功能与比较器件相似
UCC2540
- On-Chip Predictive Gate Drive™ for High-Efficiency Synchronous Buck Operation
- Dual ±3-A TrueDrive™ Outputs
- 1-MHz High Frequency Operation with 70-ns Delay from SYNCIN to G1 Output
- Leading Edge Modulation
- Overcurrent Protection using a Parallel Average Current Mode Control Loop
- 3 Modes to Support 2.7-V to 35-V Bias Operation
- Reverse Current Protection for Output Stage
- User Programmable Shutdown
- ±1.0% Initial Tolerance Bandgap Reference
- High Bandwidth Error Amplifiers
- Thermally Enhanced HTSSOP 20-Pin PowerPAD™ Package
- APPLICATIONS
- Secondary-Side Post Regulation (SSPR) for Multiple Output Power Supplies
- Cascaded Buck Converters
- Post Processing Converters for Bus Converter and DC Transformer Architectures
Predictive Gate Drive, TrueDrive, and PowerPAD are a trademarks of Texas Instruments Incorporated.
The UCC2540 is a secondary-side synchronous buck PWM controller for high current and low output voltage applications. It can be used either as the local secondary-side controller for isolated dc-dc converters using two-stage cascaded topologies or as a secondary-side post regulator (SSPR) for multiple output power supplies.
The UCC2540 runs with the synchronization signal from either the primary side or the high duty cycle quasi-dc output of bus converters or dc transformers. For higher efficiency, it also incorporates the Predictive Gate Drive technology that virtually eliminates body diode conduction losses in synchronous rectifiers.
The UCC2540 is available in the extended temperature range of 40°C to 105°C and is offered in thermally enhanced PowerPAD 20-pin HTSSOP (PWP) package. This space saving package with standard 20-pin TSSOP footprint has a drastically lower thermal resistance of 1.4°C/W øJC to accommodate the dual high-current drivers on board.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | High-Efficiency Secondary Side Synchronous PWM Controller 数据表 (Rev. C) | 2008年 10月 10日 | |||
用户指南 | UCC2540 SECONDARY SIDE POST REGULATOR EVALUATION MODULE WITH THE UCC38083 | 2004年 6月 10日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | 下载 |
---|---|---|
HTSSOP (PWP) | 20 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点