产品详情

Number of channels 8 Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Function and Pinout Compatible With FCT and F Logic
  • Reduced VOH(Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • 3-State Outputs
  • CY54FCT573T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT573T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current

  • Function and Pinout Compatible With FCT and F Logic
  • Reduced VOH(Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • 3-State Outputs
  • CY54FCT573T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT573T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current

The \x92FCT573T devices consist of eight latches with 3-state outputs for bus-organized applications. When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE\) input is low. When OE\ is high, the bus output is in the high-impedance state. In this mode, data can be entered into the latches. The \x92FCT573T devices are identical to the \x92FCT373T devices, except for the flow-through pinout of the \x92FCT573T, which simplifies board design.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT573T devices consist of eight latches with 3-state outputs for bus-organized applications. When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE\) input is low. When OE\ is high, the bus output is in the high-impedance state. In this mode, data can be entered into the latches. The \x92FCT573T devices are identical to the \x92FCT373T devices, except for the flow-through pinout of the \x92FCT573T, which simplifies board design.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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类型 标题 下载最新的英语版本 日期
* 数据表 8-Bit Latches With 3-State Outputs 数据表 2001年 10月 1日
* SMD CY54FCT573T SMD 5962-92238 2016年 6月 21日
应用手册 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 下载最新的英文版本 (Rev.AB) 2014年 11月 17日
选择指南 《高级总线接口逻辑器件选择指南》 下载英文版本 2010年 7月 7日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 选择正确的电平转换解决方案 (Rev. A) 下载英文版本 (Rev.A) 2006年 3月 23日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 CYFCT Parameter Measurement Information 2001年 4月 2日

设计和开发

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封装 引脚 下载
CDIP (J) 20 查看选项
LCCC (FK) 20 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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