脚上的跟踪,需要 XDS560v2 PRO TRACE

XDS560v2 通过 MIPI HSPT 60 引脚连接器(带有多个用于 TI 14 引脚、TI 20 引脚和 ARM 20 引脚的适配器)连接到目标板,并通过 USB2.0 高速 (480Mbps) (...)

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调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS (...)

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软件开发套件 (SDK)

ANDROIDSDK-SITARA — 用于 Sitara 微处理器的 Android 开发套件

虽然起初专为移动手持终端而设计,Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。 与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。


Android 操作系统的亮点在于:

  • 完整的开放源码软件解决方案
  • 基于 Linux
  • 针对商业开发的简洁许可条款 (Apache)
  • 包含一个完整的应用框架
  • 允许通过 Java 轻松集成定制开发应用
  • 开包即用的多媒体、图形和图形用户界面
  • 大量 Android 和应用开发人员供随时调遣

 

软件开发套件 (SDK)

LINUXDVSDK-OMAP3530 — 用于 OMAP3530/3525 数字媒体处理器的 Linux 数字视频软件开发套件 (DVSDK)

The Linux Digital Video Software Development Kit (DVSDK) enables OMAP35x system integrators to quickly develop Linux-based multimedia applications that can be easily ported across different devices in the OMAP35x generation, including OMAP3530 and OMAP3525 application processors. The DVSDK combines (...)
软件编解码器

C64XPLUSCODECS — 编解码器 - 视频和语音 - 基于 C64x+ 的器件(OMAP35x、C645x、C647x、DM646、DM644x 和 DM643x)

TI 编解码器免费提供,附带生产许可且现在可供下载。所有编解码器均经过生产环境测试,可轻松集成到视频和语音应用中。点击“获取软件”按钮(上方),获取经过测试的最新编解码器版本。该页面及每个安装程序中都包含有数据表和发布说明。

其他信息:

软件编解码器

OMAP35XCODECS 用于 OMAP35x 的编解码器 - 软件和文档

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)

支持的产品和硬件

支持的产品和硬件

产品
基于 Arm 的处理器
OMAP3503 Sitara 处理器:Arm Cortex-A8、LPDDR OMAP3515 Sitara 处理器:Arm Cortex-A8、3D 图形、LPDDR OMAP3525 应用处理器 OMAP3530 应用处理器
下载选项
软件编程工具

FLASHTOOL 用于 AM35x、AM37x、DM37x 和 OMAP35x 器件的 FlashTool

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

支持的产品和硬件

支持的产品和硬件

产品
基于 Arm 的处理器
AM3505 Sitara 处理器: Arm Cortex-A8、视频前端 AM3517 Sitara 处理器:Arm Cortex-A8、3D 图形、视频前端 AM3703 Sitara 处理器:Arm Cortex-A8、摄像机 AM3715 Sitara 处理器: Arm Cortex-A8、3D 图形、摄像机 DM3725 数字媒体处理器 DM3730 数字媒体处理器 OMAP3503 Sitara 处理器:Arm Cortex-A8、LPDDR OMAP3515 Sitara 处理器:Arm Cortex-A8、3D 图形、LPDDR OMAP3525 应用处理器 OMAP3530 应用处理器
下载选项
仿真模型

OMAP3530/25 CBB BSDL Model (Rev. C)

SPRM315C.ZIP (11 KB) - BSDL Model
仿真模型

OMAP3530/25 CBB IBIS Model (Rev. A)

SPRM322A.ZIP (1575 KB) - IBIS Model
仿真模型

OMAP3530/25 CBC BSDL Model (Rev. A)

SPRM346A.ZIP (10 KB) - BSDL Model
仿真模型

OMAP3530/25 CBC IBIS Model (Rev. A)

SPRM323A.ZIP (1559 KB) - IBIS Model
仿真模型

OMAP3530/25 CUS BSDL Model (Rev. B)

SPRM314B.ZIP (10 KB) - BSDL Model
仿真模型

OMAP3530/25 CUS IBIS Model (Rev. B)

SPRM324B.ZIP (1537 KB) - IBIS Model
计算工具

POWEREST — 功耗估算工具 (PET)

Power Estimation Tool (PET) provides users the ability to gain insight in to the power consumption of select TI processors. The tool includes the ability for the user to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be (...)
封装 引脚 CAD 符号、封装和 3D 模型
FCCSP (CBB) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频